JPS63298809A - Magnetic head device - Google Patents
Magnetic head deviceInfo
- Publication number
- JPS63298809A JPS63298809A JP13367387A JP13367387A JPS63298809A JP S63298809 A JPS63298809 A JP S63298809A JP 13367387 A JP13367387 A JP 13367387A JP 13367387 A JP13367387 A JP 13367387A JP S63298809 A JPS63298809 A JP S63298809A
- Authority
- JP
- Japan
- Prior art keywords
- thin film
- recording
- integrated circuit
- film head
- slider block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000010409 thin film Substances 0.000 claims abstract description 29
- 239000004020 conductor Substances 0.000 claims description 3
- 238000000206 photolithography Methods 0.000 abstract description 3
- 230000000694 effects Effects 0.000 abstract description 2
- 239000011521 glass Substances 0.000 abstract description 2
- 238000009413 insulation Methods 0.000 abstract 1
- 238000000034 method Methods 0.000 abstract 1
- 239000000758 substrate Substances 0.000 description 4
- 239000010408 film Substances 0.000 description 3
- 229910001297 Zn alloy Inorganic materials 0.000 description 2
- 229910000859 α-Fe Inorganic materials 0.000 description 2
- XUIMIQQOPSSXEZ-UHFFFAOYSA-N Silicon Chemical compound [Si] XUIMIQQOPSSXEZ-UHFFFAOYSA-N 0.000 description 1
- 230000004888 barrier function Effects 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 1
- 239000010931 gold Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- WJZHMLNIAZSFDO-UHFFFAOYSA-N manganese zinc Chemical compound [Mn].[Zn] WJZHMLNIAZSFDO-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- QELJHCBNGDEXLD-UHFFFAOYSA-N nickel zinc Chemical compound [Ni].[Zn] QELJHCBNGDEXLD-UHFFFAOYSA-N 0.000 description 1
- 238000002161 passivation Methods 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000004904 shortening Methods 0.000 description 1
- 230000008054 signal transmission Effects 0.000 description 1
- 229910052710 silicon Inorganic materials 0.000 description 1
- 239000010703 silicon Substances 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
- G11B5/3106—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing where the integrated or assembled structure comprises means for conditioning against physical detrimental influence, e.g. wear, contamination
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
【発明の詳細な説明】
（発明の目的〕
（産業上の利用分野）
本発明は磁気ヘッド装置に関するもので、特に磁気ディ
スク装置に用いられるものである。DETAILED DESCRIPTION OF THE INVENTION (Objective of the Invention) (Industrial Application Field) The present invention relates to a magnetic head device, and is particularly used in a magnetic disk device.
（従来の技術）
磁気ディスク装置では、フェライト等からなる磁気ヘッ
ドと浮動スライダとを一体化したモノシリツク型磁気ヘ
ッド装置が主流である。しかし、近年薄膜ヘッドとスラ
イダブロックから成る磁気′ ヘッド装置が開発されて
きている。(Prior Art) The mainstream of magnetic disk devices is a monolithic magnetic head device in which a magnetic head made of ferrite or the like and a floating slider are integrated. However, in recent years, magnetic head devices consisting of a thin film head and a slider block have been developed.
薄膜ヘッドはコイルをフォトリングラフィ法を利用して
パターニングにより形成する磁気ヘッドであって、磁気
ディスク装置の小型化および高密度記録化に好適なヘッ
ドである。A thin film head is a magnetic head in which a coil is formed by patterning using photolithography, and is a head suitable for downsizing and high-density recording of magnetic disk devices.
第３図は薄膜ヘッドを用いた従来の磁気ヘッド装置の構
成を示す側面図である。コイル１０とギャップを形成す
るポール１１からなる薄膜ヘッドおよび浮動スライダを
なすフェライト、マンガン−亜鉛合金、ニッケルー亜鉛
合金等からなるスライダブロック１２とから構成されて
いる。FIG. 3 is a side view showing the configuration of a conventional magnetic head device using a thin film head. It consists of a coil 10 and a thin film head made up of a pole 11 forming a gap, and a slider block 12 made of ferrite, manganese-zinc alloy, nickel-zinc alloy, etc., forming a floating slider.
スライダブロック１２は通常はへラドアーム（図示せず
）に取付けられており、コイル１０のリード線がスライ
ダブロック１２上に設けられたり一ドパッド部１３を介
して後述するようにフレキシブル基板（図示せず）上等
に実装した記録再生回路１４に接続されている。The slider block 12 is normally attached to a helad arm (not shown), and the lead wire of the coil 10 is provided on the slider block 12 or connected to a flexible substrate (not shown) via a pad portion 13 as described later. ) is connected to the recording/reproducing circuit 14 mounted on the top.
薄膜ヘッドは、記録再生回路１４ヘデイスクから読出し
たリード（読み出し）信号を出力したり、記録再生回路
１４からのライト（書き込み）信号に応じてデータをデ
ィスクに書き込む動作を行う。The thin film head outputs a read signal read from the disk to the recording/reproducing circuit 14, and performs an operation of writing data onto the disk in response to a write signal from the recording/reproducing circuit 14.
ところで従来の磁気ヘッド装置は、記録再生回路１４が
薄膜ヘッドとは離れた個所例えばキャリッジ上あるいは
へラドアーム上等に配置されており、例えばフレキシブ
ルプリント基板等の配線によって薄膜ヘッドに接続され
るような構造となっている。By the way, in the conventional magnetic head device, the recording/reproducing circuit 14 is arranged in a place separate from the thin film head, for example, on a carriage or on a helad arm, and is connected to the thin film head by wiring such as a flexible printed circuit board. It has a structure.
（発明が解決しようとする問題点）
このように従来の薄膜ヘッドを使用する磁気ヘッド装置
では、薄膜ヘッドと記録再生回路間が離れているため接
続用配線が数σと長く、一方では薄膜ヘッドの出力が０
．１ｍＶ程度と低いために外部ノイズの影響を受けやす
くなるという問題がある。そしてこれに伴い、リード信
号等にエラーが発生する等、磁気ディスク装置の性能が
低下するという問題がある。(Problems to be Solved by the Invention) In this way, in a magnetic head device using a conventional thin-film head, the thin-film head and the recording/reproducing circuit are separated, so the connection wiring is several sigma long. output is 0
．． Since the voltage is as low as about 1 mV, there is a problem in that it is easily influenced by external noise. As a result, there is a problem in that the performance of the magnetic disk device deteriorates, such as errors occurring in read signals and the like.
本発明は、このような問題を解消するためになされたも
ので、薄膜ヘッドと記録再生回路間の接続用配線を短縮
してノイズの影響を低減し、磁気ディスク装置のリード
／ライト動作を確実に行うことのできる磁気ディスク装
置の磁気ヘッド装置を提供することを目的とする。The present invention has been made to solve these problems, and reduces the influence of noise by shortening the connection wiring between the thin film head and the recording/reproducing circuit, thereby ensuring read/write operations of the magnetic disk device. An object of the present invention is to provide a magnetic head device for a magnetic disk device that can perform the following steps.
（問題点を解決するための手段）
本発明にかかる磁気ヘッド装置は、磁気媒体上の記録情
報の書き込み／読み出しを行う薄膜ヘッドと、この薄膜
ヘッドとの間で書き込み／読み出し信号の授受を行う記
録再生回路を含む集積回路チップとが互いに近接してス
ライダブロック上に配置され、集積回路チップの端子が
前記スライダブロック上に形成された配線導体に直接接
合されたことを特徴としている。(Means for Solving the Problems) A magnetic head device according to the present invention includes a thin film head that writes/reads recorded information on a magnetic medium, and exchanges write/read signals between the thin film head and the thin film head. An integrated circuit chip including a recording/reproducing circuit is placed close to each other on a slider block, and the terminals of the integrated circuit chip are directly connected to wiring conductors formed on the slider block.
（作 用）
本発明によれば、記録再生回路が薄膜ヘッドに近接して
スライダブロック上に直接取付けられてているため、接
続用配線が短くなりノイズの影響が低減される。(Function) According to the present invention, since the recording/reproducing circuit is mounted directly on the slider block in the vicinity of the thin film head, the connection wiring is shortened and the influence of noise is reduced.
（実施例） 以Ｆ本発明の一実施例を図面に基づいて説明する。(Example) Hereinafter, one embodiment of the present invention will be described based on the drawings.
第１図は本発明の一実施例を示す磁気ヘッド装置の側面
図である。FIG. 1 is a side view of a magnetic head device showing one embodiment of the present invention.
コイル１０とポール１１とから構成される薄膜ヘッドと
、これがその上に形成されるスライダブロック１２の構
造は第３図に示す従来の装置と同様である。しかし本発
明の場合、記録再生回路が集積回路チップ２０として形
成され、これがスライダブロック１２上に薄膜ヘッドに
近接して取付けられている点が従来の装置と大きく異な
る。スライダブロック１２上にはガラス等の絶縁層を介
して電源、接地、ライト信号及びリード信号等を入出力
するためのリードパッド２１およびこれから引出された
リード２２が形成されている。コイル１０からもリード
２２が引出されている。これらのリードパッド２１およ
びリード２２はコイル１０と同時にフォトリソクラソイ
法により形成されたものである。また、この実施例の場
合集積回路チップ２０とリード２２の先端部との直接接
合はバンブ実装を用いて行われる。そして全体には保護
のためのオーバコート層（図示せず）が形成される。The structure of the thin film head composed of a coil 10 and a pole 11, and the slider block 12 on which this head is formed is similar to the conventional device shown in FIG. However, in the case of the present invention, the recording/reproducing circuit is formed as an integrated circuit chip 20, which is mounted on the slider block 12 in close proximity to the thin film head, which is a major difference from the conventional apparatus. A lead pad 21 and leads 22 drawn out from the lead pad 21 are formed on the slider block 12 through an insulating layer such as glass for inputting and outputting power, grounding, write signals, read signals, and the like. A lead 22 is also drawn out from the coil 10. These lead pads 21 and leads 22 are formed simultaneously with the coil 10 by photolithography. Further, in this embodiment, the integrated circuit chip 20 and the tips of the leads 22 are directly bonded using bump mounting. An overcoat layer (not shown) for protection is formed over the entire structure.
第２図はバンブ実装を用いて集積回路チップを取付けた
場合の集積回路チップのパッド（バンブ）部を示す断面
図である。集積回路チップを形成するシリコン基板３３
の表面に酸化膜等の絶縁被膜３４が形成され、その表面
にパッド３６が設けられる。FIG. 2 is a sectional view showing a pad (bump) portion of an integrated circuit chip when the integrated circuit chip is mounted using bump mounting. Silicon substrate 33 forming an integrated circuit chip
An insulating film 34 such as an oxide film is formed on the surface, and a pad 36 is provided on the surface.
さらにその表面をパッシベーション膜３２で被覆し、バ
ンブ形成部分に開孔を設け、バリアメタル３５を介して
金、はんだ等のバンブ電極３１を形成している。そして
このバンブ電極３１をり一ド２２の先端部と接続するこ
とにより集積回路チップ２０がスライダブロック１２上
に実装される。Furthermore, the surface is covered with a passivation film 32, an opening is provided in the bump forming portion, and a bump electrode 31 made of gold, solder, etc. is formed via a barrier metal 35. The integrated circuit chip 20 is mounted on the slider block 12 by connecting the bump electrode 31 to the tip of the slider 22 .
なお、集積回路チップの直接取付けに際してはバンブ実
装を用いるのが一般的であるが、このような実装技術と
してはＴ Ａ Ｂ （Ｔａｐｅ Ａｕｔｏａ＋ａｔｅｄ
Ｂｏｎｄｉｎｇ ）やＣＯＧ （ｃｈｌｐ ｏｎ Ｇｒ
ａｓｏ ）やフリップチップ等が知られており、広く用
いられている。Incidentally, when directly attaching integrated circuit chips, bump mounting is generally used, but such mounting technology is T A B (Tape Auto+ated).
Bonding) and COG (chlp on Gr.
aso) and flip chips are known and widely used.
このようにしてスライダブロック１２上に薄膜ヘッドに
近接して集積回路チップ状の記録再生回路２０を取付け
ることにより、記録再生回路２０と薄膜ヘッドとの間の
接続配線を従来と比べて著しく短い１１ＩＩ１１程度ま
で短縮することができる。By mounting the recording/reproducing circuit 20 in the form of an integrated circuit chip on the slider block 12 in the vicinity of the thin film head in this way, the connection wiring between the recording/reproducing circuit 20 and the thin film head can be made significantly shorter than in the past. It can be shortened to a certain extent.
このため記録再生回路２０からライト信号を薄膜ヘッド
へ出力したり、また薄膜ヘッドからリード信号を記録再
生回路２０へ記録する際に、外部からのノイズの影響を
大幅に低減することが可能となる。Therefore, when outputting a write signal from the recording/reproducing circuit 20 to the thin film head or recording a read signal from the thin film head to the recording/reproducing circuit 20, it is possible to significantly reduce the influence of external noise. .
したがってノイズにより薄膜ヘッドからのリード信号に
エラーが発生する等の事態を防止することができる。Therefore, it is possible to prevent a situation where an error occurs in the read signal from the thin film head due to noise.
またワイヤボンディングによる接続と比較し、バンブに
よる接続は小スペースに実装でき、小型スライダにも適
している。またフレキシブル基板等に実装する記録再生
回路を設けるためのスペースを削減できるため、磁気デ
ィスク装置の小型化にも適している。Furthermore, compared to connections using wire bonding, connections using bumps can be implemented in a smaller space and are also suitable for small sliders. Furthermore, since the space for providing a recording/reproducing circuit mounted on a flexible substrate or the like can be reduced, it is suitable for downsizing magnetic disk devices.
なお、本発明における磁気ヘッド装置はフロッピーディ
スク装置（ＦＤＤ）や磁気テープ装置（ＭＴ）等におい
てもそのまま適用することができる。Note that the magnetic head device according to the present invention can be applied as is to a floppy disk device (FDD), a magnetic tape device (MT), and the like.
以上詳述したように本発明によれば、薄膜ヘッドの近傍
で同一のスライダブロック上に集積回路チップ状の記録
再生回路を設けているので薄膜ヘッドと記録再生回路と
の接続配線を従来より大幅に短縮することができ、薄膜
ヘッドと記録再生回路との間における信号伝送に対する
ノイズの影響を大幅に低減することができる。このため
結果的にデータのリード／ライト動作を確実に行うこと
ができ、磁気ディスク装置の特性を向上させることがで
きる。As detailed above, according to the present invention, since the recording/reproducing circuit in the form of an integrated circuit chip is provided on the same slider block in the vicinity of the thin-film head, the connection wiring between the thin-film head and the recording/reproducing circuit is significantly reduced compared to the conventional method. It is possible to significantly reduce the influence of noise on signal transmission between the thin film head and the recording/reproducing circuit. As a result, data read/write operations can be performed reliably, and the characteristics of the magnetic disk device can be improved.
また記録再生回路の実装に当ってバンブ等により直接ス
ライダブロック上に接合するようにしているので、ワイ
ヤボンディングと比較しワイヤが無い分だけ実装面積を
小さくすることができる。Furthermore, since the recording/reproducing circuit is mounted directly onto the slider block using bumps or the like, the mounting area can be reduced compared to wire bonding due to the absence of wires.
またモールドしても小型にできるため、小型のスライダ
を用いた時も十分に実装が可能となる。Furthermore, since it can be made compact even when molded, it can be fully mounted even when a small slider is used.
またワイヤ実装と比較して周波数特性の劣化もなく信頼
性も高い。Also, compared to wire mounting, there is no deterioration in frequency characteristics and reliability is high.
さらに、記録再生回路を設けるためのスペースを基板上
から削減できるため、磁気ディスク装置を小型化するこ
とができる。Furthermore, since the space for providing the recording/reproducing circuit can be reduced from the substrate, the magnetic disk device can be made smaller.
第１図は本発明の一実施例にかかる磁気ヘッド装置の構
成側面図、第２図は本発明に用いられるバンブの構成を
示す集積回路チップのパッド部の断面図、第３図は従来
の磁気ヘッド装置の構造を示す構成側面図である。
１０・・・コイル、１１・・・ポール、１２・・・スラ
イダブロック、２０・・・記録再生回路の集積回路チッ
プ、２１・・・リードパッド、２２・・・リード、３１
・・・バンブ電極。FIG. 1 is a side view of the configuration of a magnetic head device according to an embodiment of the present invention, FIG. 2 is a sectional view of a pad portion of an integrated circuit chip showing the configuration of a bump used in the present invention, and FIG. FIG. 2 is a configuration side view showing the structure of a magnetic head device. DESCRIPTION OF SYMBOLS 10... Coil, 11... Pole, 12... Slider block, 20... Integrated circuit chip of recording/reproducing circuit, 21... Lead pad, 22... Lead, 31
...bum electrode.
Claims (1)
薄膜ヘッドと、この薄膜ヘッドとの間で書き込み／読み
出し信号の授受を行う記録再生回路を含む集積回路チッ
プとが互いに近接してスライダブロック上に配置され、
前記集積回路チップの端子が前記スライダブロック上に
形成された配線導体に直接接合された磁気ヘッド装置。 ２、集積回路チップが配線導体とバンプにより接合され
たことを特徴とする特許請求の範囲第１項記載の磁気ヘ
ッド装置。[Claims] 1. A thin film head that writes/reads recorded information on a magnetic medium and an integrated circuit chip including a recording/reproducing circuit that sends and receives write/read signals to and from the thin film head are connected to each other. placed on the slider block in close proximity,
A magnetic head device in which terminals of the integrated circuit chip are directly bonded to wiring conductors formed on the slider block. 2. The magnetic head device according to claim 1, wherein the integrated circuit chip is bonded to the wiring conductor by bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13367387A JPS63298809A (en) | 1987-05-29 | 1987-05-29 | Magnetic head device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP13367387A JPS63298809A (en) | 1987-05-29 | 1987-05-29 | Magnetic head device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS63298809A true JPS63298809A (en) | 1988-12-06 |
Family
ID=15110225
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP13367387A Pending JPS63298809A (en) | 1987-05-29 | 1987-05-29 | Magnetic head device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS63298809A (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0470349A2 (en) * | 1990-08-09 | 1992-02-12 | Hewlett-Packard Company | A disk drive in which magnetic head-to-disk capacitive coupling is eliminated |
Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4886474A (en) * | 1972-01-14 | 1973-11-15 | ||
| JPS499188A (en) * | 1972-05-11 | 1974-01-26 | ||
| JPS60616A (en) * | 1983-06-15 | 1985-01-05 | Comput Basic Mach Technol Res Assoc | Magnetic head assembly |
| JPS6016316B2 (en) * | 1976-10-30 | 1985-04-24 | ナショナル住宅産業株式会社 | assembly beam |
-
1987
- 1987-05-29 JP JP13367387A patent/JPS63298809A/en active Pending
Patent Citations (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS4886474A (en) * | 1972-01-14 | 1973-11-15 | ||
| JPS499188A (en) * | 1972-05-11 | 1974-01-26 | ||
| JPS6016316B2 (en) * | 1976-10-30 | 1985-04-24 | ナショナル住宅産業株式会社 | assembly beam |
| JPS60616A (en) * | 1983-06-15 | 1985-01-05 | Comput Basic Mach Technol Res Assoc | Magnetic head assembly |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| EP0470349A2 (en) * | 1990-08-09 | 1992-02-12 | Hewlett-Packard Company | A disk drive in which magnetic head-to-disk capacitive coupling is eliminated |
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