JPH02199609A - Magnetic head device - Google Patents
Magnetic head deviceInfo
- Publication number
- JPH02199609A JPH02199609A JP1834089A JP1834089A JPH02199609A JP H02199609 A JPH02199609 A JP H02199609A JP 1834089 A JP1834089 A JP 1834089A JP 1834089 A JP1834089 A JP 1834089A JP H02199609 A JPH02199609 A JP H02199609A
- Authority
- JP
- Japan
- Prior art keywords
- magnetic head
- integrated circuit
- coil
- recording
- slider block
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 229910000679 solder Inorganic materials 0.000 claims abstract description 12
- 239000010409 thin film Substances 0.000 abstract description 14
- 230000008054 signal transmission Effects 0.000 abstract description 2
- 230000003247 decreasing effect Effects 0.000 abstract 1
- 239000010408 film Substances 0.000 description 5
- 230000001681 protective effect Effects 0.000 description 5
- 238000000034 method Methods 0.000 description 2
- 238000005476 soldering Methods 0.000 description 2
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 1
- 229910052802 copper Inorganic materials 0.000 description 1
- 239000010949 copper Substances 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 238000000605 extraction Methods 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 239000002184 metal Substances 0.000 description 1
- 229910052751 metal Inorganic materials 0.000 description 1
- 238000000059 patterning Methods 0.000 description 1
- 238000000206 photolithography Methods 0.000 description 1
- 238000007747 plating Methods 0.000 description 1
- 238000009416 shuttering Methods 0.000 description 1
- 238000004544 sputter deposition Methods 0.000 description 1
- 238000007740 vapor deposition Methods 0.000 description 1
- 239000002966 varnish Substances 0.000 description 1
Classifications
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B5/00—Recording by magnetisation or demagnetisation of a record carrier; Reproducing by magnetic means; Record carriers therefor
- G11B5/127—Structure or manufacture of heads, e.g. inductive
- G11B5/31—Structure or manufacture of heads, e.g. inductive using thin films
- G11B5/3103—Structure or manufacture of integrated heads or heads mechanically assembled and electrically connected to a support or housing
-
- G—PHYSICS
- G11—INFORMATION STORAGE
- G11B—INFORMATION STORAGE BASED ON RELATIVE MOVEMENT BETWEEN RECORD CARRIER AND TRANSDUCER
- G11B33/00—Constructional parts, details or accessories not provided for in the other groups of this subclass
- G11B33/12—Disposition of constructional parts in the apparatus, e.g. of power supply, of modules
Landscapes
- Engineering & Computer Science (AREA)
- Manufacturing & Machinery (AREA)
- Magnetic Heads (AREA)
- Adjustment Of The Magnetic Head Position Track Following On Tapes (AREA)
Abstract
Description
【発明の詳細な説明】
（イ） 産業上の利用分野
本発明は、磁気媒体に対し記録情報の書込・読出を行う
磁気ヘッド装置に関するものである。DETAILED DESCRIPTION OF THE INVENTION (a) Field of Industrial Application The present invention relates to a magnetic head device for writing and reading recorded information to and from a magnetic medium.
（ロ）従来技術
磁気ディスク装置に使用される磁気ヘッドとして、近年
薄膜磁気ヘッドが使用されるようになってきた。薄膜磁
気ヘッドは、コイル、磁気コアをフォトリソグラフィ法
を利用してバターニングすることにより形成する。(b) Prior Art Thin film magnetic heads have come into use in recent years as magnetic heads used in magnetic disk drives. A thin film magnetic head is formed by patterning a coil and a magnetic core using a photolithography method.
従来の薄膜磁気ヘッドは、第４図に示すように、コイル
の端子は、パターン形成面の保護膜６の表面に露出させ
ていた。端子８は、銅等の金属をメツキまたは、スハッ
タリング等で作成することが多くワイヤボンディングま
たは、ハンダ付けにより書込・読出信号の授受を行う集
積回路チップへリード線により接続されていた。In the conventional thin film magnetic head, as shown in FIG. 4, the terminals of the coil are exposed on the surface of the protective film 6 on the pattern forming surface. The terminals 8 are often made of metal such as copper by plating or shuttering, and are connected by wire bonding or soldering to an integrated circuit chip that transmits and receives write and read signals using lead wires.
この場合、集積回路チップは書込・読出のコイルパター
ンが形成されているスライダ・ブロックから離れた位置
にある。スライダ・ブロックは、ヘッド・アーム（図示
せず〉によりスライダ・ブロックの面１に接合させてい
る。コイル端子８からのリード線は、ヘッド・アームに
そって導かれ、ヘッド・アーム上またはキャリッジ上に
ある記録・再生のためのａｍ回路チ・ンプヘ接続されて
いる。In this case, the integrated circuit chip is located away from the slider block in which the write/read coil patterns are formed. The slider block is joined to face 1 of the slider block by a head arm (not shown). Lead wires from coil terminals 8 are guided along the head arm and attached to the head arm or to the carriage. It is connected to the AM circuit chip above for recording and playback.
このように、従来の薄膜磁気ヘッドでは、コイル端子と
集積回路チップとの距離が数ｃｍ以上離れているなめ、
ヘッドからの出力（０，１ｓｖ以下）を集積回路チップ
へ入力する前に、外部ノイズの影響を受けやすいという
問題点があった。そのため、ノイズが乗った出力信号を
増幅し、磁気ディスク装置へ送ると再生信号のエラーが
生じやすいといった欠点があった。In this way, in conventional thin-film magnetic heads, the distance between the coil terminal and the integrated circuit chip is several centimeters or more.
There is a problem in that the output from the head (0.1 sv or less) is susceptible to external noise before being input to the integrated circuit chip. Therefore, if the output signal containing noise is amplified and sent to the magnetic disk device, there is a drawback that errors are likely to occur in the reproduced signal.
（ハ） 発明が解決しようとする課題
本発明が解決しようとする課題は、薄膜磁気ヘッドのコ
イル端子と集積回路チップとの間の距離をできるだけ短
くして、書込・読出信号にノイズを入らないようにした
磁気ヘッド装置を得ることにある。(C) Problems to be Solved by the Invention The problems to be solved by the present invention are to reduce the distance between the coil terminals of the thin-film magnetic head and the integrated circuit chip as much as possible to prevent noise from entering the write/read signals. The object of the present invention is to obtain a magnetic head device in which the magnetic head is free from the magnetic head.
（ニ） 課題を解決するための手段
本発明の磁気ヘッド装置は、磁気媒体に対し記録情報の
書込・読出を行う磁気ヘッド装置において、コイルの外
部取出端子を磁気ヘッドの書込・読出面と反対側のスラ
イダ・ブロック面に露出させたことからなる手段によっ
て、上記課題を解決している。(d) Means for Solving the Problems The magnetic head device of the present invention is a magnetic head device that writes and reads recorded information on a magnetic medium, in which the external output terminal of the coil is connected to the write/read surface of the magnetic head. The above problem is solved by exposing the slider block to the opposite side of the slider block.
記録・再生回路を含む集積回路チップと前記外部取出端
子とをハンダ・バンプによって接合することもできる。The integrated circuit chip including the recording/reproducing circuit and the external output terminal can also be bonded using solder bumps.
（ホ）作・用
本発明の磁気ヘッド装置は、磁気記録媒体上の情報の書
込・読出を行う薄膜磁気ヘッドと、薄膜磁気ヘッドと記
録・再生信号を伝達する集積回路チップとの間の距離を
短くするために、ヘッド・アームと接続する側のスライ
ダ・ブロック面に集積回路チップを配置することを特徴
としている。(E) Function/Operation The magnetic head device of the present invention has a thin film magnetic head that writes and reads information on a magnetic recording medium, and an integrated circuit chip that transmits recording and reproduction signals between the thin film magnetic head and the magnetic recording medium. In order to shorten the distance, an integrated circuit chip is placed on the side of the slider block that connects to the head arm.
この場合、コイルの端子と集積回路との間の接続を容易
にするために、コイル端子を集積回路チップを配置する
スライダ・ブロック面に露出させたことを特徴としてい
る。スライダ・ブロック面側でヘッド・アームが接着さ
れるため、接着面は平面でなければならない、そのため
、集積回路のチップは回路面をスライダ・ブロック面側
に向はハンダ・バンプによりスライダ・ブロック面に形
成したハンダ・バンプ接続端子と接合する。それにより
、ヘッド・アームは、集積回路チップの平らな裏面と接
着できる。This case is characterized in that the coil terminals are exposed on the surface of the slider block on which the integrated circuit chip is placed, in order to facilitate the connection between the coil terminals and the integrated circuit. Since the head arm is bonded on the slider block side, the bonding surface must be flat. Therefore, the integrated circuit chip is attached to the slider block surface by solder bumps with the circuit side facing the slider block side. Connect it to the solder bump connection terminal formed on the board. Thereby, the head arm can be bonded to the flat back side of the integrated circuit chip.
（へ） 実施例
第１図から第３図までを参照して本発明の磁気ヘッド装
置の実施例について説明する。(f) Embodiment An embodiment of the magnetic head device of the present invention will be described with reference to FIGS. 1 to 3.
本発明の磁気ヘッド装装置は、磁気媒体に対し記録情報
の書込・読出を行う磁気ヘッド装置において、コイルの
外部取出端子２を磁気ヘッドの書込・読出面と反対側の
スライダ・ブロック面Ｉに露出させる。The magnetic head mounting device of the present invention is a magnetic head device that writes and reads recorded information on a magnetic medium, and the external output terminal 2 of the coil is connected to the slider block surface opposite to the writing/reading surface of the magnetic head. Expose to I.
記録・再生回路を含む集積回路チップ４と外部取出端子
２とをハンダ・バンプ１０によって接合する。An integrated circuit chip 4 including a recording/reproducing circuit and an external output terminal 2 are bonded by solder bumps 10.
第４図に示すように、従来の薄膜磁気ヘッドにおいては
、コイル端子８は保護膜表面に露出していた。コイル端
子８とリード線をワイヤボンディングまたはハンダ付け
で接続していた。As shown in FIG. 4, in the conventional thin film magnetic head, the coil terminal 8 was exposed on the surface of the protective film. The coil terminal 8 and the lead wire were connected by wire bonding or soldering.
本発明では、第１図に示すように、コイルの端子２を保
護膜表面６に露出させずにスライダ・ブロック面１に露
出させる。スライダ・ブロック面１の保護膜７の部分に
コイル端子を露出させるためには、第３図に示すように
、コイル端子２を形成した後、スライダを切断する場合
、点線の部分１２で切断すると端子２が面１に露出する
。このコイル端子２の製法は、従来の端子８の製法と同
じ方法でよい。In the present invention, as shown in FIG. 1, the coil terminals 2 are not exposed to the protective film surface 6 but are exposed to the slider block surface 1. In order to expose the coil terminal on the protective film 7 part of the slider block surface 1, when cutting the slider after forming the coil terminal 2, as shown in FIG. Terminal 2 is exposed on surface 1. The coil terminal 2 may be manufactured by the same method as the conventional terminal 8.
集積回路チッ“プは、スライダ・ブロック面１上に配置
する０面１はヘッド・アームと接続する部分であるため
、平面である必要がある。そこで、チップの回路形成面
を面１ｆｌｌに向け、平らなチップの裏側を表面として
配置する必要がある。そのために、スライダ・ブロック
の面ｌに、チップのパッド部分に対応する場所に、第２
図に示すようにハンダ・バンプ１０を形成し、次段信号
処理回路との接続パッド９と接続する。The integrated circuit chip must be flat because surface 1, which is placed on slider block surface 1, is the part that connects to the head arm. , it is necessary to place the flat back side of the chip as the surface.For this purpose, on the surface l of the slider block, a second
As shown in the figure, solder bumps 10 are formed and connected to connection pads 9 to the next stage signal processing circuit.
ハンダ・バンプ１０と外部接続パッド９、ハンダ・バン
プ１０と接続バッド３との間のライン１１等は蒸着また
は、スパッタリング等で作成すればよい。The lines 11 between the solder bumps 10 and the external connection pads 9, the solder bumps 10 and the connection pads 3, etc. may be formed by vapor deposition, sputtering, or the like.
面１上に露出したコイル端子２は、面１上に形成された
パッド３とワイヤボンディング等で接続する。パッド３
は、バンプを通して集積回路の薄膜ヘッドへの書込・読
出端子へと接続されている。The coil terminal 2 exposed on the surface 1 is connected to a pad 3 formed on the surface 1 by wire bonding or the like. pad 3
are connected through bumps to write/read terminals on the thin film head of the integrated circuit.
面１のハンダ・バンブｌＯはチップ４のバンブと接続さ
れる。The solder bump lO on side 1 is connected to the bump on chip 4.
（ト）効果
本発明によれば、薄膜磁気ヘッドのコイル端子と記録・
再生のための集積回路との間の距離を短くでき、薄膜磁
気ヘッドと記録・再生の集積回路間の信号伝送時に入る
ノイズを軽減でき、磁気ディスク装置の信頼性を大幅に
向上できる。(g) Effects According to the present invention, the coil terminal of the thin film magnetic head and the recording/recording
The distance between the integrated circuit for reproduction can be shortened, the noise introduced during signal transmission between the thin film magnetic head and the integrated circuit for recording and reproduction can be reduced, and the reliability of the magnetic disk device can be greatly improved.
第１図は本発明の磁気ヘッド装置の斜視図９第２図はス
ライダ・ブロック面上のパターンの平面図。第３図はコ
イル端子取出パターンの平面図。
第４図は従来の薄膜磁気ヘッドの斜視図。
１ニスライダ・ブロック面 ２：コイル端子３：接続パ
ッド ４：集積回路チップ５ココイル引出線
６：保護膜表面７：保護Ｍ ８：コイル端
子ハンダ・バンブ
９：接続パッド １０：ハンダ・バンプ第２図FIG. 1 is a perspective view of a magnetic head device of the present invention; FIG. 2 is a plan view of a pattern on a slider block surface. FIG. 3 is a plan view of the coil terminal extraction pattern. FIG. 4 is a perspective view of a conventional thin film magnetic head. 1. Varnish slider/block surface 2: Coil terminal 3: Connection pad 4: Integrated circuit chip 5 Cocoil leader wire
6: Protective film surface 7: Protection M 8: Coil terminal solder bump 9: Connection pad 10: Solder bump Figure 2
Claims (1)
ッド装置において、コイルの外部取出端子を磁気ヘッド
の書込・読出面と反対側のスライダ・ブロック面に露出
させたことを特徴とする磁気ヘッド装置。 ２、記録・再生回路を含む集積回路チップと前記外部取
出端子とをハンダ・バンプによつて接合したことを特徴
とする請求項１記載の磁気ヘッド装置。[Claims] 1. In a magnetic head device that writes and reads recorded information on a magnetic medium, the external output terminal of the coil is exposed on the slider block surface opposite to the write/read surface of the magnetic head. A magnetic head device characterized by: 2. The magnetic head device according to claim 1, wherein an integrated circuit chip including a recording/reproducing circuit and the external output terminal are bonded to each other by solder bumps.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1834089A JPH02199609A (en) | 1989-01-27 | 1989-01-27 | Magnetic head device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1834089A JPH02199609A (en) | 1989-01-27 | 1989-01-27 | Magnetic head device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH02199609A true JPH02199609A (en) | 1990-08-08 |
Family
ID=11968923
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1834089A Pending JPH02199609A (en) | 1989-01-27 | 1989-01-27 | Magnetic head device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH02199609A (en) |
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03230306A (en) * | 1990-02-05 | 1991-10-14 | Alps Electric Co Ltd | Thin-film magnetic head and its production |
| EP1045375A2 (en) * | 1999-04-15 | 2000-10-18 | Matsushita Electric Industrial Co., Ltd. | Magnetic reproduction device, magnetic head using the device and method for producing the magnetic head |
| WO2002050835A1 (en) * | 2000-12-20 | 2002-06-27 | Fujitsu Limited | Suspension and disk device |
| US6870717B2 (en) | 2002-05-16 | 2005-03-22 | Hitachi Global Storage Technologies Netherlands B.V. | Semiconductor slider with an integral spin valve transistor structure and method for making same without a bonding step |
| US7535676B2 (en) | 2004-08-26 | 2009-05-19 | Hitachi Global Storage Technologies B.V. | Slider with bonding pads opposite the air bearing surface |
-
1989
- 1989-01-27 JP JP1834089A patent/JPH02199609A/en active Pending
Cited By (7)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH03230306A (en) * | 1990-02-05 | 1991-10-14 | Alps Electric Co Ltd | Thin-film magnetic head and its production |
| EP1045375A2 (en) * | 1999-04-15 | 2000-10-18 | Matsushita Electric Industrial Co., Ltd. | Magnetic reproduction device, magnetic head using the device and method for producing the magnetic head |
| EP1045375A3 (en) * | 1999-04-15 | 2006-03-08 | Matsushita Electric Industrial Co., Ltd. | Magnetic reproduction device, magnetic head using the device and method for producing the magnetic head |
| WO2002050835A1 (en) * | 2000-12-20 | 2002-06-27 | Fujitsu Limited | Suspension and disk device |
| US6870717B2 (en) | 2002-05-16 | 2005-03-22 | Hitachi Global Storage Technologies Netherlands B.V. | Semiconductor slider with an integral spin valve transistor structure and method for making same without a bonding step |
| US7230805B2 (en) | 2002-05-16 | 2007-06-12 | Hitachi Global Storage Technologies Netherlands, B.V. | Semiconductor slider with an integral spin valve transistor structure and method for making same without a bonding step |
| US7535676B2 (en) | 2004-08-26 | 2009-05-19 | Hitachi Global Storage Technologies B.V. | Slider with bonding pads opposite the air bearing surface |
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