JP2998290B2 - Magnetic head device - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a magnetic head device for a floppy disk used for recording data in a computer or the like.

[0002]

2. Description of the Related Art In recent years, as small and thin devices such as a notebook word processor have become widespread, a magnetic head device for a floppy disk has been in a similar tendency.

A conventional magnetic head device will be described below. FIG. 4 is an exploded perspective view of a conventional magnetic head device, and FIG.
6 is a plan view as viewed from the medium sliding surface, FIG. 6 is a side view of the same, and FIG. 7 is a completed perspective view of the same.

In FIGS. 4 to 7, reference numeral 1 denotes a magnetic head.
It comprises a read / write magnetic head 2 and an erase magnetic head 3. A back core 4 forms a magnetic circuit together with the magnetic head 1. A slider 5 holds the magnetic head 1 from both sides. 6 is a recording / reproducing coil, 7
Is a recording / reproducing coil bobbin having a terminal 8 which acts as an intermediary for joining with a flexible printed circuit board (FPC) 14. Similarly, 9 is an erasing coil and 10 is an erasing coil bobbin, which has a terminal 8.

The magnetic head 1 and the slider 5 are adhered, the coils 6 and 9 are inserted, and the back core 4 is adhered to the magnetic head 1 to be referred to as a completed slider 13.
The completed slider 13 is bonded to the upper surface of the gimbal spring 11, the FPC 14 is bonded to the lower surface of the gimbal spring 11, the terminal 8 is passed through a hole of the FPC 14, and the FPC 14 and the terminal 8 are soldered on the lower surface of the gimbal spring 11. Was.

[0006]

The thickness of the magnetic head device has been required to be thinner as the thickness of the floppy disk has been reduced. However, the slider height of the magnetic head device is restricted by the size of the jacket of the magnetic medium. Is difficult.

Therefore, in order to reduce the thickness of the magnetic head device, the lower surface of the gimbal spring must be reduced.

However, in the above-described conventional configuration, if the amount of terminal protrusion is reduced in order to reduce the thickness of the lower surface of the gimbal spring, stable soldering cannot be obtained, and there is a problem that the reduction in thickness is limited.

An object of the present invention is to solve the above problems and to provide a thin magnetic head device.

[0010]

According to the present invention, in order to achieve the above object, a solder joint between a terminal of an FPC and a completed slider is provided by a gimbal spring provided between the FPC and the completed slider. It is configured to be provided on the upper part.

[0011]

According to the present invention, there is no solder joint between the FPC and the terminal from the lower surface of the FPC.

[0012]

An embodiment of the present invention will be described below with reference to the drawings.

FIG. 1 is an exploded perspective view of a magnetic head device according to the present invention, and FIG. 2 is a side view of the same. The completed slider 13 has the same configuration as that of the conventional example, and is fixed to the upper surface of the gimbal spring 11 with resin.

The FPC 12 is adhered to the lower surface of the gimbal spring 11. When bonding the FPC 12 to the gimbal spring 11, the terminal 8 is passed through a hole provided in the FPC 12 so as to be bonded to the gimbal spring 11.

Here, the solder joints (including the holes) of the FPC 12 are previously bent.
This bent portion has a structure in which when the FPC 12 is bonded to the gimbal spring 11, the bent portion protrudes from the upper surface of the gimbal spring 11. By bending this FPC 12,
When the FPC 12 is bonded to the gimbal spring 11, the FPC 1
The solder joint between the terminal 2 and the terminal 8 is located on the upper surface of the gimbal spring 11.

On the other hand, the amount of protrusion of the terminal 8 from the hole of the FPC is increased, so that stable solder bonding is possible.

The FPC 12 can be bent as shown in FIG. 3, and the thickness of the back surface of the magnetic head device can be reduced as in the embodiment shown in FIG.

[0018]

As is apparent from the above description, according to the present invention, by providing the solder joint between the FPC and the terminal above the gimbal spring, the stability of soldering can be improved, and the FPC and the FPC can be connected from the lower surface of the FPC. Since there are no solder joints at the terminals, the thickness of the magnetic head device can be reduced.

[Brief description of the drawings]

FIG. 1 is an exploded perspective view of a magnetic head device according to an embodiment of the present invention.

FIG. 2 is a side view of the same.

FIG. 3 is a side view of another embodiment.

FIG. 4 is an exploded perspective view of a conventional magnetic head device.

FIG. 5 is a plan view of a conventional magnetic head device viewed from a medium sliding surface.

FIG. 6 is a side view of the same.

FIG. 7 is a completed perspective view of the same.

[Explanation of symbols]

 8 Terminal 11 Gimbal spring 12 Flexible printed circuit board (FPC) 13 Completed slider

Claims (1)

(57) [Claims] 1. A slider is completed on the upper surface of a gimbal spring.
The gimbal spring has a flexure on its lower surface.
A magnetic head device provided with a printed circuit board.
Therefore, the completed slider has a terminal on the gimbal spring side.
The flexible printed circuit board includes the gimbal.
A bent part with a hole bent to the spring side is provided.
It is in and, terminals of the slider finished body the flexible printed
Through the hole in the bent part of the circuit board and solder
While, the solder joint of the flexible printed circuit board,
It is located above the gimbal spring
Magnetic head device.