JPS6241369Y2 - - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a connection device for an inductance type or magnetoresistive type multi-channel thin film magnetic head.

Thin-film magnetic heads, which create magnetic head elements using thin-film process technologies such as vapor deposition and photoablation, can be miniaturized because microfabrication is easy, as seen in IC process technology. It has particularly excellent features as a magnetic head for multi-channel recording with narrow track widths. Compared to conventional monolithic magnetic heads, inductance type thin film magnetic heads have
Since at least one magnetic core on one side is composed of a thin film magnetic material, the recording leakage flux in the working gap is theoretically steep during recording, and the short wavelength recording characteristics are excellent, making it possible to achieve the aforementioned narrow track. In combination with these points, it is suitable as a magnetic head for high-density recording. Furthermore, although magnetoresistive thin-film magnetic heads are used only for playback, they directly respond to the magnetism recorded on the recording medium, making them suitable for high-density recording as mentioned above, as well as providing high output even during playback at low speeds. can be obtained.

For these reasons, as magnetic heads for audio PCM recording that enable high-quality recording and playback of audio signals, inductance type multi-channel thin film magnetic heads are used for recording, and magnetic effect type channel thin film magnetic heads are used for playback. A system using this has been put into practical use. Incidentally, in addition to the above-mentioned characteristics of these multi-channel thin-film magnetic heads, the magnetic head elements can be manufactured using vapor deposition and photoablation techniques, resulting in high yields due to uniform characteristics. Although there is an advantage in terms of cost due to the possibility of simultaneous mass production, there is a drawback that as the number of elements increases, the manufacturing cost becomes relatively high compared to other components of the connection device.

Now, to explain the structure of the multi-channel thin film magnetic head which is the object of the present invention, as shown in FIG. A multichannel actuating element is located in the adhesive gap 6 between the tape sliding surface 3 of the protective cover 4 and the tape sliding surface 5 of the protective cover 4, and in the case of an inductance type, it is sandwiched between a pair of magnetic materials. The non-magnetic layer constitutes a recording gap, and in the case of a magnetoresistive type, a magnetic layer serving as a magnetoresistive element constitutes a reproduction gap. A conductive terminal pattern 7 for lead connection is provided at the other end of the element surface 2 of the substrate 1, and a number of leads 9 exposed from one end of a flexible wire 8 are connected to this. The substrate 1 and the flexible wire 8 are bonded and fixed to the head base 10. On the element surface 2 of the substrate 1, as shown in FIG. 2, a magnetic layer 11 and a conductor pattern 12 which function as a magnetoresistive element are deposited, and a conductor terminal pattern 7 for connection to the lead 9 of the flexible wire 8 is deposited. have. Gap depth monitoring elements 14 are formed at both ends of these magnetoresistive elements at the same time as the magnetoresistive elements are deposited, and a first resistance layer 15 for rough monitoring of the machining amount during gap depth machining. It consists of a second resistance layer 16 for monitoring the final finish and a conductor terminal pattern 18 for connecting the conductor pattern 17 and the lead 9 of the flexible wire 8.

With the above configuration, gap depth machining is performed while monitoring the resistance value of the gap depth monitor element 14, and the gap depth monitor elements 14 at both ends By controlling and processing the balance of the low resistance value shown by and the final predetermined low resistance value, the gap depths of all elements can be made uniform with high precision.

Next, an example of a conventional connection device for such a thin film magnetic head will be explained.As shown in FIG.
The conductor terminal pattern 7 on the other end of the element surface 2 of the substrate 1 on which the actuating element is formed and the conductor terminal pattern 18 of the gap depth monitor element 14 are both connected to the lead 9 of the flexible wire 8. Connected to one end is a connector 21 having connector pins 20, through which signals from the actuating element and the gap depth monitoring element are extracted. Therefore,
In such a configuration, gap depth machining and device characteristic inspection must be performed after connecting the flexible wire 8 including the multi-terminal connector 20 to the thin film magnetic head, which not only causes poor workability in gap depth machining, but also causes problems such as those mentioned above. There is a problem in that the flexible wire 8 and the connector 21, which account for a large proportion of the cost, are wasted on products with process defects after gap depth machining, including poor characteristics of the thin film magnetic head.

In view of this problem, the present invention aims to eliminate the need to waste flexible wires and connectors even if defective products occur after gap depth machining. a first flexible wire connected to the gap depth monitor element and having a lead connection terminal for the gap depth monitor element and a connection terminal part for the actuating element, and a connection part of the first flexible wire with the connection terminal part at one end. and a second flexible wire having a connector at the other end.

An embodiment of the present invention will be described below with reference to FIGS. 4 to 7. In FIG. 4, a protective cover 4 is bonded to the element surface 2 of the substrate 1 on which the thin film element is formed, covering the element. At the other end of the element surface 2, as shown in FIG.
It has a conductor terminal pattern 7 for connection to the lead 23 of No. 2. The conductor terminal pattern 18 of the gap depth monitor element is also connected to the lead 23 of the first flexible wire 22, and within this first flexible wire there is a lead connection terminal 24 for external connection of the gap depth monitor. have. The first flexible wire 22 is further connected to one end of a second flexible wire 25, and a connector 27 having connector pins 26 is connected to the other end of the second flexible wire 25. The first flexible wire 22 and the second flexible wire 25 are connected at their connecting portion 28
and these two flexible wires 2
The connecting portion 28 is protected by a flexible wire fixing member 29 bonded to the flexible wires 22, 25, which supplements the mechanical strength and serves to fix the flexible wires 22, 25 to the equipment. To explain the first flexible wire 22 with reference to FIG. 5, the other end of the lead 30 connected to the gap depth monitor element is connected to the lead connecting terminal 24 from which a measurement lead wire can be drawn out by soldering. is formed. Further, the leads from the actuating elements constituting the thin film magnetic head are connected to a group of leads 31, and the other end is constituted by a connection terminal portion 32 made of a lead copper body exposed by removing the flexible film, and a second It is used as a connection part with the flexible wire 25. Also provided is a ground terminal pattern 33, which connects to another connecting terminal pattern 34 connectable to the second flexible wire 25 if necessary. The conductor terminal patterns 7 and 18 of the thin film head substrate and the first
The flexible wire leads 30 and 31 can be bonded together by forming an Au--Sn eutectic layer by heating and pressing the surfaces of the leads 30 and 31 of the flexible wires, for example, the former with Au and the latter with Sn. By providing the first flexible wire 22 having such a lead connection terminal 24 for gap depth monitoring, gap depth processing can be performed at the stage of connecting this first flexible wire 22. By making the first flexible wire 22 small in size, workability is not deteriorated in gap depth machining, and even if it becomes defective at this stage, the second flexible wire 25, which has a large cost ratio, is not wasted. That's enough. Since the characteristics of the thin film magnetic head element can also be inspected at this stage, the second flexible wire 25 is not wasted even in the case of defective characteristics. Since this first flexible wire is small in size, it can be manufactured at low cost using a film carrier method, as shown in FIG. That is, the film 36 has tractor holes 35 on both sides.
The first flexible wire pattern 37 is formed in the first flexible wire pattern 37, and the outer shape is punched out using a press.These manufacturing processes can be automated in a continuous process, and can be manufactured at low cost. To explain the second flexible wire 25 with reference to FIG. 7, one end of the lead pattern 38 becomes a connection part 39 with the connection terminal part 32 of the first flexible wire 22, and the other end has a terminal to which the connector pin 26 is connected. 40 is formed. The first flexible wire 22 and the second flexible wire 25 can be connected, for example, by coating the former with a copper lead and the latter with Pb--Sn solder, and then bonding them together by heat and pressure bonding.

According to the thin film magnetic head connection device of the present invention,
As is clear from the above description, by dividing the flexible wire into two parts, most of the flexible wire is not wasted due to manufacturing defects, so that it can be manufactured at low cost and is easy to manufacture.

[Brief explanation of the drawing]

FIG. 1 is a perspective view showing the structure of a thin film magnetic head, which is the object of the present invention, FIG. 2 is a plan view of the same element pattern, FIG. 3 is a plan view of a conventional example, and FIGS.
The figure shows an embodiment of the present invention, FIG. 4 is a plan view,
FIG. 5 is an enlarged plan view of the first flexible wire, FIG. 6 is an explanatory diagram of the manufacturing process of the first flexible wire, and FIG. 7 is an enlarged plan view of the second flexible wire. DESCRIPTION OF SYMBOLS 1... Board, 2... Element surface, 4... Protective cover, 7, 18... Conductor terminal pattern, 14... Gap depth monitor element, 22... First flexible wire, 24... Lead connection terminal , 25...
...Second flexible wire, 27...Connector, 28...Connection section, 29...Flexible wire fixing component, 32...Connection terminal section, 39...Connection section.

Claims (1)

[Claims for Utility Model Registration] 1. One end connected to the substrate of an inductance type or magnetoresistive type multi-channel thin film magnetic head equipped with a gap depth monitor element and actuated with a lead connection terminal for the gap depth monitor element. A thin film magnetic field comprising a first flexible wire having a connecting terminal portion for an element, and a second flexible wire having a connecting portion with the connecting terminal portion of the first flexible wire at one end and a connector at the other end. Head connection device. 2. The connection of the thin film magnetic head according to claim 1, which is provided with a flexible wire fixing component that covers the connection portion between the first flexible wire and the second flexible wire and is bonded to the two flexible wires. Device.