JP2806378B2 - Magnetic head slider - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION

[0001]

The present invention relates to a magnetic head used in a magnetic disk drive, and more particularly to a magnetic head slider integrated with a recording / reproducing amplifier.

[0002]

2. Description of the Related Art In a conventional magnetic disk drive, as shown in FIG. 11, a slider 103 provided with a magnetic head 102 for recording and reproducing data on and from a recording disk 101 is mounted on a suspension 104.
It is attached to an actuator unit 107 including a mounting arm 105 and a carriage 106.

The actuator unit 107 is equipped with a head amplifier 108 for amplifying a recording / reproducing signal.

[0004] The rotation of the magnetic disk 101 causes the magnetic head slider 1 to move away from the surface of the magnetic disk 101.
03, and the arm 105 is swung by the rotation of the carriage 106 to move the magnetic head 102 to the magnetic disk 1.
01 is moved to a desired position in the radial direction, thereby recording or reproducing predetermined information on the surface of the magnetic disk 101.

[0005] Signal lines for recording signals and reproduction signals are fine lines 109 and a flexible printed wiring board (FPC) 1.
A head slider 103 provided with a magnetic head 102 and having a magnetic head 102 is connected to a head amplifier 108 via a suspension 104 and an actuator 107.

[0006] In recent years, with the increase in capacity and transfer speed of magnetic disk devices, demands for higher bandwidth and higher speed for recording / reproducing signals are increasing.

On the other hand, as the reproduction signal becomes finer as the density becomes higher, the reproduction output becomes smaller, and at the same time, the frequency band to be used is expanded.
In this case, the reproduction signal is transmitted from the magnetic head 102 to the head amplifier 108 via the flexible printed wiring board (FPC) 110. Even in such a situation, a sufficient bit error rate is ensured, so that this weak signal is transmitted. Various methods have been proposed for reducing circuit noise and disturbance noise mixed in a reproduced signal.

For example, in Japanese Patent Application Laid-Open No. 4-47511, for a head chip provided with a plurality of magnetoresistive thin-film magnetic heads, the same number of transformers and amplifying ICs as the magnetoresistive thin-film magnetic heads are surface-mounted. A method is disclosed in which a chip and a flexible printed wiring board (FPC) are adhered to each other, electrically connected to each other by wire bonding or the like, and then molded into a resin to obtain a magnetic head.

[0009]

In the structure of the conventional hard disk drive, the first problem is that the usable band of the reproducing amplifier is narrowed or the noise is increased, and the quality of the reproduced signal is deteriorated, that is, S / N ratio is reduced. For this reason, there is a disadvantage that the error rate is deteriorated and the reliability and the high-speed performance of the device are reduced.

The reason is that the fine lines from the magnetic head to the head amplifier and the wiring using the FPC pass from the head slider to the suspension and the actuator, so that the length is at least several centimeters, which is very small when handling minute recording / reproducing signals. This causes parasitic capacitance and inductance that cannot be ignored.

Further, since the long wiring functions as an antenna, there is a disadvantage that the wiring is easily affected by external noise.

The second problem is that during recording, the reversal time of the recording current increases and a desired magnetization reversal interval on the magnetic disk cannot be realized. For this reason, non-linear distortion and the like are likely to occur, which has been a serious obstacle to realizing high-density recording.

The reason is that the transient response of the recording current is deteriorated in accordance with the time constant due to the parasitic capacitance and inductance due to the length of the wiring from the magnetic head to the head amplifier, as in the first problem. It is.

A third problem is that the flying of the head with respect to the magnetic disk becomes unstable, and the magnetic head cannot be moved to a desired position in the radial direction of the magnetic disk at a high speed due to the swing of the arm. However, there is a problem that the reliability and the high speed of the device are impaired. The reason for this is that, since a chip on which an IC or the like is mounted is added to the magnetoresistive thin-film magnetic head chip, the head slider becomes large and the mass increases.

Further, the fourth problem is that the cost of the magnetic head is increased in the conventional configuration. The reason for this is that a step of connecting and molding a plurality of chips is necessary, which complicates the magnetic head working process and increases the number of processes, thereby lowering productivity.

[0016]

An object of the present invention is to improve the disadvantages of the prior art, and particularly to effectively suppress the narrowing of the frequency band used, which tends to occur during recording and reproduction, and to suppress the decrease in the S / N ratio. It is an object of the present invention to provide a magnetic head slider in which the reliability of the entire apparatus is improved.

[0017]

In order to achieve the above object, according to the first aspect of the present invention, a slider body provided at the tip of a suspension and a magnetic head provided at one end face of the slider body are provided. In a magnetic head slider formed by forming the magnetic head into a thin film, a silicon bare chip substrate is laminated on the slider body via a resin layer, and a recording is performed by a thin film process on the silicon bare chip substrate. Equipped with a head amplifier circuit for playback. A connection circuit for directly connecting the head amplifier circuit and the above-described magnetic head is provided in the resin layer, thereby integrating the magnetic head and the head amplifier circuit.

Therefore, according to the first aspect of the present invention,
Since the magnetic head and the head amplifier are directly connected and the parasitic capacitance and inductance caused by the length of the connection wiring between them are suppressed to a minimum, disturbance noise can be reduced during reproduction.
And low noise can be realized, and furthermore, it is possible to effectively suppress the narrowing of the recording / reproducing band used by the disk device equipped with the disk device. At the time of recording, a high-speed recording current reversal is ensured, a desired magnetization reversal interval is realized, nonlinear distortion and the like can be reduced, and as a result, the reliability of a magnetic disk device equipped with the same can be secured.

According to a second aspect of the present invention, the silicon bare chip substrate is laminated via a resin layer on the surface of the slider body opposite to the slider floating surface. At the same time, a head amplifier circuit for recording and reproduction manufactured by a thin film process is provided on the silicon bare chip substrate. Then, a connection circuit for directly connecting the head amplifier circuit and the magnetic head is provided in the resin layer described above, whereby the magnetic head and the head amplifier circuit are integrated.

Therefore, according to the second aspect of the present invention,
In addition to functioning equivalently to the above-described claim 1, the head amplifier circuit is laminated on the slider body, so that the head amplifier circuit can be integrated with the slider body without changing the size of the slider body. It is possible to execute information recording or reading of the sensitivity.

According to a third aspect of the present invention, in accordance with the first aspect of the present invention, a silicon bare chip substrate is laminated on one end surface of a slider body with a resin layer interposed therebetween. Is equipped with a head amplifier circuit for recording and reproduction manufactured by a thin film process. A connection circuit for directly connecting the head amplifier circuit and the magnetic head is provided in the resin layer described above,
Thus, a configuration is adopted in which the magnetic head and the head amplifier circuit are integrated.

Therefore, according to the third aspect of the present invention,
In addition to functioning equivalently to the above-described first aspect of the present invention, the same thickness as that of the above-described conventional example can be maintained without changing the thickness of the slider main body. And a silicon bare chip substrate with a head amplifier circuit covering the magnetic head at one end of the slider body, so that the magnetic head can be protected for a long time, and the durability of the magnetic head can be improved. Can be achieved.

According to the fourth aspect of the present invention, the above-described connection circuits are provided on both surfaces of the resin layer corresponding to the input wiring of the head amplifier circuit on the silicon bare chip substrate side and the wiring for the magnetic head on the slider body side. It is configured such that it comprises one and the other conductive pads, a projection made of a conductive member connecting the respective conductive pads, and a direct member.

Therefore, in the invention according to claim 4,
In addition to functioning equivalently to each of the above-described inventions, the magnetic head can be connected to the head amplifier circuit on the silicon bare chip substrate side without using a wiring cable, and noise entering from the outside can be obtained. Can be greatly reduced. In the invention according to claim 5, the above-mentioned suspension is equipped with a flexible printed wiring board for connecting the head amplifier circuit on the silicon bare chip substrate side to a signal processing system and a control system provided outside.
It has the configuration.

Therefore, according to the invention of claim 5,
In addition to functioning equivalently to the above-mentioned invention, no separate wiring cable is required in the slider body, and in this respect, the stable operation of the slider body can be ensured. It becomes possible.

[0026]

BEST MODE FOR CARRYING OUT THE INVENTION

(First Embodiment) Hereinafter, a first embodiment of the present invention will be described with reference to FIGS.

In FIGS. 1 and 2, the magnetic head slider includes a slider body 1 provided at the tip of a suspension 100 and a magnetic head 2 provided on one end surface of the slider body 1. This magnetic head 2
Are formed into a thin film in a thin film manufacturing process.

A silicon bare chip substrate 4 is laminated on the slider body 1 via a resin layer 3. Specifically, as shown in FIGS. 1 and 2, a silicon bare chip substrate 4 is laminated via a resin layer 3 on the surface of the slider body 1 opposite to the slider floating surface (the lower surface in FIG. 1). . On this silicon bare chip substrate 4, a recording / reproducing head amplifier circuit manufactured by a thin film process is provided. Then, a connection circuit 10 for directly connecting the head amplifier circuit and the magnetic head 2 is incorporated in the resin layer 3 described above.

More specifically, a silicon bare chip substrate 4 having the same dimensions as the rear surface of the slider body 1 is laminated on the slider body 1 provided with the magnetic head 2. The silicon bare chip substrate 4 is provided with a first-stage head amplifier circuit, and the first-stage head amplifier circuit is electrically connected to the above-described magnetic head 2 and is sealed by the resin layer 3.

On the upper surface 4A of the silicon bare chip substrate 4 (the surface opposite to the connection surface with the slider body 1), a power supply and a power supply for connecting the next-stage signal processing circuit system and the first-stage head amplifier circuit are provided. At least six connection terminals 5 for recording / reproducing signal input / output are formed by through-hole processing or the like, and are provided on the silicon bare chip substrate 4 and the power supply and the next-stage signal processing system via the suspension 100 by the fine wires 6. Head amplifier circuit.

Next, the electrical connection between the slider body 1 and the silicon bare chip substrate 4 will be described in detail.

FIG. 2 shows the slider body 1 and the silicon bare chip substrate 4 in this embodiment viewed from the arrow A in FIG.
FIG. 3 is a schematic explanatory diagram showing a configuration example of an electrical connection with the device.

In FIG. 2, on the upper surface of the slider body 1, that is, on the rear surface of the ABS (air bearing surface), a metal such as Au (gold) or Al connected to the magnetic head 2 for inputting and outputting recording / reproducing signals. I / O pad 1 consisting of
P is provided at a predetermined pitch of, for example, 0.1 to 0.2 [mm].

On the other hand, on the silicon bare chip substrate 4 provided with the first stage head amplifier circuit, the input / output pads 1P
An input / output pad 4P having the same pitch as that of the input / output pad 1P is provided so that the input / output pad 4P can be directly connected. Further, a connection projection 13 made of Au (gold), solder, or the like is provided at the tip of the input / output pad 4P. Further, a connection member 14 made of solder, conductive adhesive, or the like that comes into contact with the connection projection 13 is provided on the input / output pad 1P on the silicon bare chip substrate 4 side. The two input / output pads 1P and 4P, the connection projection 13 and the connection member 14 form the connection circuit 10 described above.
Is configured.

In FIG. 2, four connection circuits 10 are provided, and these are sealed with a resin or the like to form a resin layer 3. As a result, a magnetic head slider in which the magnetic head 2 and the head amplifier circuit are electrically connected directly is formed.

FIGS. 1 and 2 show a case where a magnetoresistive head is used as the magnetic head. Therefore, the number of input / output pads 1P and 11 is two for the recording head and two for the reproducing head. Although the case of four magnetic heads is exemplified, when the induction type magnetic head is used as the magnetic head 2, the total number of the input / output pads 1P and 11 may be two.

Next, the operation of the first embodiment will be described. First, magnetic information recorded on a recording medium (not shown) such as a magnetic disk is converted into a reproduction voltage signal by the magnetic head 2 and detected.

The detected reproduction signal is supplied to the head amplifier circuit in the silicon bare chip substrate 20 via the connection circuit 10 including the input / output pads 1P and 11 connected to the magnetic head 2. The reproduced signal amplified by the head amplifier circuit is transmitted from the connection terminal 5 provided on the upper surface 4A of the silicon bare chip substrate 4 to the next stage via the fine wire 9 wired on the head suspension 100. The signal is supplied to a signal processing system (not shown).

On the other hand, a recording signal supplied from a signal processing system (not shown) is
The signal is input to a head amplifier circuit provided on the silicon bare chip substrate 4 through the wired fine wire 9 and the connection terminal 5. The recording signal amplified to a predetermined level of the recording current required for recording by the head amplifier circuit is applied to the input / output pads 4P, 4P of the silicon bare chip substrate 20.
It is supplied to the magnetic head 2 via the connection circuit 10 including 1P.

This recording signal is electromagnetically converted by the magnetic head 2 and recorded as magnetic information on a recording medium (not shown).

Here, a power supply for driving the head amplifier circuit provided on the silicon bare chip substrate 4 is supplied to the silicon bare chip substrate 4 via the fine wires 9 and the connection terminals 5 wired via the suspension 100. .

Next, the effect of the first embodiment will be described.

In the first embodiment, since the magnetic head 2 and the head amplifier circuit are electrically connected by the input / output pads 4P, 1P and solder or conductive adhesive, the length of the wiring is reduced. Can be minimized to a minimum. For this reason,
It is possible to reduce the parasitic capacitance and inductance due to the wiring length, thereby suppressing the deterioration of the S / N ratio in the reproduction signal, the narrowing of the usable recording / reproduction band, and the increase of the reversal time of the recording current. Become.

Further, since the silicon bare chip substrate 4 provided with the first stage head amplifier circuit having the same dimensions as the rear surface of the slider body 1 is sealed and connected to the slider body 1 with resin or the like, connection lines and the like are formed. This eliminates the need for an extra space in consideration of the size of the magnetic head slider, which makes it possible to reduce the size of the entire magnetic head slider, thereby stabilizing the flying attitude of the entire magnetic head slider and moving the magnetic disk to a predetermined position at high speed. Becomes

Further, a head amplifier circuit can be formed as an integrated slider by separately manufacturing and directly connecting a silicon bare chip substrate 4 on a silicon substrate and a slider body 1 provided with a magnetic head 2 separately. Therefore, no special process is added. Therefore, it can be produced at low cost.

(Second Embodiment) Next, a second embodiment of the present invention will be described with reference to FIGS.

First, in FIG. 3, the second embodiment has a slider body 1 provided with a magnetic head 2 as in the case of the first embodiment described above. A silicon bare chip substrate 4 (first stage head amplifier circuit) having the same dimensions as the slider main body 1 is provided on the rear surface (the upper surface in FIG. 3). The conveyor chip substrate 4 and the magnetic head 2 are electrically connected via a connection circuit 10. The connection circuit 10 has the same configuration as the connection circuit 10 in FIG. 2 described above, and is sealed with a resin to form the resin layer 3. Thus, a magnetic head slider in which the magnetic head 2 and the head amplifier circuit are directly electrically connected is formed.

The silicon bare chip substrate 4 is composed of a recording / reproducing system recording amplifier and a first stage amplifier (a sense current supply circuit in the case of a magnetoresistive head) in advance by a thin film process. On the upper surface 4A of the silicon bare chip substrate 4 in FIG. The pad 21P is manufactured by through-hole processing or the like.

Further, in the second embodiment, a power supply and a signal processing system of the next stage and a head amplifier circuit provided on the silicon bare chip substrate 4 are provided by using a flexible printed circuit board (FPC) 28 via a suspension 100. And are configured to be connected.

Here, the flexible printed wiring board (F
The electrical connection between the PC (PC) 28 and the silicon bare chip substrate 4 (omitted in FIG. 3) will be described with reference to FIG.

FIG. 4 shows a configuration example of the electrical connection between the flexible printed wiring board (FPC) 28 and the silicon bare chip substrate 4 in the second embodiment viewed from the direction of arrow A in FIG.

In FIG. 4, Au or Al for inputting and outputting a recording / reproducing signal connected to a power supply and a next-stage signal processing circuit (not shown) is provided on the connection surface of the FPC 28 with the silicon bare chip substrate 4. At least six input / output pads 28P made of metal such as are provided at a predetermined pitch, for example, 0.1 to 0.2 [mm]. Each input / output pad 28P is provided with a connection projection 23 made of Au, solder, or the like.

On the other hand, the above-mentioned input / output pad 21P is provided on the connection surface of the silicon bare chip substrate 4 provided with the first stage head amplifier circuit with the FPC 28.

The input / output pads 21P and 2P
8P are connected to each other via a connection member 24 such as a conductive adhesive and a connection protrusion 23 attached to the tip of the connection member 8P to form a connection circuit 20, which is sealed with resin or the like to form a resin layer. Thus, the FPC 28 and the silicon bare chip substrate 4 are directly electrically connected.

Here, the case where the connection projection 23 is provided on the input / output pad 28P of the FPC 28 has been described. However, the connection projection 23 may be provided on the input / output pad 21P of the silicon bare chip substrate 4.

Next, the operation of the second embodiment (FIGS. 3 and 4) will be described.

First, the operation in which the reproduction signal from the magnetic head 2 is amplified and reaches the input / output pad 21P provided on the surface 4A opposite to the input / output pad 1P of the silicon bare chip substrate 4 is described in the first embodiment. Same as in the case.

The reproduced signal amplified by the first stage head amplifier circuit of the silicon bare chip substrate 4 is supplied from the input / output pad 21P to the connection material 24 made of solder or conductive adhesive, the connection projection 23, the input / output pad 28P, The signal is supplied to a signal processing system (not shown) of the next stage via a flexible printed wiring board (FPC) 28 provided along with the head suspension 100.

On the other hand, a recording signal supplied from a signal processing system (not shown) is transmitted from an FPC 28 provided along with the head suspension 100 to an input / output pad 28P and a connection projection 2.
3, via the connection member 24 and the input / output pad 21P, are input to the head amplifier circuit provided on the silicon bare chip substrate 4.

Here, the operation of recording data on the magnetic disk from the head amplifier circuit via the magnetic head 2 is the same as that of the first embodiment.

A power supply for driving the head amplifier circuit provided on the silicon bare chip substrate 4 is supplied from the FPC 28 provided along with the head suspension 100 via the connection circuit 20 to the head amplifier provided on the silicon bare chip substrate 4. Supplied to the circuit. Other configurations are the same as those of the above-described first embodiment.

In this case, in addition to having the same operation and effect as in the above-described first embodiment, the head suspension 100, the FPC 28, and the slider body 1 on which the head amplifier is mounted can be integrated. This also has the effect of reducing the weight and simplifying the production process.

(Third Embodiment) Next, a third embodiment will be described with reference to FIGS.

First, referring to FIG. 5, the third embodiment differs from the first embodiment in that the slider body 1 mounted on the tip end of the suspension 100 includes:
The slider body 1 includes a magnetic head (not shown) formed and mounted in a thin film on one end surface 1a. Although not shown in FIG. 5, this magnetic head is provided at the same position as the magnetic head 2 in FIG. 1 described above. A silicon bare chip substrate 34 is laminated on one end surface of the slider body 1 via a resin layer 33. On this silicon bare chip substrate 34, a head amplifier circuit (not shown) for recording and reproduction manufactured by a thin film process is provided. Then, a connection circuit 30 for directly connecting the head amplifier circuit to the above-described magnetic head is sealed in a resin and provided in the above-described resin layer 33 (see FIG. 6).

Connection circuit 30 sealed with this resin
Is similar to that of the first embodiment.

Next, the electrical connection between the slider body 1 and the silicon bare chip substrate 4 will be described with reference to FIG.
Here, FIG. 6 is a schematic explanatory view showing an electrical connection state between the slider body 1 and the silicon bare chip substrate 4 as viewed from the direction of arrow B in FIG. In the figure, the connection terminal 5 and the connection fine wire 9 are omitted.

In FIG. 6, a surface (magnetic head forming surface) 1a of the slider body 1 on which the magnetic head 2 (not shown) is provided is for inputting and outputting a recording / reproducing signal connected to the magnetic head. An input / output pad 1P made of a metal such as Au or Al is provided at a predetermined pitch, for example, 0.1
０．２0.2 [mm].

The input / output pads 1P and the input / output pads 4P provided on the silicon bare chip substrate 4 have the same structure and structure as those of the first embodiment, and the magnetic head and the head amplifier circuit are directly electrically connected. Is done.

FIG. 6 shows a case where a magneto-resistance effect type magnetic head is employed as the magnetic head.
The number of the input / output pads 1P and 4P is two for each of the recording head and the reproduction head. When the induction type magnetic head is used as the magnetic head, the input / output pads 1P and 4P are used.
P may be two in total.

As described above, the third embodiment has the same operation and effects as those of the first embodiment, and furthermore, the input / output pad pads 1P and 4P of the magnetic head are formed by forming the magnetic head of the slider body 1 on the magnetic head. Since it was provided on the surface 1a,
There is an advantage that it is not necessary to change the production process of the conventional magnetic head slider at all, and the production efficiency can be improved.

(Fourth Embodiment) Next, a fourth embodiment will be described with reference to FIGS.

The fourth embodiment shown in FIGS. 7 and 8 has a slider body 1 provided with a magnetic head (not shown) as in the case of the third embodiment described above. On the one end surface 1a of the main body 1 on which the magnetic head is provided, the silicon bare chip substrate 34 provided with the first stage head amplifier circuit and the terminal (not shown) of the magnetic head are electrically connected and sealed with resin. It has a structure. Reference numeral 33 denotes a resin layer sealed with a resin.

The above-mentioned silicon bare chip substrate 3
4, a recording / reproducing system recording amplifier and a first-stage amplifier (a sense current supply circuit or the like in the case of a magnetoresistive head) are provided in advance by a thin film process. Right end face 34A of this silicon bare chip substrate 34 in FIG.
The power supply and at least six inputs / outputs for input / output of recording / reproducing signals are connected to the power supply and the signal processing circuit system of the next stage and the first stage head amplifier circuit. The pad 21P (see FIG. 8) is manufactured by through-hole processing or the like.

In the structure of the fourth embodiment, a power supply, a signal processing system of the next stage, and a head amplifier circuit of the silicon bare chip substrate 34 (FIG. 1) are used by using a flexible printed circuit board (FPC) 38 via a suspension 100. (Not shown).

Next, the electrical connection between the FPC 38 and the silicon bare chip substrate 34 (omitted in FIG. 7) is shown in FIG.
It will be described based on.

FIG. 8 shows a schematic configuration example of the electrical connection between the flexible printed wiring board (FPC) 38 and the silicon bare chip substrate 34 as viewed from the direction of arrow B in FIG.

As shown in FIG. 8, the connection surface of the FPC 38 with the silicon bare chip substrate 34 is
As in the case of the embodiment, at least six input / output pads 3
8P are provided at a predetermined pitch, and connection projections 23 are provided respectively. Further, on the connection surface of the silicon bare chip substrate 34 with the FPC 38, there is provided a connection member 24 made of solder or a conductive adhesive or the like connected to the connection protrusion 23 via the input / output pads 21P and 38P. The input / output pads 21P and 38
The connection circuit 40 is constituted by P, the connection protrusion 23 and the connection member 24 described above.

Here, the case where the connection projection 23 is provided on the input / output pad 38P of the FPC 38 has been described. However, the case where the connection projection 23 is provided on the input / output pad 21P of the silicon bare chip substrate 34 may be used.

In the fourth embodiment, the electrical connection between the slider body 1 and the silicon bare chip substrate 34 has the same configuration as that of the above-described FIG. 6 (third embodiment). A connection circuit 30 is provided so that a signal for recording or reproduction can be smoothly transmitted. Other configurations are the same as those of the third embodiment shown in FIGS. 5 and 6 described above.

The above-described fourth embodiment has the same functions and effects as those of the above-described third embodiment. In addition, the slider body 1 on which the head suspension, the FPC 38 and the head amplifier are mounted is integrated. Therefore, it is possible to reduce the weight, and at the same time, it is possible to simplify the production process because the trouble of wiring with fine wires or the like is eliminated.

(Fifth Embodiment) Next, a fifth embodiment will be described with reference to FIGS. First, in FIG. 9, reference numeral 51 denotes a head base (slider body) provided with the magnetic head 2. This head base 51 includes
A printed board 52 is provided with an adhesive. On the printed board 52, two connection terminals 53 for soldering the fine wires 2a wound as coils on the magnetic head 2 are provided at predetermined intervals.

The silicon bare chip substrate 54 is mounted on the printed circuit board 32 via the connection circuit 10. As shown in FIG. 10, the connection circuit 50 has the same configuration as the connection circuit 50 in the first embodiment (FIG. 2) described above, and is sealed with a resin to form a resin layer 55.

The silicon bare chip substrate 54 is provided with a recording / reproducing recording amplifier and a first-stage amplifier (not shown) in advance by a thin film process. The upper surface of the silicon bare chip substrate 54 (that is, the printed board 52 described above)
54A, at least four connection terminals 5 for power supply for connecting the power supply and the next-stage signal processing circuit system to the first-stage head amplifier circuit and for input / output of recording / reproduction signals.
Are manufactured by through-hole processing or the like.

Next, the electrical connection between the input / output pads 1P provided on the printed board 52 and the silicon bare chip substrate 54 will be described.

FIG. 10 is a schematic cross section taken along the line CC in FIG. In FIG. 10, an input / output pad 1P made of a metal such as Au or Al for inputting and outputting a recording / reproducing signal connected to the magnetic head 2 is provided on the printed board 52 at a predetermined pitch, for example, 0.1 to 0.2 [m
m].

The input / output pads 1P and the input / output pads 4P of the head amplifier circuit provided on the silicon bare chip substrate 54 form a part of the connection circuit 50 as described above, and the first embodiment described above. And are directly connected electrically with the same configuration and structure. The fine wire 2a wound as a coil around the magnetic head 2 is
Is connected to the input / output pad 1P via the connection terminal 53 provided on the silicon bare chip substrate 54.

In the fifth embodiment, the silicon bare chip substrate 54 has the shape and dimensions of the head base 51 (8 [m
m] or more (about several [mm] square), so that the shape and mass of the head base alone do not greatly change. Therefore, even when the head base 51 is installed on the rotating drum, the dynamic balance of the drum is not impaired. For this reason, the fifth embodiment has the same operational effects as the first embodiment described above, and also has the advantage that the temporal fluctuation of the recording / reproducing signal can be suppressed.

[0088]

According to the present invention, the magnetic head and the head amplifier section are directly connected to each other, so that the parasitic capacitance and the inductance caused by the length of the connection wiring between the magnetic head and the head amplifier section are reduced. Therefore, it is possible to effectively reduce disturbance noise during reproduction, reduce noise, and narrow a recording / reproducing band used by a disk device equipped with the same. Therefore, not only can the decrease in the S / N ratio be suppressed, but also a high-speed recording current reversal can be ensured during recording, so that a desired magnetization reversal interval can be realized, and nonlinear distortion and the like can be reduced. An excellent magnetic head slider, which has not been achieved in the past, can ensure the reliability of a magnetic disk device equipped with a magnetic disk drive.

Further, according to the present invention, a silicon bare chip substrate having the first stage head amplifier circuit and the same size as the upper surface of the slider main body (the surface opposite to the surface facing the magnetic disk) is sealed in the slider main body with resin or the like. Since they are connected and integrated, it is possible to reduce the overall size and weight.

Further, according to the present invention, a silicon bare chip substrate in which a head amplifier circuit is previously formed on a silicon substrate, and a slider body provided with a magnetic head are separately manufactured and directly connected to each other to form an integrated type. Since the slider can be formed, the production efficiency can be improved without adding a special process, and therefore, an excellent unprecedented feature that a head / amplifier integrated type slider can be produced at low cost. A magnetic head slider can be provided.

[Brief description of the drawings]

FIG. 1 is a schematic perspective view showing a first embodiment of the present invention.

FIG. 2 is a schematic front view as seen from the direction of arrow A in FIG.

FIG. 3 is a schematic perspective view showing a second embodiment of the present invention.

FIG. 4 is a schematic front view seen from the direction of arrow A in FIG. 3;

FIG. 5 is a schematic perspective view showing a third embodiment of the present invention.

FIG. 6 is a schematic plan view seen from the direction of arrow B in FIG. 5;

FIG. 7 is a schematic perspective view showing a fourth embodiment of the present invention.

FIG. 8 is a schematic plan view partially viewed from the direction of arrow B in FIG. 7;

FIG. 9 is a plan view showing a fifth embodiment of the present invention.

FIG. 10 is a partially omitted cross-sectional view along the line CC of FIG. 9;

FIG. 11 is a perspective view showing a conventional example.

[Explanation of symbols]

 DESCRIPTION OF SYMBOLS 1 Slider main body 1a Magnetic head formation surface 1P, 4P, 21P, 28P, 38P I / O pad 2 Magnetic head 3, 3A, 33, 33A, 55 Resin layer 5 Connection terminal 9 Fine wire 13, 23 Connection projection 14, 24 Connection Member 10, 20, 30, 40, 50 Connection circuit 28, 38 Flexible printed wiring board (FPC) 51 Head base 100 Suspension 101 Magnetic disk

Claims (5)

(57) [Claims] 1. A magnetic head slider comprising: a slider body provided at a tip of a suspension; and a magnetic head provided at one end surface of the slider body, wherein the magnetic head is formed in a thin film shape. A silicon bare chip substrate is laminated on a slider body via a resin layer, and a head amplifier circuit for recording and reproduction manufactured by a thin film process is provided on the silicon bare chip substrate. The head amplifier circuit and the magnetic head A magnetic head slider, wherein a connection circuit for directly connecting the magnetic head slider is provided in the resin layer. 2. A magnetic head slider comprising: a slider main body mounted on a tip end of a suspension; and a magnetic head mounted on one end surface of the slider main body, wherein the magnetic head is formed in a thin film shape. On the surface of the slider body opposite to the slider floating surface,
A silicon bare chip substrate is laminated via a resin layer, and a head amplifier circuit for recording / reproducing manufactured by a thin film process is provided on the silicon bare chip substrate, and the head amplifier circuit is directly connected to the magnetic head. A magnetic head slider, wherein a connection circuit is provided in the resin layer. 3. A magnetic head slider comprising: a slider main body mounted on a tip end of a suspension; and a magnetic head mounted on one end surface of the slider main body, wherein the magnetic head is formed in a thin film shape. On one end surface of the slider body, a silicon bare chip substrate is laminated via a resin layer, and a head amplifier circuit for recording and reproduction manufactured by a thin film process is provided on the silicon bare chip substrate. A magnetic head slider, wherein a connection circuit for directly connecting to a magnetic head is provided in the resin layer. 4. The one connection circuit provided on both sides of the resin layer corresponding to the input wiring of the head amplifier circuit on the silicon bare chip substrate side and the magnetic head wiring on the slider body side, respectively. 2. A structure according to claim 1, wherein said conductive pad is constituted by a projection made of a conductive member connecting said conductive pads and a direct member.
4. The magnetic head slider according to 2 or 3. 5. The suspension according to claim 1, further comprising a flexible printed wiring board for connecting the head amplifier circuit on the silicon bare chip substrate side to a signal processing system and a control system disposed outside. 5. The magnetic head slider according to 2, 3, or 4.