JPS60137046A - 発光素子または受光素子封止体 - Google Patents

発光素子または受光素子封止体

Info

Publication number
JPS60137046A
JPS60137046A JP59231815A JP23181584A JPS60137046A JP S60137046 A JPS60137046 A JP S60137046A JP 59231815 A JP59231815 A JP 59231815A JP 23181584 A JP23181584 A JP 23181584A JP S60137046 A JPS60137046 A JP S60137046A
Authority
JP
Japan
Prior art keywords
light
epoxy resin
parts
curing
weight
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP59231815A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6262058B2 (enrdf_load_stackoverflow
Inventor
Toru Nishimura
徹 西村
Katsumi Shimada
嶋田　克実
Kazuo Iko
伊香　和夫
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Nitto Denko Corp
Original Assignee
Nitto Electric Industrial Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Nitto Electric Industrial Co Ltd filed Critical Nitto Electric Industrial Co Ltd
Priority to JP59231815A priority Critical patent/JPS60137046A/ja
Publication of JPS60137046A publication Critical patent/JPS60137046A/ja
Publication of JPS6262058B2 publication Critical patent/JPS6262058B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10F—INORGANIC SEMICONDUCTOR DEVICES SENSITIVE TO INFRARED RADIATION, LIGHT, ELECTROMAGNETIC RADIATION OF SHORTER WAVELENGTH OR CORPUSCULAR RADIATION
    • H10F77/00—Constructional details of devices covered by this subclass
    • H10F77/50—Encapsulations or containers

Landscapes

  • Light Receiving Elements (AREA)
  • Epoxy Resins (AREA)
  • Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
  • Led Device Packages (AREA)
  • Led Devices (AREA)
JP59231815A 1984-11-02 1984-11-02 発光素子または受光素子封止体 Granted JPS60137046A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP59231815A JPS60137046A (ja) 1984-11-02 1984-11-02 発光素子または受光素子封止体

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP59231815A JPS60137046A (ja) 1984-11-02 1984-11-02 発光素子または受光素子封止体

Related Parent Applications (1)

Application Number Title Priority Date Filing Date
JP12584779A Division JPS5649726A (en) 1979-09-29 1979-09-29 Epoxy resin composition having excellent transparency for casting

Publications (2)

Publication Number Publication Date
JPS60137046A true JPS60137046A (ja) 1985-07-20
JPS6262058B2 JPS6262058B2 (enrdf_load_stackoverflow) 1987-12-24

Family

ID=16929453

Family Applications (1)

Application Number Title Priority Date Filing Date
JP59231815A Granted JPS60137046A (ja) 1984-11-02 1984-11-02 発光素子または受光素子封止体

Country Status (1)

Country Link
JP (1) JPS60137046A (enrdf_load_stackoverflow)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0466950B1 (en) * 1990-07-16 1998-10-07 Nitto Denko Corporation Method for producing an epoxy resin composition for use in molding photosemiconductor
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6617400B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst

Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5121680A (ja) * 1974-08-19 1976-02-20 Mitsubishi Heavy Ind Ltd Kisosochi
JPS51129499A (en) * 1975-04-04 1976-11-11 Hitachi Chem Co Ltd Epoxy resin composition

Patent Citations (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5121680A (ja) * 1974-08-19 1976-02-20 Mitsubishi Heavy Ind Ltd Kisosochi
JPS51129499A (en) * 1975-04-04 1976-11-11 Hitachi Chem Co Ltd Epoxy resin composition

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
EP0466950B1 (en) * 1990-07-16 1998-10-07 Nitto Denko Corporation Method for producing an epoxy resin composition for use in molding photosemiconductor
US6617401B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition comprising cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride curing agent and boron catalyst
US6617400B2 (en) * 2001-08-23 2003-09-09 General Electric Company Composition of cycloaliphatic epoxy resin, anhydride curing agent and boron catalyst
US6809162B2 (en) * 2001-08-23 2004-10-26 General Electric Company Solid state device with encapsulant of cycloaliphatic epoxy resin, 4-methylhexahydrophthalic anhydride and boron catalyst
US6878783B2 (en) * 2001-08-23 2005-04-12 General Electric Company Solid state device with encapsulant of cycloaliphatic epoxy resin, anhydride, and boron catalyst

Also Published As

Publication number Publication date
JPS6262058B2 (enrdf_load_stackoverflow) 1987-12-24

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