JPS60137032A - ワイヤボンデイング装置 - Google Patents

ワイヤボンデイング装置

Info

Publication number
JPS60137032A
JPS60137032A JP58246141A JP24614183A JPS60137032A JP S60137032 A JPS60137032 A JP S60137032A JP 58246141 A JP58246141 A JP 58246141A JP 24614183 A JP24614183 A JP 24614183A JP S60137032 A JPS60137032 A JP S60137032A
Authority
JP
Japan
Prior art keywords
wire
bonding
bonding wire
tension
magnetic field
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58246141A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0564461B2 (enExample
Inventor
Nobushi Suzuki
鈴木　悦四
Tomio Kashihara
富雄 樫原
Masayoshi Yamaguchi
政義 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Toshiba Corp
Original Assignee
Toshiba Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Toshiba Corp filed Critical Toshiba Corp
Priority to JP58246141A priority Critical patent/JPS60137032A/ja
Publication of JPS60137032A publication Critical patent/JPS60137032A/ja
Publication of JPH0564461B2 publication Critical patent/JPH0564461B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H59/00—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators
    • B65H59/10—Adjusting or controlling tension in filamentary material, e.g. for preventing snarling; Applications of tension indicators by devices acting on running material and not associated with supply or take-up devices
    • B65H59/20—Co-operating surfaces mounted for relative movement
    • B65H59/22—Co-operating surfaces mounted for relative movement and arranged to apply pressure to material
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B65—CONVEYING; PACKING; STORING; HANDLING THIN OR FILAMENTARY MATERIAL
    • B65H—HANDLING THIN OR FILAMENTARY MATERIAL, e.g. SHEETS, WEBS, CABLES
    • B65H2553/00—Sensing or detecting means
    • B65H2553/20—Sensing or detecting means using electric elements
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/0711—Apparatus therefor
    • H10W72/07141—Means for applying energy, e.g. ovens or lasers
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W72/00—Interconnections or connectors in packages
    • H10W72/071—Connecting or disconnecting
    • H10W72/075—Connecting or disconnecting of bond wires
    • H10W72/07502—Connecting or disconnecting of bond wires using an auxiliary member
    • H—ELECTRICITY
    • H10—SEMICONDUCTOR DEVICES; ELECTRIC SOLID-STATE DEVICES NOT OTHERWISE PROVIDED FOR
    • H10W—GENERIC PACKAGES, INTERCONNECTIONS, CONNECTORS OR OTHER CONSTRUCTIONAL DETAILS OF DEVICES COVERED BY CLASS H10
    • H10W90/00—Package configurations
    • H10W90/701—Package configurations characterised by the relative positions of pads or connectors relative to package parts
    • H10W90/751—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires
    • H10W90/756—Package configurations characterised by the relative positions of pads or connectors relative to package parts of bond wires between a chip and a stacked lead frame, conducting package substrate or heat sink

Landscapes

  • Wire Bonding (AREA)
JP58246141A 1983-12-26 1983-12-26 ワイヤボンデイング装置 Granted JPS60137032A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58246141A JPS60137032A (ja) 1983-12-26 1983-12-26 ワイヤボンデイング装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58246141A JPS60137032A (ja) 1983-12-26 1983-12-26 ワイヤボンデイング装置

Publications (2)

Publication Number Publication Date
JPS60137032A true JPS60137032A (ja) 1985-07-20
JPH0564461B2 JPH0564461B2 (enExample) 1993-09-14

Family

ID=17144088

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58246141A Granted JPS60137032A (ja) 1983-12-26 1983-12-26 ワイヤボンデイング装置

Country Status (1)

Country Link
JP (1) JPS60137032A (enExample)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909431A (en) * 1988-05-18 1990-03-20 Emanuele Japichino Method and apparatus for preparing a bonding wire

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4909431A (en) * 1988-05-18 1990-03-20 Emanuele Japichino Method and apparatus for preparing a bonding wire

Also Published As

Publication number Publication date
JPH0564461B2 (enExample) 1993-09-14

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