JPS60136175U - Overcoat glass for hybrid integrated circuit manufacturing - Google Patents
Overcoat glass for hybrid integrated circuit manufacturingInfo
- Publication number
- JPS60136175U JPS60136175U JP2170084U JP2170084U JPS60136175U JP S60136175 U JPS60136175 U JP S60136175U JP 2170084 U JP2170084 U JP 2170084U JP 2170084 U JP2170084 U JP 2170084U JP S60136175 U JPS60136175 U JP S60136175U
- Authority
- JP
- Japan
- Prior art keywords
- overcoat glass
- aperture
- hybrid integrated
- active element
- integrated circuit
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来のオーバコートグラスの概略平面図、□第
2図は本考案に係るオーバコートグラスの一実施例の概
略平面図、第3図は同じく能動素子の実装状態を示す要
部の断面図である。
10・・・オーバコートグラス、11・・・能動素子、
12・・・リード端子、13・・・窓開は部、14・・
・半田ペースト、15・・・受動素子回路基板。Fig. 1 is a schematic plan view of a conventional overcoat glass, □ Fig. 2 is a schematic plan view of an embodiment of the overcoat glass according to the present invention, and Fig. 3 is a schematic plan view of an embodiment of the overcoat glass according to the present invention. FIG. 10... Overcoat glass, 11... Active element,
12...Lead terminal, 13...Window opening, 14...
-Solder paste, 15...Passive element circuit board.
Claims (1)
ラスの所定位置にミニモールドタイプの能動素子のリー
ド端子と対向する窓開は部を形成し、該窓開は部に被着
した半田ペーストの上面に前記能動素子のリード端子を
重合させてこれらを恒温槽に収容することにより、前記
半田ペーストを溶融させて前記能動素子のリード端子を
前記骨′ 動素子回路基板に半田付は固定した混成集積
回路において、前記オーバコートグラスに形成された窓
開は部を、該窓開は部の並列方向内側の辺を直線状にす
ると共に、少な(とも隣接する窓開は部側の辺を曲線で
構成した孔で形成したことを特徴とする混成集積回、路
製造用オーバコートグラス。A window opening facing the lead terminal of the mini-mold type active element is formed in a predetermined position of the overcoat glass overlaid on the surface of the passive element circuit board, and the window opening is formed on the upper surface of the solder paste adhered to the part. By polymerizing the lead terminals of the active element and placing them in a constant temperature bath, the solder paste is melted and the lead terminal of the active element is soldered and fixed to the bone motion element circuit board. In the circuit, the apertures formed in the overcoat glass are arranged so that the inner side of the aperture in the parallel direction of the aperture is a straight line, and the side of the aperture formed in the overcoat glass is a curved line. An overcoat glass for manufacturing hybrid integrated circuits and circuits, characterized in that it is formed with structured holes.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2170084U JPS60136175U (en) | 1984-02-20 | 1984-02-20 | Overcoat glass for hybrid integrated circuit manufacturing |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP2170084U JPS60136175U (en) | 1984-02-20 | 1984-02-20 | Overcoat glass for hybrid integrated circuit manufacturing |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60136175U true JPS60136175U (en) | 1985-09-10 |
JPH0419825Y2 JPH0419825Y2 (en) | 1992-05-06 |
Family
ID=30513331
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP2170084U Granted JPS60136175U (en) | 1984-02-20 | 1984-02-20 | Overcoat glass for hybrid integrated circuit manufacturing |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60136175U (en) |
Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5315047U (en) * | 1976-07-20 | 1978-02-08 | ||
JPS5780791A (en) * | 1980-11-07 | 1982-05-20 | Matsushita Electric Ind Co Ltd | Wiring circuit device |
Family Cites Families (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
US3940432A (en) * | 1973-06-19 | 1976-02-24 | Union Carbide Corporation | Process for making ethylene glycol |
-
1984
- 1984-02-20 JP JP2170084U patent/JPS60136175U/en active Granted
Patent Citations (2)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS5315047U (en) * | 1976-07-20 | 1978-02-08 | ||
JPS5780791A (en) * | 1980-11-07 | 1982-05-20 | Matsushita Electric Ind Co Ltd | Wiring circuit device |
Also Published As
Publication number | Publication date |
---|---|
JPH0419825Y2 (en) | 1992-05-06 |
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