JPS60127085A - Laser working device - Google Patents

Laser working device

Info

Publication number
JPS60127085A
JPS60127085A JP58233925A JP23392583A JPS60127085A JP S60127085 A JPS60127085 A JP S60127085A JP 58233925 A JP58233925 A JP 58233925A JP 23392583 A JP23392583 A JP 23392583A JP S60127085 A JPS60127085 A JP S60127085A
Authority
JP
Japan
Prior art keywords
laser
working
processing
speed
region
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58233925A
Other languages
Japanese (ja)
Other versions
JPS6322918B2 (en
Inventor
Shigeru Takagi
茂 高木
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Mitsubishi Electric Corp
Original Assignee
Mitsubishi Electric Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Mitsubishi Electric Corp filed Critical Mitsubishi Electric Corp
Priority to JP58233925A priority Critical patent/JPS60127085A/en
Publication of JPS60127085A publication Critical patent/JPS60127085A/en
Publication of JPS6322918B2 publication Critical patent/JPS6322918B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01SDEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
    • H01S3/00Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
    • H01S3/10Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating

Landscapes

  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Engineering & Computer Science (AREA)
  • Plasma & Fusion (AREA)
  • Optics & Photonics (AREA)
  • Laser Beam Processing (AREA)

Abstract

PURPOSE:To eliminate the working defect in a low speed region and to improve working accuracy by providing a control means for detecting a working speed and compensating a laser output in the region where the working speed is low. CONSTITUTION:The speeds Vx, Vy in the X-axis and Y-axis direction of a working table are detected in an arithmetic circuit 1 for vector and the vector speed is calculated in the stage of laser working. A non-linear amplifier 2 controls a laser oscillator 3 so as to compensate the laser output to be lost by the heat radiation in the stage of working in the region where the working speed is lower than a preset value in accordance with said signal. Inconveniences in working such as a decrease in cutting width in the low speed region and deterioration in surface roughness are eliminated by the control of the laser oscillator 3.

Description

【発明の詳細な説明】 〈発明の技術分野〉 本発明はレーザ加工装置に関し、特に、加工精度を向上
させる技術に関する。
DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a laser processing apparatus, and particularly to a technique for improving processing accuracy.

〈従来技術〉 この種のレーザ加工装置は、レーザ発振器から発振され
るレーザビームを加工物に照射して、該加工物を切断等
加工するものである。
<Prior Art> This type of laser processing apparatus irradiates a workpiece with a laser beam emitted from a laser oscillator to perform cutting or other processing on the workpiece.

かかるレーザ加工装置は熱加工であるため、加工物に最
適な入熱コントロールを行わないと、切断を行うもので
は切断中が変化し、加工精度を落すことになる。
Since such laser processing equipment performs thermal processing, unless optimal heat input control is performed on the workpiece, the cutting process will change during cutting, resulting in a decrease in processing accuracy.

従来は第1図に示すグラフのように加工テーブルの能力
からくる加工速度の変化に対し、加工速度に比例してレ
ーザ出力をコントロールしていた。
Conventionally, as shown in the graph shown in Figure 1, the laser output was controlled in proportion to the machining speed, in response to changes in the machining speed caused by the capacity of the machining table.

従来のレーザ加工装置は以上のようにレーザ出力のコン
トロールを行っているが、加工速度の小さい領域例えば
0.5m10以下の領域においては投入されたレーザ出
力のうち大部分が伝熱により放散し、切断に寄与するレ
ーザ出力分はごく限られたものとなってしまう。従って
、加工速度の低速領域においては切断中が狭くなったり
、面粗さが悪くなるという欠点があった。
Conventional laser processing equipment controls the laser output as described above, but in regions where the processing speed is low, for example, 0.5 m10 or less, most of the input laser power is dissipated due to heat transfer. The amount of laser output that contributes to cutting is extremely limited. Therefore, in the low processing speed range, there is a drawback that the cutting area becomes narrow and the surface roughness deteriorates.

〈発明の概要〉 そこで、本発明は以上のような従来の実情に鑑み、加工
速度の小さい領域においては、加工時の熱放散で失われ
るレーザ出力を補うようなレーザ出力を得るべくレーザ
出力を制御する構成により、加工精度を向上することを
目的とするものである。
<Summary of the Invention> Therefore, in view of the above-mentioned conventional situation, the present invention has been developed to increase the laser output in a region where the processing speed is low in order to obtain a laser output that compensates for the laser power lost due to heat dissipation during processing. The purpose is to improve machining accuracy by controlling the configuration.

〈発明の実施例〉 以下、本発明の一実施例を第2図〜第4図に基づいて説
明する。
<Embodiment of the Invention> Hereinafter, an embodiment of the present invention will be described based on FIGS. 2 to 4.

第2図において、1は加工速度を検出する加工速度検出
手段としてのベクトル演算回路で、レーザ加工装置の図
示しない加工テーブルのX軸方向。
In FIG. 2, reference numeral 1 denotes a vector calculation circuit as a machining speed detection means for detecting machining speed in the X-axis direction of a machining table (not shown) of the laser machining device.

Y軸方向の速度VX、Vyを検出し、ベクトル速度v=
へ−I「v7を演算する。2はベクトル演算回路1から
の信号に基づき、加工速度がプリセット値よシも小さい
領域において加工時の熱放射で失われるレーザ出力を補
うようなレーザ出力に後述のレーザ発振器を制御するレ
ーザ出力制御装置としての非線形増巾器で、第3図に示
すグラフのようにプリセット値の点で非線形になる特性
を有している。3はレーザ発振器で、前記非線形増巾器
2の信号に応じてレーザ出力をコントロールする。
Detect the velocities VX and Vy in the Y-axis direction, and calculate the vector velocity v=
2 is based on the signal from the vector calculation circuit 1, and calculates the laser output to compensate for the laser output lost due to heat radiation during processing in a region where the processing speed is lower than the preset value. 3 is a nonlinear amplifier as a laser output control device that controls a laser oscillator, and has a characteristic of becoming nonlinear at a preset value as shown in the graph shown in Figure 3. 3 is a laser oscillator, and the nonlinear amplifier The laser output is controlled according to the signal from the amplifier 2.

以上の構成によシ加工速度に対するレーザ出力は第4図
に示すような関係にコントロールされる。
With the above configuration, the laser output with respect to the machining speed is controlled to have the relationship shown in FIG. 4.

尚、前記加工速度のプリセット値は例えば0.5mA+
以下に設定するようにする。
Note that the preset value of the processing speed is, for example, 0.5 mA+
Set as below.

かかる構成によれば、加工速度が例えば0.5r+J以
下の領域において、レーザ出力を所定の一定値に保持す
るようにして、加工時の熱放散で失われるレーザ出力を
補うようにしたから、従来のように低速領域で切断中が
狭くなったり、面粗さが悪くなるというような加工上の
不都合を解消でき、精度の高い加工を行うことができる
According to this configuration, the laser output is maintained at a predetermined constant value in a region where the processing speed is, for example, 0.5r+J or less to compensate for the laser output lost due to heat dissipation during processing. It is possible to eliminate processing problems such as the narrow cutting area and poor surface roughness in the low speed range, and it is possible to perform highly accurate processing.

尚、上記の実施例においては、加工速度がプリセット値
よシも小さい領域において、レーザ出力を加工速度に対
して一定に制御するように構成したが、レーザ出力を加
工速度に対して増加するように制御するようにしても良
い。
In the above embodiment, the laser output was controlled to be constant with respect to the machining speed in a region where the machining speed was smaller than the preset value, but the laser output was controlled to be constant with respect to the machining speed. It may also be controlled to.

又、レーザ出力のコントロールは連続波でもパルスでも
同様の効果を奏する。
Furthermore, controlling the laser output produces the same effect whether it is a continuous wave or a pulse.

〈発明の効果〉 以上説明したように本発明によれば、加工速度の小さい
領域において、加工時の熱放散で失われるレーザ出力を
補うような?−ザ出力にレーザ発振器を制御するように
したから、加工速度の小さい領域でレーザエネルギが減
少することによる欠点を解消でき、加工精度を向上する
ことができる。
<Effects of the Invention> As explained above, according to the present invention, in a region where the processing speed is low, the laser power that is lost due to heat dissipation during processing can be compensated for. - Since the laser oscillator is controlled according to the laser output, it is possible to eliminate the drawbacks caused by the decrease in laser energy in the region where the processing speed is low, and it is possible to improve the processing accuracy.

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来のレーザ加工装置における加工速度とレー
ザ出力の関係を示すグラフ、第2図は本発明に係るレー
ザ加工装置の一実施例を示すブロック図、第3図は同上
実施例における非線形増巾器の特性を示すグラフ、第4
図は同上実施例における加工速度とレーザ出力の関係を
示すグラフである。 1・・・ベクトル演算回路 2・・・非線形増巾器3・
・・レーザ発振器 代理人 大岩増雄(ほか2名)
Fig. 1 is a graph showing the relationship between processing speed and laser output in a conventional laser processing device, Fig. 2 is a block diagram showing an embodiment of the laser processing device according to the present invention, and Fig. 3 is a nonlinear diagram in the same embodiment. Graph showing characteristics of amplifier, 4th
The figure is a graph showing the relationship between processing speed and laser output in the same example. 1... Vector calculation circuit 2... Nonlinear amplifier 3.
...Laser oscillator agent Masuo Oiwa (and 2 others)

Claims (1)

【特許請求の範囲】 (1)レーザ発振器から発振されるレーザビームを加工
物に照射して、該加工物を加工するレーザ加工装置にお
じで、加工速度を検出する加工速度検出手段と、該加工
速度検出手段からの信号に基づき、加工速度がプリセッ
ト値よりも小さい領域において加工時の熱放散で失われ
るレーザ出力を補うようなレーザ出力にレーザ発振器を
制御するレーザ出力制御装置と、を設けたことを特徴と
するレーザ加工装置。 ■)レーザ出力制御装置は、加工速度がプリセント値よ
シも小さい領域において、レーザ出力を加工速度に対し
て一定に制御するように構成されてなる特許請求の範囲
第1項記載のレーザ加工装置。 (3)レーザ出力制御装置は、加工速度がブリセント値
よυも小さい領域において、レーザ出力を加工速度に対
して増加させるように制御する構成である特許請求の範
囲第1項記載のレーザ加工装置。 (4)加工速度のプリセット値を0.5 m序以下に設
定したことを特徴とする特許請求の範囲第1項〜第3項
のいずれか1つに記載のレーザ加工装置。
[Scope of Claims] (1) Processing speed detection means for detecting the processing speed in a laser processing device that processes the workpiece by irradiating the workpiece with a laser beam emitted from a laser oscillator; A laser output control device is provided, which controls the laser oscillator to output a laser that compensates for laser output lost due to heat dissipation during processing in a region where the processing speed is lower than a preset value based on a signal from the processing speed detection means. A laser processing device characterized by: (2) The laser processing apparatus according to claim 1, wherein the laser output control device is configured to control the laser output to a constant value with respect to the processing speed in a region where the processing speed is smaller than the precent value. . (3) The laser processing apparatus according to claim 1, wherein the laser output control device is configured to control the laser output to increase with respect to the processing speed in a region where the processing speed is smaller than the Bricent value by υ. . (4) The laser processing apparatus according to any one of claims 1 to 3, wherein the preset value of the processing speed is set to 0.5 m or less.
JP58233925A 1983-12-12 1983-12-12 Laser working device Granted JPS60127085A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP58233925A JPS60127085A (en) 1983-12-12 1983-12-12 Laser working device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP58233925A JPS60127085A (en) 1983-12-12 1983-12-12 Laser working device

Publications (2)

Publication Number Publication Date
JPS60127085A true JPS60127085A (en) 1985-07-06
JPS6322918B2 JPS6322918B2 (en) 1988-05-13

Family

ID=16962747

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58233925A Granted JPS60127085A (en) 1983-12-12 1983-12-12 Laser working device

Country Status (1)

Country Link
JP (1) JPS60127085A (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5992190A (en) * 1982-11-15 1984-05-28 Amada Co Ltd Laser working device

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5992190A (en) * 1982-11-15 1984-05-28 Amada Co Ltd Laser working device

Also Published As

Publication number Publication date
JPS6322918B2 (en) 1988-05-13

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