JPS6322918B2 - - Google Patents
Info
- Publication number
- JPS6322918B2 JPS6322918B2 JP58233925A JP23392583A JPS6322918B2 JP S6322918 B2 JPS6322918 B2 JP S6322918B2 JP 58233925 A JP58233925 A JP 58233925A JP 23392583 A JP23392583 A JP 23392583A JP S6322918 B2 JPS6322918 B2 JP S6322918B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- laser output
- processing
- processing speed
- speed
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
- 238000001514 detection method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000003754 machining Methods 0.000 description 19
- 230000017525 heat dissipation Effects 0.000 description 5
- 238000010586 diagram Methods 0.000 description 2
- 230000000694 effects Effects 0.000 description 2
- 230000003746 surface roughness Effects 0.000 description 2
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
〈発明の技術分野〉
本発明はレーザ加工装置に関し、特に、加工精
度を向上させる技術に関する。DETAILED DESCRIPTION OF THE INVENTION Technical Field of the Invention The present invention relates to a laser processing apparatus, and particularly to a technique for improving processing accuracy.
〈従来技術〉
この種のレーザ加工装置は、レーザ発振器から
発振されるレーザビームを加工物に照射して、該
加工物を切断等加工するものである。<Prior Art> This type of laser processing apparatus irradiates a workpiece with a laser beam emitted from a laser oscillator to perform cutting or other processing on the workpiece.
かかるレーザ加工装置は熱加工であるため、加
工物に最適な入熱コントロールを行わないと、切
断を行うものでは切断巾が変化し、加工精度を落
すことになる。 Since such a laser processing device performs thermal processing, unless optimal heat input control is performed on the workpiece, the cutting width of the device that performs cutting will change, reducing processing accuracy.
従来は第１図に示すグラフのように加工テーブ
ルの能力からくる加工速度の変化に対し、加工速
度に比例してレーザ出力をコントロールしてい
た。 Conventionally, as shown in the graph shown in Figure 1, the laser output was controlled in proportion to the machining speed in response to changes in the machining speed caused by the capacity of the machining table.
従来のレーザ加工装置は以上のようにレーザ出
力のコントロールを行つているが、加工速度の小
さい領域例えば0.5ｍ／分以下の領域においては
投入されたレーザ出力のうち大部分が伝熱により
放散し、切断に寄与するレーザ出力分はごく限ら
れたものとなつてしまう。従つて、加工速度の低
速領域においては切断巾が狭くなつたり、面粗さ
が悪くなるという欠点があつた。 Conventional laser processing equipment controls the laser output as described above, but in regions where the processing speed is low, for example 0.5 m/min or less, most of the input laser power is dissipated by heat transfer. , the laser output that contributes to cutting is extremely limited. Therefore, there are disadvantages in that the cutting width becomes narrow and the surface roughness deteriorates in the low processing speed range.
〈発明の概要〉
そこで、本発明は以上のような従来の実情に鑑
み、加工速度の小さい領域においては、加工時の
熱放散で失われるレーザ出力を補うようなレーザ
出力を得るべくレーザ出力を制御する構成によ
り、加工精度を向上することを目的とするもので
ある。<Summary of the Invention> Therefore, in view of the above-mentioned conventional situation, the present invention aims to increase the laser output in a region where the processing speed is low in order to obtain a laser output that compensates for the laser power lost due to heat dissipation during processing. The purpose is to improve machining accuracy by controlling the configuration.
〈発明の実施例〉
以下、本発明の一実施例を第２図〜第４図に基
づいて説明する。<Embodiment of the Invention> Hereinafter, an embodiment of the present invention will be described based on FIGS. 2 to 4.
第２図において、１は加工速度を検出する加工
速度検出手段としてのベクトル演算回路で、レー
ザ加工装置の図示しない加工テーブルのＸ軸方
向、Ｙ軸方向の速度Vx，Vyを検出し、ベクトル
速度Ｖ＝√2＋2を演算する。２はベクトル
演算回路１からの信号に基づき、加工速度のプリ
セツト値において加工速度とレーザ出力の関係が
非連続変化しかつプリセツト値より小さい領域に
おいて加工時の熱放散で失なわれるレーザ出力を
補うべくプリセツト値より大きい領域における加
工速度とレーザ出力の関係よりも加工速度に対す
るレーザ出力が大きくなるよう後述のレーザ発振
器を制御するレーザ出力制御装置としての非線形
増巾器で、第３図に示すグラフのようにプリセツ
ト値の点で非線形になる特性を有している。３は
レーザ発振器で、前記非線形増巾器２の信号に応
じてレーザ出力をコントロールする。 In FIG. 2, reference numeral 1 denotes a vector calculation circuit as a machining speed detection means for detecting the machining speed, which detects the velocities Vx and Vy in the X-axis direction and Y-axis direction of the machining table (not shown) of the laser processing device, and detects the vector velocity. Calculate V=√ 2 + 2 . 2 compensates for the laser output lost due to heat dissipation during machining in a region where the relationship between machining speed and laser output changes discontinuously at the preset value of the machining speed and is smaller than the preset value, based on the signal from the vector calculation circuit 1. This is a nonlinear amplifier as a laser output control device that controls a laser oscillator, which will be described later, so that the laser output with respect to the machining speed is larger than the relationship between the machining speed and the laser output in a region larger than the preset value. It has the characteristic of becoming non-linear at the preset value as shown in FIG. 3 is a laser oscillator, which controls laser output according to the signal from the nonlinear amplifier 2;
以上の構成により加工速度に対するレーザ出力
は第４図に示すような関係にコントロールされ
る。 With the above configuration, the laser output with respect to the processing speed is controlled to have the relationship shown in FIG. 4.
この場合、プリセツト値以上の特性は、従来通
り比例関係にある（速度零の時のパワーは零でな
くともよい）。又、プリセツト値以下の特性は熱
放散分のエネルギーを補正するため理想直線（点
線部）にさらにエネルギーを加えたア〜ウのいず
れかの直線とするような制御となる。 In this case, the characteristics above the preset value have a proportional relationship as before (the power at zero speed does not have to be zero). Furthermore, for characteristics below the preset value, control is performed such that the ideal straight line (dotted line) is set to one of the straight lines A to C, which is obtained by adding more energy to the ideal straight line (dotted line) in order to correct the energy for heat dissipation.
尚、前記加工速度のプリセツト値は例えば0.5
ｍ／分以下に設定するようにする。 The preset value of the machining speed is, for example, 0.5.
Make sure to set it to less than m/min.
かかる構成によれば、加工速度が例えば0.5
ｍ／分以下の領域において、このプリセツト値よ
り大きい領域における加工速度とレーザ出力の関
係よりも加工速度に対するレーザ出力が大きくな
るようにして、加工時の熱放散で失われるレーザ
出力を補うようにしたから、従来のように低速領
域で切断巾が狭くなつたり、面粗さが悪くなると
いうような加工上の不都合を解消でき、精度の高
い加工を行うことができる。 According to this configuration, the machining speed is, for example, 0.5
In the region below m/min, the laser output relative to the machining speed is set to be larger than the relationship between the machining speed and the laser output in the region greater than this preset value, thereby compensating for the laser power lost due to heat dissipation during machining. Therefore, it is possible to eliminate the conventional problems in machining such as narrow cutting width and poor surface roughness in the low speed range, and it is possible to perform highly accurate machining.
又、レーザ出力のコントロールは連続波でもパ
ルスでも同様の効果を奏する。 Furthermore, controlling the laser output produces the same effect whether it is a continuous wave or a pulse.
〈発明の効果〉
以上説明したように本発明によれば、加工速度
の小さい領域において、加工時の熱放散で失われ
るレーザ出力を補うようなレーザ出力にレーザ発
振器を制御するようにしたから、加工速度の小さ
い領域でレーザエネルギが減少することによる欠
点を解消でき、加工精度を向上することができ
る。<Effects of the Invention> As explained above, according to the present invention, the laser oscillator is controlled to a laser output that compensates for the laser output lost due to heat dissipation during processing in a region where the processing speed is low. It is possible to eliminate the drawbacks caused by a decrease in laser energy in a region where the processing speed is low, and to improve processing accuracy.
第１図は従来のレーザ加工装置における加工速
度とレーザ出力の関係を示すグラフ、第２図は本
発明に係るレーザ加工装置の一実施例を示すブロ
ツク図、第３図は同上実施例における非線形増巾
器の特性を示すグラフ、第４図は同上実施例にお
ける加工速度とレーザ出力の関係を示すグラフで
ある。
１…ベクトル演算回路、２…非線形増巾器、３
…レーザ発振器。
Fig. 1 is a graph showing the relationship between processing speed and laser output in a conventional laser processing device, Fig. 2 is a block diagram showing an embodiment of the laser processing device according to the present invention, and Fig. 3 is a nonlinear diagram in the same embodiment. FIG. 4 is a graph showing the characteristics of the amplifier, and is a graph showing the relationship between processing speed and laser output in the same embodiment. 1... Vector calculation circuit, 2... Nonlinear amplifier, 3
...Laser oscillator.
Claims (1)
加工物に照射して、該加工物を加工するレーザ加
工装置において、加工速度を検出する加工速度検
出手段と、該加工速度検出手段からの信号に基づ
き、加工速度がプリセツト値において加工速度と
レーザ出力の関係が非連続変化し、かつプリセツ
ト値より小さい領域においてプリセツト値より大
きい領域における加工速度とレーザ出力の関係よ
りも加工速度に対するレーザ出力が大きくなるよ
うレーザ発振器を制御するレーザ出力制御装置
と、を設けたことを特徴とするレーザ加工装置。 ２ レーザ出力制御装置は、加工速度がプリセツ
ト値よりも小さい領域において、レーザ出力を加
工速度に対して一定に制御するように構成されて
なる特許請求の範囲第１項記載のレーザ加工装
置。 ３ レーザ出力制御装置は、加工速度がプリセツ
ト値よりも小さい領域において、レーザ出力を加
工速度に対して増加させるように制御する構成で
ある特許請求の範囲第１項記載のレーザ加工装
置。 ４ 加工速度のプリセツト値を0.5ｍ／分以下に
設定したことを特徴とする特許請求の範囲第１項
〜第３項のいずれか１つに記載のレーザ加工装
置。[Claims] 1. In a laser processing apparatus that processes a workpiece by irradiating the workpiece with a laser beam emitted from a laser oscillator, a processing speed detection means for detecting a processing speed; and the processing speed detection means Based on the signal from A laser processing device comprising: a laser output control device that controls a laser oscillator to increase laser output. 2. The laser processing apparatus according to claim 1, wherein the laser output control device is configured to control the laser output to be constant with respect to the processing speed in a region where the processing speed is smaller than a preset value. 3. The laser processing apparatus according to claim 1, wherein the laser output control device is configured to control the laser output to increase with respect to the processing speed in a region where the processing speed is smaller than a preset value. 4. The laser processing apparatus according to any one of claims 1 to 3, wherein a preset value of the processing speed is set to 0.5 m/min or less.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58233925A JPS60127085A (en) | 1983-12-12 | 1983-12-12 | Laser working device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58233925A JPS60127085A (en) | 1983-12-12 | 1983-12-12 | Laser working device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60127085A JPS60127085A (en) | 1985-07-06 |
| JPS6322918B2 true JPS6322918B2 (en) | 1988-05-13 |
Family
ID=16962747
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58233925A Granted JPS60127085A (en) | 1983-12-12 | 1983-12-12 | Laser working device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60127085A (en) |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992190A (en) * | 1982-11-15 | 1984-05-28 | Amada Co Ltd | Laser working device |
-
1983
- 1983-12-12 JP JP58233925A patent/JPS60127085A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992190A (en) * | 1982-11-15 | 1984-05-28 | Amada Co Ltd | Laser working device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60127085A (en) | 1985-07-06 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| KR910015989A (en) | Positioning control method of transducer | |
| JPS6322918B2 (en) | ||
| JPH1118466A (en) | Velocity controller | |
| JPS6057952B2 (en) | Laser processing equipment | |
| JPS60127091A (en) | Laser working device | |
| JPS58132441A (en) | Automatic compensator for thermal displacement | |
| JPS6322919B2 (en) | ||
| JP3346917B2 (en) | Torch height control device in plasma cutting equipment | |
| JP3383044B2 (en) | Laser processing control device | |
| JPS62194508A (en) | Numerical controller | |
| JPS60127084A (en) | Control device for laser working | |
| JPS60176104A (en) | Process controller | |
| JPS61123489A (en) | Laser working device | |
| JPH04209002A (en) | Control circuit | |
| JP2510344Y2 (en) | Automatic amplitude controller | |
| JPS6224885A (en) | Laser beam machine | |
| JPH0324316B2 (en) | ||
| JPH1190671A (en) | Method and device for controlling jetting pressure of assist gas in laser beam machine | |
| JPH04100130A (en) | Servo controller for motor | |
| RU2058577C1 (en) | Adaptive control system | |
| JPH06329316A (en) | Inertia compensating device | |
| JPH02106289A (en) | Device for controlling force | |
| JPS58136463A (en) | Thermal recorder | |
| JPS5853709A (en) | Optical tracking device | |
| JPS63191988A (en) | Laser doppler speedometer |