JPH0364235B2 - - Google Patents
Info
- Publication number
- JPH0364235B2 JPH0364235B2 JP58233924A JP23392483A JPH0364235B2 JP H0364235 B2 JPH0364235 B2 JP H0364235B2 JP 58233924 A JP58233924 A JP 58233924A JP 23392483 A JP23392483 A JP 23392483A JP H0364235 B2 JPH0364235 B2 JP H0364235B2
- Authority
- JP
- Japan
- Prior art keywords
- laser
- speed
- machining
- processing
- preset value
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
- 238000003754 machining Methods 0.000 claims description 32
- 238000001514 detection method Methods 0.000 claims description 3
- 238000000034 method Methods 0.000 claims description 3
- 239000012768 molten material Substances 0.000 claims description 2
- 230000001678 irradiating effect Effects 0.000 claims 1
- 238000003079 width control Methods 0.000 description 6
- 230000007812 deficiency Effects 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000003698 laser cutting Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01S—DEVICES USING THE PROCESS OF LIGHT AMPLIFICATION BY STIMULATED EMISSION OF RADIATION [LASER] TO AMPLIFY OR GENERATE LIGHT; DEVICES USING STIMULATED EMISSION OF ELECTROMAGNETIC RADIATION IN WAVE RANGES OTHER THAN OPTICAL
- H01S3/00—Lasers, i.e. devices using stimulated emission of electromagnetic radiation in the infrared, visible or ultraviolet wave range
- H01S3/10—Controlling the intensity, frequency, phase, polarisation or direction of the emitted radiation, e.g. switching, gating, modulating or demodulating
Landscapes
- Physics & Mathematics (AREA)
- Electromagnetism (AREA)
- Engineering & Computer Science (AREA)
- Plasma & Fusion (AREA)
- Optics & Photonics (AREA)
- Laser Beam Processing (AREA)
Description
【発明の詳細な説明】
＜発明の技術分野＞
本発明はレーザ加工装置に関し、特に、加工精
度を向上させる技術に関する。DETAILED DESCRIPTION OF THE INVENTION <Technical Field of the Invention> The present invention relates to a laser processing apparatus, and particularly to a technique for improving processing accuracy.
＜従来の技術＞
この種のレーザ加工装置は、レーザ発振器から
発振されるレーザビームを加工物に照射して、該
加工物を切断等加工するものである。<Prior Art> This type of laser processing apparatus irradiates a workpiece with a laser beam emitted from a laser oscillator to process the workpiece, such as cutting.
かかるレーザ加工装置は熱加工であるため、加
工物に最適な入熱コントロールを行わないと切断
を行うものでは溶け落ち等の現象が生じ、加工精
度を落すことになる。 Since such a laser processing device performs thermal processing, if the heat input is not optimally controlled for the workpiece, phenomena such as burn-through will occur if the laser processing device performs cutting, resulting in a decrease in processing accuracy.
連続波（CW）の場合には、数ｍ／分〜十数
ｍ／分の加工が可能であるが、加工速度が0.5
ｍ／分〜２ｍ／分程度以下では如何にパワーをコ
ントロールしてもドロスフリー（レーザ切断時に
被加工物の切断面に付着する溶融物が極めて少な
い状態）の状態の良好な加工結果は得られない。 In the case of continuous wave (CW), machining is possible from several m/min to more than ten m/min, but the machining speed is 0.5 m/min.
m/min to 2 m/min or less, no matter how you control the power, you will not be able to obtain good processing results in a dross-free state (a state in which there is very little molten material adhering to the cut surface of the workpiece during laser cutting). do not have.
従つて従来は第１図及び第２図ａ，ｂに示すよ
うなパルス加工にし、そのデユーテイフアクタ
（パルスON時間／パルスON＋パルスOFF時間）
を最悪の条件においても入熱の過不足のないよう
にプリセツトして、加工速度はできるだけ変化の
ないように選定して加工を行つていた。 Therefore, in the past, pulse processing was used as shown in Figures 1 and 2 a and b, and the duty factor (pulse ON time/pulse ON + pulse OFF time) was
The machining process was performed by presetting so that there was no excess or deficiency of heat input even under the worst conditions, and by selecting the machining speed so that there was no change as much as possible.
パルス加工の場合、最適の周波数は数百Hzであ
り、そのため加工速度は１ｍ／分程度の極めて遅
いものになつていた。 In the case of pulse machining, the optimum frequency is several hundred Hz, and therefore the machining speed is extremely slow, about 1 m/min.
従来は以上のようなレーザ出力コントロールで
あつたため、連続波（CW）で加工を行えば加工
速度の上がる条件においても、他の条件からパル
ス加工を強いられるため、パルス加工にせねばな
らず、加工速度が極めて遅くなるという欠点があ
つた。 Conventionally, the laser output was controlled as described above, but even under conditions where continuous wave (CW) machining would increase the machining speed, pulse machining was forced due to other conditions, so pulse machining had to be used. The drawback was that the speed was extremely slow.
＜発明の概要＞
そこで、本発明は以上のような従来の実情に鑑
み、連続波とパルスの加工を加工速度に応じて自
動的に切り換えることにより、高速でしかも高精
度の加工を実現することを目的としている。<Summary of the invention> In view of the above-mentioned conventional circumstances, the present invention aims to realize high-speed and highly accurate machining by automatically switching between continuous wave and pulse machining according to the machining speed. It is an object.
＜発明の実施例＞
以下、本発明の一実施例を第３図〜第５図に基
づいて説明する。<Embodiment of the Invention> Hereinafter, an embodiment of the present invention will be described based on FIGS. 3 to 5.
第３図において、１は加工速度を検出する加工
速度検出手段としてのベクトル演算回路で、レー
ザ加工装置の図示しない加工テーブルのＸ軸方
向、Ｙ軸方向の速度Vx，Vyを検出して、ベクト
ル速度＝√2＋2を演算する。２は非線形増
幅器で、第４図ａ，ｂに示すようにプリセツト値
の点で非線形になるような特性を有している。 In FIG. 3, reference numeral 1 denotes a vector calculation circuit as a processing speed detection means for detecting the processing speed, which detects the speeds Vx and Vy of the processing table (not shown) of the laser processing device in the X-axis direction and Y-axis direction, and Calculate speed = √ 2 + 2 . Reference numeral 2 denotes a nonlinear amplifier, which has characteristics such that it becomes nonlinear at a preset value, as shown in FIGS. 4a and 4b.
３はパルス巾制御回路で、前記非線形増巾器２
の第４図ａに示すような特性に基づく出力信号に
より第５図ｂに示すような出力を後述のレーザ発
振器に発する。５は演算増幅器で、非線形増幅器
の第４図ｂに示すような特性に基づく出力信号を
第５図ａに示す形の信号に変換してレーザ発振器
に出力する。 3 is a pulse width control circuit, which is connected to the nonlinear amplifier 2;
Based on the output signal based on the characteristics shown in FIG. 4a, an output as shown in FIG. 5b is generated to a laser oscillator, which will be described later. Reference numeral 5 denotes an operational amplifier which converts an output signal based on the characteristics of the nonlinear amplifier shown in FIG. 4b into a signal shown in FIG. 5a, and outputs the signal to the laser oscillator.
４はレーザ発振器でパルス巾制御回路３及び演
算増幅器５の信号に基づいて、パルスON、OFF
時間及びレーザ出力のピーク値をコントロールす
る。 4 is a laser oscillator that turns pulses ON and OFF based on signals from pulse width control circuit 3 and operational amplifier 5.
Control the time and peak value of laser power.
上記非線形増幅器２と演算増幅器５と、によつ
て、ベクトル演算回路１からの信号に基づき、加
工速度がプリセツト値よりも大きい時にレーザ出
力を連続波（CW）としてピーク値を加工速度の
関数して変化するようにレーザ発振器４を制御す
る手段が構成され、非線形増幅器２と、パルス巾
制御回路３と、によつて加工速度がプリセツト値
より小さい時にレーザ出力をパルスとして平均出
力を加工速度の関数として変化させるようにレー
ザ発振器４を制御する手段、が構成されている。 The nonlinear amplifier 2 and the operational amplifier 5 set the laser output as a continuous wave (CW) when the machining speed is greater than the preset value, and set the peak value as a function of the machining speed, based on the signal from the vector calculation circuit 1. The nonlinear amplifier 2 and the pulse width control circuit 3 control the laser output as a pulse when the machining speed is smaller than a preset value, and change the average output to the machining speed. Means for controlling the laser oscillator 4 to vary it as a function is configured.
以上の構成により、第５図ｃに示すように平均
パワーが加工速度に比例するようなレーザビーム
を出力する。 With the above configuration, a laser beam whose average power is proportional to the processing speed as shown in FIG. 5c is output.
尚、前記加工速度のプリセツト値はドロスフリ
ーの状態の保たれる最低速度に設定するようにす
る。 The preset value of the machining speed is set to the lowest speed at which a dross-free state can be maintained.
例えば、プリセツト値は0.5ｍ／分〜２ｍ／分
の間に設定すればよい。 For example, the preset value may be set between 0.5 m/min and 2 m/min.
以上の構成によれば、加工速度がプイセツト値
よりも大きい時は連続波（CW）のピーク値制
御、小さい時はパルス巾制御による平均値制御を
行うことにより、高速でしかも高精度の加工を行
うことができる。 According to the above configuration, when the machining speed is larger than the preset value, continuous wave (CW) peak value control is performed, and when it is smaller than the preset value, average value control is performed using pulse width control, thereby achieving high-speed and high-precision machining. It can be carried out.
尚、プリセツト値より加工速度の小さい領域で
は、パルス巾制御によりコントロールしている
が、これはパルス周波数制御でもパルスピーク値
制御でもあるいはこれらの複合により行つても同
様の効果を奏する。 In the region where the machining speed is lower than the preset value, control is performed by pulse width control, but the same effect can be obtained by performing pulse frequency control, pulse peak value control, or a combination of these.
＜発明の効果＞
以上の説明のように、本発明によれば、連続波
とパルスの加工を切り換えるように構成すること
により、高速でしかも高精度の加工を実現するこ
とができる。<Effects of the Invention> As described above, according to the present invention, by switching between continuous wave and pulse processing, high-speed and highly accurate processing can be realized.
第１図は従来の加工装置における加工速度とレ
ーザ出力の関係を示すグラフ、第２図ａ，ｂは
夫々パルス周波数一定で、デユーテイフアクタが
変化した時のパルスON時間、OFF時間の関係を
示すグラフ、第３図は本発明に係るレーザ加工装
置の一実施例を示すブロツク図、第４図は同上実
施例における非線形増幅器の特性を示すグラフ、
第５図は同上実施例における加工速度とパワー、
加工速度とデユーテイフアクタ、加工速度と平均
パワーの関係を示すグラフである。
１……ベクトル演算回路、２……非線形増幅
器、３……パルス巾制御回路、４……レーザ発振
器、５……演算増幅器。
Figure 1 is a graph showing the relationship between machining speed and laser output in a conventional machining device. Figure 2 a and b are graphs showing the relationship between pulse ON time and OFF time when the duty factor changes when the pulse frequency is constant. 3 is a block diagram showing an embodiment of the laser processing apparatus according to the present invention, and FIG. 4 is a graph showing the characteristics of the nonlinear amplifier in the same embodiment.
Figure 5 shows the machining speed and power in the same example.
It is a graph showing the relationship between machining speed and duty factor, and machining speed and average power. DESCRIPTION OF SYMBOLS 1...Vector arithmetic circuit, 2...Nonlinear amplifier, 3...Pulse width control circuit, 4...Laser oscillator, 5...Operation amplifier.
Claims (1)
加工物に照射して、該加工物を加工するレーザ加
工装置において、加工速度を検出する加工速度検
出手段と、該加工速度検出手段からの信号に基づ
き、加工速度がプリセツト値よりも大きい時にレ
ーザ出力を連続波として出力値を加工速度の関数
として変化させるように前記レーザ発振器を制御
する手段と、加工速度がプリセツト値よりも小さ
い時にレーザ出力をパルスとして平均出力値を加
工速度の関数として変化させるようにレーザ発振
器を制御する手段と、を設けたことを特徴とする
レーザ加工装置。 ２ 加工速度のプリセツト値を、レーザ加工時被
加工物の切断面に付着する溶融物が極めて少ない
状態が得られる最低速度に設定することを特徴と
する特許請求の範囲第１項記載のレーザ加工装
置。 ３ 加工速度のプリセツト値を、0.5ｍ／分〜２
ｍ／分間に設定することを特徴とする特許請求の
範囲第２項記載のレーザ加工装置。[Claims] 1. In a laser processing apparatus that processes a workpiece by irradiating the workpiece with a laser beam emitted from a laser oscillator, a processing speed detection means for detecting a processing speed; and the processing speed detection means means for controlling the laser oscillator so that the laser output is a continuous wave and the output value changes as a function of the machining speed when the machining speed is greater than a preset value; and 1. A laser processing apparatus comprising: means for controlling a laser oscillator so that the laser output is pulsed and the average output value is changed as a function of processing speed. 2. Laser machining according to claim 1, characterized in that the preset value of the machining speed is set to the lowest speed at which extremely little molten material adheres to the cut surface of the workpiece during laser machining. Device. 3 Set the machining speed preset value from 0.5 m/min to 2
3. The laser processing apparatus according to claim 2, wherein the laser processing apparatus is set at m/min.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58233924A JPS60127091A (en) | 1983-12-12 | 1983-12-12 | Laser working device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58233924A JPS60127091A (en) | 1983-12-12 | 1983-12-12 | Laser working device |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60127091A JPS60127091A (en) | 1985-07-06 |
| JPH0364235B2 true JPH0364235B2 (en) | 1991-10-04 |
Family
ID=16962731
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58233924A Granted JPS60127091A (en) | 1983-12-12 | 1983-12-12 | Laser working device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60127091A (en) |
Families Citing this family (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS63160776A (en) * | 1986-12-24 | 1988-07-04 | Miyachi Electric Co | High-speed pulse laser beam machining device |
| US20100049264A1 (en) | 2008-08-22 | 2010-02-25 | Dymedix Corporation | Diagnostic indicator and PSG interface for a closed loop neuromodulator |
| CN101862903B (en) * | 2010-03-30 | 2013-05-08 | 深圳市大族激光科技股份有限公司 | Laser processing control method and system and laser cutting machine processing system |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992190A (en) * | 1982-11-15 | 1984-05-28 | Amada Co Ltd | Laser working device |
-
1983
- 1983-12-12 JP JP58233924A patent/JPS60127091A/en active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS5992190A (en) * | 1982-11-15 | 1984-05-28 | Amada Co Ltd | Laser working device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60127091A (en) | 1985-07-06 |
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