JPS62124091A - Profiling laser beam machine - Google Patents

Abstract

PURPOSE:To irradiate a laser beam vertically on the body to be worked and to increase the accuracy in laser beam machining by controlling the distance with the body to be worked by the profiling laser beam with a distance sensor signal and by controlling the squareness by the signal difference in plural distance sensors as well. CONSTITUTION:A work head 1 is moved vertically and controlled in an adequate distance by operating a driving part by a servo circuit 8 by comparing the focus distance by the condensing lens 2 of a laser beam 3 with the signal of a distance sensor 6c, reference value and distance comparing part 7. The work head 1 is made vertical to the body 5 to be worked with the control of the driving art 12 by actuating the servo circuit by finding the inclination angle by calculating the signal difference of distance sensors 6a, 6c by arithmetic part 10 once again. Similarly the horizontal right angled direction is controlled vertically by the signal difference in the distance sensors 6b, 6d. By said control of the focus distance and verticalness the accuracy in profiling laser machining is made better.

Description

[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a laser processing device that maintains a constant distance between a processing method and a workpiece in laser processing, and also follows the normal direction of the workpiece. It is something.

[Conventional technology]

FIG. 5 is a sectional view showing the processing head of a conventional scanning laser processing device, in which (1) is the processing head, (2) is the processing lens provided on this processing head (1), and (3) is the laser beam. , (4) is a distance sensor attached to the processing head (1),
(5) is the workpiece.

The laser beam (1) is focused by a processing lens (2),
Then, a workpiece (5) set near the focal point is irradiated with heat to perform thermal processing. At that time, in order to keep the focal position of the laser beam (11) on the workpiece (5) constant, it is desirable that the distance between the processing nozzle (2) and the workpiece (5) is always kept constant. For this purpose, the distance between the workpiece (5) and the machining head (1) is measured by a distance sensor (4), and the machining is performed in accordance with the unevenness of the workpiece (5) so that the distance is always equal to a preset distance. The head (1) is driven up and down.

[Problem that the invention seeks to solve]

Since the conventional copying laser processing device is configured as described above, the focal position of the laser beam on the workpiece can always be kept constant even if the workpiece is tilted. However, when the workpiece is tilted, The beam is irradiated obliquely to the workpiece due to the inclination of the workpiece, which poses a problem in terms of processing accuracy.

This invention was made to solve the above problems, and it maintains a constant distance between the processing head and the workpiece, and always irradiates the workpiece with the beam perpendicularly. The purpose of the present invention is to obtain a copying laser processing device that can perform the following steps.

[Means for solving problems]

The laser processing apparatus according to the present invention includes a processing head equipped with a plurality of distance sensors that detect the distance to the workpiece, and a first sensor that moves the processing head up and down so that the distance to the wave-processed workpiece is always kept constant based on this signal. a means for calculating the inclination angle of the workpiece surface from the difference between the signals output from the plurality of distance sensors, and a means for calculating the inclination angle of the workpiece surface from the difference in signals output from the plurality of distance sensors, and a means for calculating the inclination angle of the workpiece surface so that the workpiece is always irradiated with laser light perpendicularly. and second driving means for changing the.

[Effect]

In this invention, the first drive means is operated based on the signals from the holes and the holes to maintain a constant distance between the processing head and the workpiece. Further, the inclination of the wave-processed object is determined by the calculation means, and the inclination of the processing head is adjusted by the second driving means according to this inclination, so that the laser beam is irradiated perpendicularly to the surface of the workpiece.

[Embodiments of the invention]

An embodiment of the present invention will be described below with reference to the drawings. 1st
In figures (a) and (b), (6a) to (6d) are
These are distance sensors placed at equal intervals around the processing head. In the control system shown in FIG. 2, (7) is a distance comparison unit that compares the output of one distance sensor with a preset distance and sends a signal to the servo circuit (8) to make the distance constant. Drive unit (9) according to the output of the servo circuit (8)
drives the processing head (1) up and down. On the other hand, (10)
calculates the inclination of the workpiece (5) from the difference between the outputs of the two distance sensors (6a) and (6c), and calculates the angle according to the angle:
This is an angle calculation unit that sends the signal to the servo circuit (11). Based on the output of the servo circuit (11), the drive unit (12) adjusts the inclination angle of the machining head in the axial direction passing through the distance sensors (6al, (Be)) to match the inclination angle of the workpiece. From the difference between the outputs of (6h) and (6d), (
6b) (By changing the inclination angle of the machining head in the axial direction passing through 6dl, the machining head is always perpendicular to the workpiece as shown in FIG. 3.

The method of determining the inclination angle of the workpiece by the angle calculating section (10) will be explained based on FIG. 4. Distance sensor (6a) and (6C
) and the distance between the distance sensors (6a) and (6c) detecting the distance, that is, the location where the distance sensor (6a) is installed,
The inclination angle (15) of the wave workpiece can be determined from the distance (15) from the place where (6c) is attached.

The holes C, S (6a) to (6d) are not limited to optical sensors, and may be any sensor that can detect distance, such as a magnetic sensor or a differential sensor.

〔Effect of the invention〕

As described above (according to the present invention), the distance between the machining head and the wave workpiece is kept constant, and the distance between the workpiece and the workpiece is Since the processing head is always vertical, highly accurate laser processing is possible.

[Brief explanation of drawings]

1(a), (BL is a cross-sectional explanatory view and a plan view of a processing head portion of a copying laser processing apparatus according to an embodiment of the present invention, FIG. 2 is a block diagram showing the entire copying laser processing apparatus, FIG. 3 is a diagram explaining the operation of the embodiment, FIG. 4 is a diagram explaining how to determine the inclination angle of the workpiece,
FIG. 5 is an explanatory cross-sectional view showing a processing head portion of a conventional scanning laser processing device. (1) is the processing head, (2) is the processing head, (41, (
6al・(6d) is a distance sensor, (5) is a workpiece, (
7) is a distance comparison section, and (10) is an angle calculation section. Note that the same reference numerals in each figure indicate the same or corresponding parts. Agent Patent Attorney Tadashi Sato Figure 1 (a) Figure 2

Claims (1)

[Claims] The laser beam is focused by a lens etc. installed on the processing head,
In devices that perform laser processing, the processing head is equipped with multiple distance sensors that detect the distance to the workpiece, and a first drive that moves the processing head up and down to keep the distance to the workpiece constant based on these signals. Means: means for calculating the inclination angle of the surface of the workpiece from the difference in signals output from the plurality of distance sensors, and based on the result, the inclination of the processing head is adjusted so that the laser beam is always irradiated perpendicularly to the workpiece. A copying laser processing device characterized by comprising a second driving means for changing the pattern.