JPS60126852A - 半導体冷却装置 - Google Patents

半導体冷却装置

Info

Publication number
JPS60126852A
JPS60126852A JP23422383A JP23422383A JPS60126852A JP S60126852 A JPS60126852 A JP S60126852A JP 23422383 A JP23422383 A JP 23422383A JP 23422383 A JP23422383 A JP 23422383A JP S60126852 A JPS60126852 A JP S60126852A
Authority
JP
Japan
Prior art keywords
heat sink
semiconductor
heat
fin
cooling device
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP23422383A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0422022B2 (enrdf_load_stackoverflow
Inventor
Asao Nishimura
西村　朝雄
Tatsuji Sakamoto
坂本　達事
Takahiro Oguro
崇弘 大黒
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Hitachi Ltd
Original Assignee
Hitachi Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Hitachi Ltd filed Critical Hitachi Ltd
Priority to JP23422383A priority Critical patent/JPS60126852A/ja
Publication of JPS60126852A publication Critical patent/JPS60126852A/ja
Publication of JPH0422022B2 publication Critical patent/JPH0422022B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/34—Arrangements for cooling, heating, ventilating or temperature compensation ; Temperature sensing arrangements
    • H01L23/42—Fillings or auxiliary members in containers or encapsulations selected or arranged to facilitate heating or cooling
    • H01L23/433—Auxiliary members in containers characterised by their shape, e.g. pistons
    • H01L23/4338—Pistons, e.g. spring-loaded members
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/10—Bump connectors; Manufacturing methods related thereto
    • H01L2224/15—Structure, shape, material or disposition of the bump connectors after the connecting process
    • H01L2224/16—Structure, shape, material or disposition of the bump connectors after the connecting process of an individual bump connector
    • H01L2224/161—Disposition
    • H01L2224/16151—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
    • H01L2224/16221—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
    • H01L2224/16225—Disposition the bump connector connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
    • H01L2924/151—Die mounting substrate
    • H01L2924/153—Connection portion
    • H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
    • H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
JP23422383A 1983-12-14 1983-12-14 半導体冷却装置 Granted JPS60126852A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP23422383A JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP23422383A JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Publications (2)

Publication Number Publication Date
JPS60126852A true JPS60126852A (ja) 1985-07-06
JPH0422022B2 JPH0422022B2 (enrdf_load_stackoverflow) 1992-04-15

Family

ID=16967622

Family Applications (1)

Application Number Title Priority Date Filing Date
JP23422383A Granted JPS60126852A (ja) 1983-12-14 1983-12-14 半導体冷却装置

Country Status (1)

Country Link
JP (1) JPS60126852A (enrdf_load_stackoverflow)

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
US5126829A (en) * 1988-09-26 1992-06-30 Hitachi, Ltd. Cooling apparatus for electronic device
US6528878B1 (en) * 1999-08-05 2003-03-04 Hitachi, Ltd. Device for sealing and cooling multi-chip modules
KR101147731B1 (ko) 2004-06-03 2012-05-25 엘지전자 주식회사 디엘피 프로젝터의 ｄｍｄ 칩의 냉각 구조

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US5052481A (en) * 1988-05-26 1991-10-01 International Business Machines Corporation High conduction cooling module having internal fins and compliant interfaces for vlsi chip technology
US5126829A (en) * 1988-09-26 1992-06-30 Hitachi, Ltd. Cooling apparatus for electronic device
US6528878B1 (en) * 1999-08-05 2003-03-04 Hitachi, Ltd. Device for sealing and cooling multi-chip modules
US6890799B2 (en) * 1999-08-05 2005-05-10 Hitachi, Ltd. Device for sealing and cooling multi-chip modules
KR101147731B1 (ko) 2004-06-03 2012-05-25 엘지전자 주식회사 디엘피 프로젝터의 ｄｍｄ 칩의 냉각 구조

Also Published As

Publication number Publication date
JPH0422022B2 (enrdf_load_stackoverflow) 1992-04-15

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