JPS60121800A - 電子部品のテ−ピング方法 - Google Patents
電子部品のテ−ピング方法Info
- Publication number
- JPS60121800A JPS60121800A JP23105883A JP23105883A JPS60121800A JP S60121800 A JPS60121800 A JP S60121800A JP 23105883 A JP23105883 A JP 23105883A JP 23105883 A JP23105883 A JP 23105883A JP S60121800 A JPS60121800 A JP S60121800A
- Authority
- JP
- Japan
- Prior art keywords
- lead wire
- resin coating
- tape
- coating layer
- base tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 238000000034 method Methods 0.000 title claims description 13
- 229920005989 resin Polymers 0.000 claims description 43
- 239000011347 resin Substances 0.000 claims description 43
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 claims description 31
- 239000011247 coating layer Substances 0.000 claims description 23
- 239000011248 coating agent Substances 0.000 claims description 10
- 238000000576 coating method Methods 0.000 claims description 10
- 239000010410 layer Substances 0.000 claims description 6
- 238000002844 melting Methods 0.000 claims description 6
- 230000008018 melting Effects 0.000 claims description 6
- 239000012943 hotmelt Substances 0.000 claims description 5
- 239000002390 adhesive tape Substances 0.000 description 11
- 239000000853 adhesive Substances 0.000 description 4
- 230000001070 adhesive effect Effects 0.000 description 4
- 239000003795 chemical substances by application Substances 0.000 description 4
- 238000003780 insertion Methods 0.000 description 4
- 230000037431 insertion Effects 0.000 description 4
- 239000000463 material Substances 0.000 description 3
- 238000005476 soldering Methods 0.000 description 2
- RSWGJHLUYNHPMX-UHFFFAOYSA-N Abietic-Saeure Natural products C12CCC(C(C)C)=CC2=CCC2C1(C)CCCC2(C)C(O)=O RSWGJHLUYNHPMX-UHFFFAOYSA-N 0.000 description 1
- 101100056767 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) arp-3 gene Proteins 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- KHPCPRHQVVSZAH-HUOMCSJISA-N Rosin Natural products O(C/C=C/c1ccccc1)[C@H]1[C@H](O)[C@@H](O)[C@@H](O)[C@@H](CO)O1 KHPCPRHQVVSZAH-HUOMCSJISA-N 0.000 description 1
- XTXRWKRVRITETP-UHFFFAOYSA-N Vinyl acetate Chemical compound CC(=O)OC=C XTXRWKRVRITETP-UHFFFAOYSA-N 0.000 description 1
- 230000006866 deterioration Effects 0.000 description 1
- 230000000694 effects Effects 0.000 description 1
- 239000000203 mixture Substances 0.000 description 1
- 239000012188 paraffin wax Substances 0.000 description 1
- 239000011295 pitch Substances 0.000 description 1
- -1 polyethylene Polymers 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 238000003825 pressing Methods 0.000 description 1
- 229920005992 thermoplastic resin Polymers 0.000 description 1
- KHPCPRHQVVSZAH-UHFFFAOYSA-N trans-cinnamyl beta-D-glucopyranoside Natural products OC1C(O)C(O)C(CO)OC1OCC=CC1=CC=CC=C1 KHPCPRHQVVSZAH-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Packages (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23105883A JPS60121800A (ja) | 1983-12-06 | 1983-12-06 | 電子部品のテ−ピング方法 |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP23105883A JPS60121800A (ja) | 1983-12-06 | 1983-12-06 | 電子部品のテ−ピング方法 |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS60121800A true JPS60121800A (ja) | 1985-06-29 |
JPH0311967B2 JPH0311967B2 (enrdf_load_stackoverflow) | 1991-02-19 |
Family
ID=16917622
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP23105883A Granted JPS60121800A (ja) | 1983-12-06 | 1983-12-06 | 電子部品のテ−ピング方法 |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS60121800A (enrdf_load_stackoverflow) |
Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51114670A (en) * | 1975-03-31 | 1976-10-08 | Nippon Electric Co | Method of manufacturing chain lead structure |
-
1983
- 1983-12-06 JP JP23105883A patent/JPS60121800A/ja active Granted
Patent Citations (1)
Publication number | Priority date | Publication date | Assignee | Title |
---|---|---|---|---|
JPS51114670A (en) * | 1975-03-31 | 1976-10-08 | Nippon Electric Co | Method of manufacturing chain lead structure |
Also Published As
Publication number | Publication date |
---|---|
JPH0311967B2 (enrdf_load_stackoverflow) | 1991-02-19 |
Similar Documents
Publication | Publication Date | Title |
---|---|---|
US5945733A (en) | Structure for attaching a semiconductor wafer section to a support | |
US4118260A (en) | Heat recoverable article | |
JPS60121800A (ja) | 電子部品のテ−ピング方法 | |
JPS6057568B2 (ja) | 光フアイバテ−プの製造方法 | |
JPS60121799A (ja) | 電子部品のテ−ピング方法 | |
JPH0111705Y2 (enrdf_load_stackoverflow) | ||
JPS639953Y2 (enrdf_load_stackoverflow) | ||
JPH03187083A (ja) | テープカセットにおけるリーダトレーラテープ | |
JPS6228738B2 (enrdf_load_stackoverflow) | ||
JPH03283170A (ja) | テープ接合方法及びテープ接合装置 | |
JPS6345336Y2 (enrdf_load_stackoverflow) | ||
JP2836410B2 (ja) | 半導体装置の粘着テーピング方法 | |
JPH0322260Y2 (enrdf_load_stackoverflow) | ||
JPS63258717A (ja) | ヒユ−ズクリツプのテ−ピング装置 | |
JPH1044266A (ja) | 粘着テープ用非粘着性紙芯及びその製造方法 | |
KR940004796Y1 (ko) | 브라운관 보강용 테이프 | |
JPS6112235U (ja) | ワイヤボンデイング装置 | |
JPH0732454Y2 (ja) | 電子部品連 | |
JPS58151239A (ja) | ラミネ−トシ−スの製造方法 | |
JPS6131927B2 (enrdf_load_stackoverflow) | ||
JPS63246102A (ja) | うちわの製造方法 | |
JPS61285618A (ja) | 金属ラミネ−トシ−スケ−ブルのラミネ−トテ−プ被覆装置 | |
JPS6329417A (ja) | 複合絶縁テ−プの接続法 | |
JPS60130899A (ja) | テ−ピング電子部品連 | |
JPH04142263A (ja) | 電子部品収納用キャリアテープ |