JPH0311967B2 - - Google Patents
Info
- Publication number
- JPH0311967B2 JPH0311967B2 JP58231058A JP23105883A JPH0311967B2 JP H0311967 B2 JPH0311967 B2 JP H0311967B2 JP 58231058 A JP58231058 A JP 58231058A JP 23105883 A JP23105883 A JP 23105883A JP H0311967 B2 JPH0311967 B2 JP H0311967B2
- Authority
- JP
- Japan
- Prior art keywords
- coating layer
- lead wire
- resin coating
- tape
- base tape
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Landscapes
- Packages (AREA)
- Apparatuses And Processes For Manufacturing Resistors (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23105883A JPS60121800A (ja) | 1983-12-06 | 1983-12-06 | 電子部品のテ−ピング方法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP23105883A JPS60121800A (ja) | 1983-12-06 | 1983-12-06 | 電子部品のテ−ピング方法 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60121800A JPS60121800A (ja) | 1985-06-29 |
| JPH0311967B2 true JPH0311967B2 (enrdf_load_stackoverflow) | 1991-02-19 |
Family
ID=16917622
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP23105883A Granted JPS60121800A (ja) | 1983-12-06 | 1983-12-06 | 電子部品のテ−ピング方法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60121800A (enrdf_load_stackoverflow) |
Family Cites Families (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS51114670A (en) * | 1975-03-31 | 1976-10-08 | Nippon Electric Co | Method of manufacturing chain lead structure |
-
1983
- 1983-12-06 JP JP23105883A patent/JPS60121800A/ja active Granted
Also Published As
| Publication number | Publication date |
|---|---|
| JPS60121800A (ja) | 1985-06-29 |
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