JPS60113499A - Chip type taping tape - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] The present invention relates to a tape for chip-type taping, and more specifically, the present invention relates to a tape for chip-type taping, and more specifically, it is possible to easily determine the directionality of chip-type electronic components sealed within the chip-type taping from outside the taping. The present invention relates to a chip-type taping tape that can be easily and quickly detected using a non-contact detection device.

[Technical Background of the Invention] Electronic circuits are generally assembled using automatic assembly equipment. For example, chip-type electronic components mounted in a line on chip-type taping are placed in predetermined positions on a circuit board using an automatic insertion machine or the like. Automatic assembly of electronic circuits is carried out by sequential automatic mounting.

A known chip type taping used in such an automatic assembly process has a structure shown in FIGS. 1 and 2. That is, as shown in the figure, the known chip-type taping includes an opaque carrier tape 1 having a large number of four parts 2 and a transparent cover tape 3 that covers the recess 2 and is enclosed within the recess 2. It has a chip type electronic component 4. In addition, the carrier tape 1 has a recess 2.
Feed holes 5 are arranged side by side, and when the feed holes 5 engage with protrusions of a reel of an automatic insertion machine, etc., the chip-type taping is fed intermittently in the longitudinal direction. ing.

As shown in FIG. 1, the chip type electronic component 4 sealed in the recess 2 of the carrier tape 1 has a pair of terminals a protruding from one side thereof, and a pair of terminals a protruding from the center of the other side. Usually, within the same chip-type taping, each chip-type electronic component is housed in the recess 2 so that the same terminal faces the same side.

However, in the manufacturing process of chip type taping, as shown in FIG. Since it is possible for electronic components to be sealed inside the recess 2, it is important to check the terminal direction (i.e. directionality) of the electronic components inside the taping when completing the chip-type taping and before using it. is necessary.

Conventionally, in order to determine the directionality of the chip-type electronic component within the recess 2, there have been two methods: (1) determining the directionality of the electronic component by human visual observation from outside the transparent cover tape 3;
(2) One of the methods has been implemented in which directionality is determined by photographing the dip-type electronic component in the recess 2 from outside the transparent cover tape 3 with a television camera and image-processing this detection signal.

[Problems with Background Art] However, the above method (2) has drawbacks such as easy judgment errors, long time required for judgment, and high cost for judgment. Although this method does not cause judgment errors, it has the disadvantage that the equipment is very expensive and the image processing time required for judgment is long.

[Object of the Invention] The object of the present invention is to automatically determine the orientation of a chip-type electronic component in a chip-type daping at high speed using a simple and inexpensive non-contact detection device without using the conventional determination method. It is an object of the present invention to provide a chip-type taping tape that can be used for various purposes.

[Summary of the Invention] The chip-type taping tape according to the present invention has a detection hole in which the chip-type electronic component sealed in the chip-type taping is closed only when the chip-type electronic component is oriented in a specific direction. For chip-type taping made of the tape according to the present invention, it is possible to easily and quickly determine the orientation of chip-type electronic components using a photoelectric non-contact detector or the like. It can be performed.

[Embodiment of the Invention] An embodiment of the present invention will be described below with reference to FIGS. 4 to 6.

FIG. 4 shows a plan view of the carrier tape 7 of the chip-type taping according to the present invention, with the cover tape removed. Further, in the same figure, parts indicated by the same reference numerals as in FIG. 1 indicate the same parts as in the conventional tape of FIG. 1.

The chip-type taping carrier tape 7 according to the present invention is characterized in that a detection hole 8 is provided in each recess 2. The detection hole 8 is blocked by a part of the chip-type electronic component housed in the recess 2 only when the chip-type electronic component is in a specific posture (for example, the above-mentioned inverted state). There is. That is, in the embodiment of the present invention, when the chip-type electronic component 6 in an inverted state is accommodated in the recess 2 as shown by the two-dot chain line in FIG. Although the detection hole 8 is blocked by the terminal 6, the detection hole 8 is not blocked by the chip type electronic component 4 in the normal state shown by the solid line.

Therefore, for a chip-type taping made of the tape of the present invention, a relatively simple detector such as a known photoelectric detector or an ultrasonic detector can be used to automatically and quickly detect the chip-type electronics in the taping. The orientation of parts can be determined.

FIG. 6 shows an example of a case where a photoelectric detector is used to determine the directionality of a chip-type electronic component inside the taping.
In the figure, 9 is a light projector, and 10 is a light receiving element.
As shown in the figure, when an inverted chip type electronic component 6 is accommodated in the recess 2 of the carrier tape 7, the detection hole 8
The projector 9 is blocked by the terminals of the electronic component 6.
The light beam projected toward the detection hole 8 is blocked and no longer enters the light receiving element 1o, and as a result, it is possible to detect that the electronic component 6 is in an inverted state.

[Effects of the Invention] As explained in the above embodiments, according to the present invention, the directionality of the chip-type electronic component inside the taping can be detected from the outside of the taping using a conventionally known simple non-contact detector. Since it can be detected automatically and quickly, the time and cost required for chip-type taping inspection can be significantly reduced, and at the same time, there will be no judgment errors, thereby preventing mistakes in the electronic circuit assembly process. be able to.

[Brief explanation of the drawing]

Figure 1 is a plan view of conventionally known chip-type taping;
The figure is a sectional view taken along the arrow ■-■ in Figure 1, Figure 3 is a plan view showing chip-type taping in which chip-type electronic components with different orientations are mixed, and Figure 4 is a tape constructed with the tape according to the present invention. FIG. 5 is a sectional view taken along the line V-■ in FIG. 4, and FIG.
It is a sectional view taken along the line r-v■. 1.7...Carrier tape, 2...Concavity, 3.
...Cover tape, 4,6...Chip-type electronic components,
8...Detection hole, 9...Emitter, Ding O...Light receiving element. 7-

Claims (1)

[Claims] 1. A chip-type taping tape in which a chip-type electronic component is encapsulated has a detection hole that is blocked by a part of the chip-type electronic component only when the chip-type electronic component is encapsulated facing in a specific direction. A chip-type taping tape that is characterized by the fact that: