JPS60110135A - ペレットピックアップ装置 - Google Patents
ペレットピックアップ装置Info
- Publication number
- JPS60110135A JPS60110135A JP58217581A JP21758183A JPS60110135A JP S60110135 A JPS60110135 A JP S60110135A JP 58217581 A JP58217581 A JP 58217581A JP 21758183 A JP21758183 A JP 21758183A JP S60110135 A JPS60110135 A JP S60110135A
- Authority
- JP
- Japan
- Prior art keywords
- wafer sheet
- wafer
- pellets
- sheet
- ring portion
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000008188 pellet Substances 0.000 claims abstract description 41
- 230000002093 peripheral effect Effects 0.000 claims description 2
- NJPPVKZQTLUDBO-UHFFFAOYSA-N novaluron Chemical compound C1=C(Cl)C(OC(F)(F)C(OC(F)(F)F)F)=CC=C1NC(=O)NC(=O)C1=C(F)C=CC=C1F NJPPVKZQTLUDBO-UHFFFAOYSA-N 0.000 abstract 2
- 235000012431 wafers Nutrition 0.000 description 60
- 239000000853 adhesive Substances 0.000 description 7
- 230000001070 adhesive effect Effects 0.000 description 7
- 238000000034 method Methods 0.000 description 6
- 241000257465 Echinoidea Species 0.000 description 5
- 230000000694 effects Effects 0.000 description 5
- SGTNSNPWRIOYBX-UHFFFAOYSA-N 2-(3,4-dimethoxyphenyl)-5-{[2-(3,4-dimethoxyphenyl)ethyl](methyl)amino}-2-(propan-2-yl)pentanenitrile Chemical compound C1=C(OC)C(OC)=CC=C1CCN(C)CCCC(C#N)(C(C)C)C1=CC=C(OC)C(OC)=C1 SGTNSNPWRIOYBX-UHFFFAOYSA-N 0.000 description 1
- 238000004026 adhesive bonding Methods 0.000 description 1
- 238000005336 cracking Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- 238000007689 inspection Methods 0.000 description 1
- 238000009434 installation Methods 0.000 description 1
- 238000011900 installation process Methods 0.000 description 1
- 238000012986 modification Methods 0.000 description 1
- 230000004048 modification Effects 0.000 description 1
- 238000012856 packing Methods 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L21/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
- H01L21/70—Manufacture or treatment of devices consisting of a plurality of solid state components formed in or on a common substrate or of parts thereof; Manufacture of integrated circuit devices or of parts thereof
- H01L21/77—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate
- H01L21/78—Manufacture or treatment of devices consisting of a plurality of solid state components or integrated circuits formed in, or on, a common substrate with subsequent division of the substrate into plural individual devices
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2221/00—Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof covered by H01L21/00
- H01L2221/67—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere
- H01L2221/683—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping
- H01L2221/68304—Apparatus for handling semiconductor or electric solid state devices during manufacture or treatment thereof; Apparatus for handling wafers during manufacture or treatment of semiconductor or electric solid state devices or components; Apparatus not specifically provided for elsewhere for supporting or gripping using temporarily an auxiliary support
- H01L2221/68318—Auxiliary support including means facilitating the separation of a device or wafer from the auxiliary support
- H01L2221/68322—Auxiliary support including means facilitating the selective separation of some of a plurality of devices from the auxiliary support
Landscapes
- Engineering & Computer Science (AREA)
- Physics & Mathematics (AREA)
- Condensed Matter Physics & Semiconductors (AREA)
- General Physics & Mathematics (AREA)
- Manufacturing & Machinery (AREA)
- Computer Hardware Design (AREA)
- Microelectronics & Electronic Packaging (AREA)
- Power Engineering (AREA)
- Dicing (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58217581A JPS60110135A (ja) | 1983-11-18 | 1983-11-18 | ペレットピックアップ装置 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP58217581A JPS60110135A (ja) | 1983-11-18 | 1983-11-18 | ペレットピックアップ装置 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60110135A true JPS60110135A (ja) | 1985-06-15 |
| JPH0144018B2 JPH0144018B2 (enrdf_load_stackoverflow) | 1989-09-25 |
Family
ID=16706519
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP58217581A Granted JPS60110135A (ja) | 1983-11-18 | 1983-11-18 | ペレットピックアップ装置 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60110135A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61179751U (enrdf_load_stackoverflow) * | 1985-04-26 | 1986-11-10 | ||
| JPS63102237U (enrdf_load_stackoverflow) * | 1986-12-23 | 1988-07-02 | ||
| JPH01173737A (ja) * | 1987-12-28 | 1989-07-10 | Shinkawa Ltd | ウエハー供給装置 |
| JP2004327714A (ja) * | 2003-04-24 | 2004-11-18 | Nec Machinery Corp | ウェーハシートのエキスパンド装置 |
Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504543A (enrdf_load_stackoverflow) * | 1973-05-16 | 1975-01-17 | ||
| JPS544062A (en) * | 1977-06-13 | 1979-01-12 | Hitachi Ltd | Wafer extender |
| JPS5728949A (en) * | 1980-07-30 | 1982-02-16 | Saburo Kano | Finishing hot water or shower apparatus annexed to external furnace type bathtub |
-
1983
- 1983-11-18 JP JP58217581A patent/JPS60110135A/ja active Granted
Patent Citations (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS504543A (enrdf_load_stackoverflow) * | 1973-05-16 | 1975-01-17 | ||
| JPS544062A (en) * | 1977-06-13 | 1979-01-12 | Hitachi Ltd | Wafer extender |
| JPS5728949A (en) * | 1980-07-30 | 1982-02-16 | Saburo Kano | Finishing hot water or shower apparatus annexed to external furnace type bathtub |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS61179751U (enrdf_load_stackoverflow) * | 1985-04-26 | 1986-11-10 | ||
| JPS63102237U (enrdf_load_stackoverflow) * | 1986-12-23 | 1988-07-02 | ||
| JPH01173737A (ja) * | 1987-12-28 | 1989-07-10 | Shinkawa Ltd | ウエハー供給装置 |
| JP2004327714A (ja) * | 2003-04-24 | 2004-11-18 | Nec Machinery Corp | ウェーハシートのエキスパンド装置 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPH0144018B2 (enrdf_load_stackoverflow) | 1989-09-25 |
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Legal Events
| Date | Code | Title | Description |
|---|---|---|---|
| LAPS | Cancellation because of no payment of annual fees |