JPS60109335U

JPS60109335U - semiconductor equipment

Info

Publication number: JPS60109335U
Application number: JP20053083U
Authority: JP
Inventors: 中嶋　享一; 勝清水
Original assignee: 富士電機株式会社
Priority date: 1983-12-27
Filing date: 1983-12-27
Publication date: 1985-07-25
Also published as: JPS6331401Y2

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図は本考案の実施例を示す構造図であり、第２図は
同じく本考案の★流側であって下端板の部分断面図を示
す。・１０・・・底板、１１・・・冷却フィン、１２・・・
電力変換用半導体素子、２０・・・側板、２１・・・は
め合い凹凸部、２２・・・切り欠き付き円形穴、２３・
・・切り欠き付き長方形穴、３０・・・上端板、３１・
・・取付穴、３９・・・タッピングねじ、４０・・・下
端板、４０Ａ・・・分割された下端板、４１・・・取付
穴、４２・・・主回路端子、４３・・・開口部、４４・
・・ファン、４５・・・平滑コンデンサ、４９−１・・
タッピングねじ、５０・・・プリント板、５１・・・プ
リント板端子、５２・・・プリント板取付金具、５３・
・・締付けねじ、６０・・・蓋。FIG. 1 is a structural diagram showing an embodiment of the present invention, and FIG. 2 is a partial sectional view of the lower end plate, which is also on the downstream side of the present invention.・10...Bottom plate, 11...Cooling fin, 12...
Semiconductor element for power conversion, 20... Side plate, 21... Fitting uneven portion, 22... Circular hole with notch, 23.
...Rectangular hole with notch, 30...Top end plate, 31.
...Mounting hole, 39...Tapping screw, 40...Lower end plate, 40A...Divided lower end plate, 41...Mounting hole, 42...Main circuit terminal, 43...Opening , 44・
...Fan, 45...Smoothing capacitor, 49-1...
Tapping screw, 50... Printed board, 51... Printed board terminal, 52... Printed board mounting bracket, 53.
...Tightening screw, 60...lid.

Claims

[Scope of utility model registration request]

A semiconductor device that converts power using a semiconductor element, its accessories, and a printed circuit board equipped with control electronic components, in which cooling fins are formed in the longitudinal direction on one side using a material with good thermal conductivity. A bottom plate obtained by cutting a long material into a predetermined length, a concave-convex hole on one side into which the side of the bottom plate fits, a partially cut-out circular hole, and a partially cut-out rectangular hole. When the side plates are obtained by cutting a long material formed continuously in the longitudinal direction into a predetermined length, and the side plates are fitted on both sides of the bottom plate with the cooling fins on the outside, an upper end plate having mounting holes at positions corresponding to the notched circular holes; an opening having a main circuit terminal through which a printed circuit board terminal can protrude; and mounting holes at positions corresponding to the notched circular holes of the side plates. a lower end plate, a notch in the both side plates that passes through the mounting holes of the upper and lower end plates, and a screw that is screwed into the circular hole to form a box with an open front; A rectangular hole with a notch is formed in each side plate so that a terminal portion of a printed board that is housed together with a semiconductor device and its accessories is located in an opening in the lower end plate, and the opening is closed by the printed board. 1. A semiconductor device comprising: a printed board that can be attached using a printed circuit board; and a lid that closes a front surface of the box.