JPS60109332U - 混成集積回路装置 - Google Patents

混成集積回路装置

Info

Publication number
JPS60109332U
JPS60109332U JP1983203897U JP20389783U JPS60109332U JP S60109332 U JPS60109332 U JP S60109332U JP 1983203897 U JP1983203897 U JP 1983203897U JP 20389783 U JP20389783 U JP 20389783U JP S60109332 U JPS60109332 U JP S60109332U
Authority
JP
Japan
Prior art keywords
integrated circuit
circuit device
hybrid integrated
heat sink
copperization
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1983203897U
Other languages
English (en)
Japanese (ja)
Other versions
JPS645895Y2 (enrdf_load_stackoverflow
Inventor
一郎 宗像
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Fujitsu Ltd
Original Assignee
Fujitsu Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Fujitsu Ltd filed Critical Fujitsu Ltd
Priority to JP1983203897U priority Critical patent/JPS60109332U/ja
Publication of JPS60109332U publication Critical patent/JPS60109332U/ja
Application granted granted Critical
Publication of JPS645895Y2 publication Critical patent/JPS645895Y2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/42—Wire connectors; Manufacturing methods related thereto
    • H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
    • H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
    • H01L2224/4805—Shape
    • H01L2224/4809—Loop shape
    • H01L2224/48091—Arched

Landscapes

  • Cooling Or The Like Of Electrical Apparatus (AREA)
JP1983203897U 1983-12-27 1983-12-27 混成集積回路装置 Granted JPS60109332U (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1983203897U JPS60109332U (ja) 1983-12-27 1983-12-27 混成集積回路装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1983203897U JPS60109332U (ja) 1983-12-27 1983-12-27 混成集積回路装置

Publications (2)

Publication Number Publication Date
JPS60109332U true JPS60109332U (ja) 1985-07-25
JPS645895Y2 JPS645895Y2 (enrdf_load_stackoverflow) 1989-02-14

Family

ID=30766301

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1983203897U Granted JPS60109332U (ja) 1983-12-27 1983-12-27 混成集積回路装置

Country Status (1)

Country Link
JP (1) JPS60109332U (enrdf_load_stackoverflow)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023540751A (ja) * 2020-09-03 2023-09-26 ノースロップ グラマン システムズ コーポレーション モノリシックマイクロ波集積回路（ｍｍｉｃ）アセンブリおよびそれを実現するための方法

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120165A (enrdf_load_stackoverflow) * 1973-03-23 1974-11-16
JPS52126758U (enrdf_load_stackoverflow) * 1976-03-23 1977-09-27
JPS58173855A (ja) * 1982-04-02 1983-10-12 Mitsubishi Electric Corp 半導体素子用冷却装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS49120165A (enrdf_load_stackoverflow) * 1973-03-23 1974-11-16
JPS52126758U (enrdf_load_stackoverflow) * 1976-03-23 1977-09-27
JPS58173855A (ja) * 1982-04-02 1983-10-12 Mitsubishi Electric Corp 半導体素子用冷却装置

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JP2023540751A (ja) * 2020-09-03 2023-09-26 ノースロップ グラマン システムズ コーポレーション モノリシックマイクロ波集積回路（ｍｍｉｃ）アセンブリおよびそれを実現するための方法

Also Published As

Publication number Publication date
JPS645895Y2 (enrdf_load_stackoverflow) 1989-02-14

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