JPS60106664A - Ｉｃ用全自動はんだ付け装置 - Google Patents

Ｉｃ用全自動はんだ付け装置

Info

Publication number
JPS60106664A
JPS60106664A JP21235983A JP21235983A JPS60106664A JP S60106664 A JPS60106664 A JP S60106664A JP 21235983 A JP21235983 A JP 21235983A JP 21235983 A JP21235983 A JP 21235983A JP S60106664 A JPS60106664 A JP S60106664A
Authority
JP
Japan
Prior art keywords
tank
cleaning
soldering
flux
cleaning liquid
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP21235983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6345908B2 (enrdf_load_stackoverflow
Inventor
Kenji Kondo
近藤　権士
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP21235983A priority Critical patent/JPS60106664A/ja
Priority to US06/670,941 priority patent/US4570569A/en
Priority to KR1019840007108A priority patent/KR890004818B1/ko
Publication of JPS60106664A publication Critical patent/JPS60106664A/ja
Publication of JPS6345908B2 publication Critical patent/JPS6345908B2/ja
Granted legal-status Critical Current

Links

Classifications

    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0653—Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00—Soldering, e.g. brazing, or unsoldering
    • B23K1/08—Soldering by means of dipping in molten solder
    • B23K1/085—Wave soldering
    • B—PERFORMING OPERATIONS; TRANSPORTING
    • B23—MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23K—SOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00—Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06—Solder feeding devices; Solder melting pans
    • B23K3/0646—Solder baths
    • B23K3/0669—Solder baths with dipping means
    • B23K3/0676—Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21235983A 1983-11-14 1983-11-14 Ｉｃ用全自動はんだ付け装置 Granted JPS60106664A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP21235983A JPS60106664A (ja) 1983-11-14 1983-11-14 Ｉｃ用全自動はんだ付け装置
US06/670,941 US4570569A (en) 1983-11-14 1984-11-13 Soldering apparatus
KR1019840007108A KR890004818B1 (ko) 1983-11-14 1984-11-13 Ic용 전자동 납땜장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21235983A JPS60106664A (ja) 1983-11-14 1983-11-14 Ｉｃ用全自動はんだ付け装置

Publications (2)

Publication Number Publication Date
JPS60106664A true JPS60106664A (ja) 1985-06-12
JPS6345908B2 JPS6345908B2 (enrdf_load_stackoverflow) 1988-09-12

Family

ID=16621237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21235983A Granted JPS60106664A (ja) 1983-11-14 1983-11-14 Ｉｃ用全自動はんだ付け装置

Country Status (1)

Country Link
JP (1) JPS60106664A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS6345908B2 (enrdf_load_stackoverflow) 1988-09-12

Similar Documents

Publication Publication Date Title
US3482755A (en) Automatic wave soldering machine
JPS6372478A (ja) 半田仕上げ集積回路パッケ−ジリ−ド
US3053215A (en) Apparatus for soldering printed sheets
KR890004818B1 (ko) Ic용 전자동 납땜장치
JPS60106664A (ja) Ｉｃ用全自動はんだ付け装置
US4776508A (en) Electronic component lead tinning device
US4410127A (en) Method of soldering pins to printed circuit boards, and soldering bath for this method
JPH0442057Y2 (enrdf_load_stackoverflow)
JPS60106663A (ja) Ｉｃ用全自動はんだ付け装置
JPS6043895A (ja) 基板洗浄装置
JPH022538Y2 (enrdf_load_stackoverflow)
JPH0438528Y2 (enrdf_load_stackoverflow)
JPS60105292A (ja) Ｉｃ用全自動はんだ付け装置
JPS643577Y2 (enrdf_load_stackoverflow)
JPH022539Y2 (enrdf_load_stackoverflow)
JPS6127149B2 (enrdf_load_stackoverflow)
JP2582530Y2 (ja) 多槽浸漬式洗壜機
JPH055849U (ja) 物品搬送装置
JP3391014B2 (ja) 容器洗浄装置
JPS61295637A (ja) Ｉｃリ−ドフレ−ムの過剰モ−ルド除去方法
JPS61172359A (ja) 半田処理装置
JPS6051938B2 (ja) 浸漬式はんだ槽
JPH072139Y2 (ja) スポット半田付装置
JPS59202166A (ja) 自動はんだ付け装置
JPH02310989A (ja) プリント基板の洗浄方法およびその装置