JPS6345908B2 - - Google Patents

Info

Publication number
JPS6345908B2
JPS6345908B2 JP21235983A JP21235983A JPS6345908B2 JP S6345908 B2 JPS6345908 B2 JP S6345908B2 JP 21235983 A JP21235983 A JP 21235983A JP 21235983 A JP21235983 A JP 21235983A JP S6345908 B2 JPS6345908 B2 JP S6345908B2
Authority
JP
Japan
Prior art keywords
cleaning
tank
soldering
rail
transport
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP21235983A
Other languages
English (en)
Japanese (ja)
Other versions
JPS60106664A (ja
Inventor
Kenji Kondo
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Individual
Original Assignee
Individual
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Individual filed Critical Individual
Priority to JP21235983A priority Critical patent/JPS60106664A/ja
Priority to US06/670,941 priority patent/US4570569A/en
Priority to KR1019840007108A priority patent/KR890004818B1/ko
Publication of JPS60106664A publication Critical patent/JPS60106664A/ja
Publication of JPS6345908B2 publication Critical patent/JPS6345908B2/ja
Granted legal-status Critical Current

Links

Classifications

    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0653Solder baths with wave generating means, e.g. nozzles, jets, fountains
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K1/00Soldering, e.g. brazing, or unsoldering
    • B23K1/08Soldering by means of dipping in molten solder
    • B23K1/085Wave soldering
    • BPERFORMING OPERATIONS; TRANSPORTING
    • B23MACHINE TOOLS; METAL-WORKING NOT OTHERWISE PROVIDED FOR
    • B23KSOLDERING OR UNSOLDERING; WELDING; CLADDING OR PLATING BY SOLDERING OR WELDING; CUTTING BY APPLYING HEAT LOCALLY, e.g. FLAME CUTTING; WORKING BY LASER BEAM
    • B23K3/00Tools, devices, or special appurtenances for soldering, e.g. brazing, or unsoldering, not specially adapted for particular methods
    • B23K3/06Solder feeding devices; Solder melting pans
    • B23K3/0646Solder baths
    • B23K3/0669Solder baths with dipping means
    • B23K3/0676Conveyors therefor

Landscapes

  • Engineering & Computer Science (AREA)
  • Mechanical Engineering (AREA)
  • Molten Solder (AREA)
  • Lead Frames For Integrated Circuits (AREA)
JP21235983A 1983-11-14 1983-11-14 Ic用全自動はんだ付け装置 Granted JPS60106664A (ja)

Priority Applications (3)

Application Number Priority Date Filing Date Title
JP21235983A JPS60106664A (ja) 1983-11-14 1983-11-14 Ic用全自動はんだ付け装置
US06/670,941 US4570569A (en) 1983-11-14 1984-11-13 Soldering apparatus
KR1019840007108A KR890004818B1 (ko) 1983-11-14 1984-11-13 Ic용 전자동 납땜장치

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP21235983A JPS60106664A (ja) 1983-11-14 1983-11-14 Ic用全自動はんだ付け装置

Publications (2)

Publication Number Publication Date
JPS60106664A JPS60106664A (ja) 1985-06-12
JPS6345908B2 true JPS6345908B2 (enrdf_load_stackoverflow) 1988-09-12

Family

ID=16621237

Family Applications (1)

Application Number Title Priority Date Filing Date
JP21235983A Granted JPS60106664A (ja) 1983-11-14 1983-11-14 Ic用全自動はんだ付け装置

Country Status (1)

Country Link
JP (1) JPS60106664A (enrdf_load_stackoverflow)

Also Published As

Publication number Publication date
JPS60106664A (ja) 1985-06-12

Similar Documents

Publication Publication Date Title
US3482755A (en) Automatic wave soldering machine
US4787550A (en) Automatic soldering apparatus
KR890004818B1 (ko) Ic용 전자동 납땜장치
US4410127A (en) Method of soldering pins to printed circuit boards, and soldering bath for this method
JPS6345908B2 (enrdf_load_stackoverflow)
JPH0442057Y2 (enrdf_load_stackoverflow)
JPS60106663A (ja) Ic用全自動はんだ付け装置
JPH11117053A (ja) オイルブランケットを備えた水平はんだ付け装置
JPH0438528Y2 (enrdf_load_stackoverflow)
JPH0467357B2 (enrdf_load_stackoverflow)
JPH022538Y2 (enrdf_load_stackoverflow)
JPS60105292A (ja) Ic用全自動はんだ付け装置
JPS59202166A (ja) 自動はんだ付け装置
JPH022539Y2 (enrdf_load_stackoverflow)
JPS643577Y2 (enrdf_load_stackoverflow)
JPS6127149B2 (enrdf_load_stackoverflow)
JPH0890217A (ja) 自動半田付け方法、自動半田付け装置、噴射孔型半田噴流 ノズル及びフラックス塗布ブラシ装置
JPH0225574Y2 (enrdf_load_stackoverflow)
JPS645766U (enrdf_load_stackoverflow)
JPH0685130A (ja) 電子部品製造装置
JPH0248137Y2 (enrdf_load_stackoverflow)
JPH072139Y2 (ja) スポット半田付装置
JPH055849U (ja) 物品搬送装置
JP2582530Y2 (ja) 多槽浸漬式洗壜機
JPS5881555A (ja) 自動はんだ付け装置