JPS60105296A - Method of fixing electronic part - Google Patents
Method of fixing electronic partInfo
- Publication number
- JPS60105296A JPS60105296A JP21274983A JP21274983A JPS60105296A JP S60105296 A JPS60105296 A JP S60105296A JP 21274983 A JP21274983 A JP 21274983A JP 21274983 A JP21274983 A JP 21274983A JP S60105296 A JPS60105296 A JP S60105296A
- Authority
- JP
- Japan
- Prior art keywords
- electronic component
- wiring board
- printed wiring
- present
- adhesive
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
【発明の詳細な説明】
産業上の利用分野
本発明は−プリント配線基板」二に装着した多数個の電
子部品の固定方法に関するものである。DETAILED DESCRIPTION OF THE INVENTION Field of the Invention The present invention relates to a method for fixing a large number of electronic components mounted on a printed wiring board.
従来例の構成とその問題点
一般に、プリント配線基板には多数個の電子部品が装着
されており、これらの電子部品が動いて相互に接触する
ようなことがあると回路動作の不安定性を招き好ましく
ない。そのため、多数個の電子部品が装着されたプリン
ト基板においては一従来からコードバンドや接着テープ
によって上記プリント基板上に装着した多数個の電子部
品相互間をしばりつけて固定化を図ったり、他にワック
ス等により密着させるなどの方法が採用されていた。Conventional configurations and their problems Generally, a printed wiring board is equipped with a large number of electronic components, and if these electronic components move and come into contact with each other, it can cause instability in circuit operation. Undesirable. For this reason, in the case of printed circuit boards on which a large number of electronic components are mounted, it has traditionally been attempted to secure the electronic components mounted on the printed circuit board by using cord bands or adhesive tape to tie the electronic components together. Methods such as adhesion using wax or the like were used.
しかしながら、上述した従来の方法において一コードバ
ンドや接着テープで固定する場合には電子部品のリード
線の断線となる危険性があり、溶融したワックスにより
固定しようとする場合にはその熱により電子部品全破壊
させたシー接点部分にワックスが流れ込み接点不良にな
るという問題を有していた。However, in the conventional method described above, when fixing with a cord band or adhesive tape, there is a risk of breaking the lead wire of the electronic component, and when fixing with melted wax, the heat causes the electronic component to break. There was a problem in that wax flowed into the completely destroyed sea contact part, causing a contact failure.
発明の目的
本発明は、このような従来の問題点を解消するもので、
電子部品とその近傍に存在する他の部品が容易に固定化
できる電子部品の固定方法を提供することを目的とする
。Purpose of the Invention The present invention solves these conventional problems.
It is an object of the present invention to provide a method for fixing an electronic component that can easily fix the electronic component and other components present in the vicinity thereof.
発明の構成
本発明は、前記の目的を達成するために、電子部品本体
の天面又は側面に予じめ形成した粘着性物質を利用し、
この電子部品本体の近傍に配置される他の部品を固着す
るようにしたことを特長とするものである。Structure of the Invention In order to achieve the above object, the present invention utilizes an adhesive substance pre-formed on the top or side surface of an electronic component body,
This electronic component is characterized in that other components placed near the main body of the electronic component are fixed to each other.
実施例の説明
第１図は本発明の一実施例を示しており１図中１はプリ
ント配線基板、２ｉｄ上記プリント配線基板１に装着し
た電子部品であり−その本体部２ａの天面に粘着性物質
３が予じめ形成されている。DESCRIPTION OF EMBODIMENTS FIG. 1 shows an embodiment of the present invention, in which 1 is a printed wiring board, 2id is an electronic component mounted on the printed wiring board 1, and an adhesive is attached to the top surface of the main body 2a. The substance 3 is preformed.
４は上記電子部品１に近接するよう上記プリント配線基
鈑１に装着された他の電子部品であり、上記粘着性物質
３によって上記電子部品２に固着されている。Reference numeral 4 designates another electronic component mounted on the printed wiring board 1 so as to be close to the electronic component 1, and is fixed to the electronic component 2 by the adhesive substance 3.
ここで、上記粘着性物質３は第２図に示すようにプリン
ト配線基板への実装前に電子部品２の本体部２ａの天面
に形成した粘着性物質３を利用したり一第３図に示すよ
うに電子部品２の本体部２ａの天面に粘着性物質３をあ
らかじめ形成しておき一接着使用時においてワックス等
の表面処理をした非粘着性物質５をはがすことにより上
記粘着性物質３を利用したシ、第４図に示すように電子
部品２を一連化するだめの粘着力を持つテープ６の粘着
性物質を電子部品２をテープ６から（はがす時に電子部
品２側にのこるようにして利用することができる。Here, the adhesive substance 3 may be formed on the top surface of the main body 2a of the electronic component 2 before mounting on the printed wiring board as shown in FIG. 2, or as shown in FIG. As shown, an adhesive substance 3 is formed in advance on the top surface of the main body 2a of the electronic component 2, and when adhesive is used, the adhesive substance 3 is removed by peeling off the non-adhesive substance 5 whose surface has been treated with wax or the like. As shown in FIG. 4, the adhesive material of the tape 6 with sufficient adhesive strength to connect the electronic components 2 is removed from the tape 6 (so that it remains on the electronic component 2 side when peeled off). It can be used.
第５図は本発明の他の実施例を示しており１図中、１は
プリント配線基板、７．８は上記プリント配線基板１に
装着された電子部品であり、上記電子部品７の本体部子
ａの側面に予じめ形成された粘着性物質９によって上記
電子７．８の相互間が固着されている。FIG. 5 shows another embodiment of the present invention, in which 1 is a printed wiring board, 7.8 is an electronic component mounted on the printed wiring board 1, and the main body of the electronic component 7 is shown in FIG. The electrons 7.8 are fixed to each other by an adhesive substance 9 previously formed on the side surface of the element a.
第６図は本発明の更に他の実施例を示しており７図中−
１はプリント配線基板、１０は上記プリント配線基板１
上に装着された電子部品であり−その本体部１０２Ｌの
天面および側面に予じめ粘着性物質１１を形成している
。そして、この粘着性物質１１によって近傍に存在する
他のリード線やテープ、板材等の部品１２を固着してい
る。FIG. 6 shows still another embodiment of the present invention, and in FIG.
1 is a printed wiring board; 10 is the printed wiring board 1 mentioned above;
The adhesive substance 11 is previously formed on the top and side surfaces of the main body 102L of the electronic component mounted on the main body 102L. This adhesive substance 11 fixes other nearby components 12 such as lead wires, tapes, and plates.
発明の効果
以上のように本発明によれは一電子部品本体に予じめ形
成した粘着性物質を利用して近接配置された電子部品相
互間や他に配される部品を固足するようにしたので、テ
ープバンド、接着テープ全利用してしばりつける時の応
力に起因するリード線の断線が発生がなく−１だワック
スにて密着させる場合のワックス自体に起因する部品の
破損。Effects of the Invention As described above, according to the present invention, it is possible to fix electronic components placed close to each other or other components by using an adhesive substance pre-formed on the main body of the electronic component. Therefore, there is no breakage of the lead wire due to stress when tightening by using tape band and adhesive tape.-1) When bonding with wax, parts are damaged due to the wax itself.
不良が未然に防止できる。しかも、高周波回路における
電子部品の振動による発振防止、電子部品の振動による
共振防止、劣化防止を図ることができる利点を有する。Defects can be prevented. Moreover, it has the advantage of being able to prevent oscillation due to vibration of electronic components in a high frequency circuit, prevention of resonance due to vibration of electronic components, and prevention of deterioration.
第１図は本発明の一実施例を示すプリント鈑の斜視図、
第２図、第３図および第４図は同プリント板に使用する
電子部品の斜視図、第５図は本発明の他の実施例を示す
断面図、第６図は本発明の更に他の実施例を示す斜視図
である。
１・・・・・プリント配線基板−２，４，７，８，１０
・・・・・・電子部品、１２・・・・・・部品−３，９
，１１・・・・・・粘着性物質。
代理人の氏名 弁理士 中 尾 敏 男 ほか１名第１
図
第２図
第３図FIG. 1 is a perspective view of a printed board showing an embodiment of the present invention;
2, 3, and 4 are perspective views of electronic components used in the printed board, FIG. 5 is a sectional view showing another embodiment of the present invention, and FIG. 6 is a perspective view of another embodiment of the present invention. It is a perspective view showing an example. 1...Printed wiring board-2, 4, 7, 8, 10
...Electronic parts, 12...Parts-3,9
, 11...Adhesive substance. Name of agent: Patent attorney Toshio Nakao and 1 other person No. 1
Figure 2 Figure 3
Claims (1)
される他の部品を、上記電子部品本体の天面又は側面に
予じめ形成し／ヒ粘着性物質によって上記電子部品本体
に固着することを特徴とする電子部品の固定方法。Other components to be placed in the vicinity of the electronic component body mounted on the printed wiring board are formed in advance on the top or side surface of the electronic component body and fixed to the electronic component body using an adhesive substance. Features a method of fixing electronic components.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21274983A JPS60105296A (en) | 1983-11-11 | 1983-11-11 | Method of fixing electronic part |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP21274983A JPS60105296A (en) | 1983-11-11 | 1983-11-11 | Method of fixing electronic part |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS60105296A true JPS60105296A (en) | 1985-06-10 |
Family
ID=16627782
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP21274983A Pending JPS60105296A (en) | 1983-11-11 | 1983-11-11 | Method of fixing electronic part |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60105296A (en) |
-
1983
- 1983-11-11 JP JP21274983A patent/JPS60105296A/en active Pending
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