JP3304447B2 - Substrate for mounting electronic components - Google Patents
Substrate for mounting electronic componentsInfo
- Publication number
- JP3304447B2 JP3304447B2 JP33091192A JP33091192A JP3304447B2 JP 3304447 B2 JP3304447 B2 JP 3304447B2 JP 33091192 A JP33091192 A JP 33091192A JP 33091192 A JP33091192 A JP 33091192A JP 3304447 B2 JP3304447 B2 JP 3304447B2
- Authority
- JP
- Japan
- Prior art keywords
- heat sink
- electronic component
- component mounting
- plating film
- substrate
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired - Lifetime
Links
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/4805—Shape
- H01L2224/4809—Loop shape
- H01L2224/48091—Arched
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/48—Structure, shape, material or disposition of the wire connectors after the connecting process of an individual wire connector
- H01L2224/481—Disposition
- H01L2224/48151—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive
- H01L2224/48221—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked
- H01L2224/48225—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation
- H01L2224/48227—Connecting between a semiconductor or solid-state body and an item not being a semiconductor or solid-state body, e.g. chip-to-substrate, chip-to-passive the body and the item being stacked the item being non-metallic, e.g. insulating substrate with or without metallisation connecting the wire to a bond pad of the item
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
- H01L2224/42—Wire connectors; Manufacturing methods related thereto
- H01L2224/47—Structure, shape, material or disposition of the wire connectors after the connecting process
- H01L2224/49—Structure, shape, material or disposition of the wire connectors after the connecting process of a plurality of wire connectors
- H01L2224/491—Disposition
- H01L2224/49105—Connecting at different heights
- H01L2224/49109—Connecting at different heights outside the semiconductor or solid-state body
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
- H01L2224/73—Means for bonding being of different types provided for in two or more of groups H01L2224/10, H01L2224/18, H01L2224/26, H01L2224/34, H01L2224/42, H01L2224/50, H01L2224/63, H01L2224/71
- H01L2224/732—Location after the connecting process
- H01L2224/73251—Location after the connecting process on different surfaces
- H01L2224/73265—Layer and wire connectors
Landscapes
- Cooling Or The Like Of Electrical Apparatus (AREA)
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
- Structure Of Printed Boards (AREA)
- Cooling Or The Like Of Semiconductors Or Solid State Devices (AREA)
Description
【０００１】[0001]
【産業上の利用分野】本発明は，ヒートシンクと電子部
品との密着性に優れた電子部品搭載用基板及びその製造
方法に関する。BACKGROUND OF THE INVENTION 1. Field of the Invention The present invention relates to a substrate for mounting electronic components having excellent adhesion between a heat sink and electronic components, and a method of manufacturing the same.
【０００２】[0002]
【従来技術】従来，電子部品搭載用基板としては，図１
１に示すごとく，絶縁基板９と，該絶縁基板９に穿設さ
れた開口部９１と，該開口部９１の一端を塞ぐヒートシ
ンク１とからなるものがある。開口部９１の一端には，
ヒートシンク１よりも若干大きい形状の段部９２が形成
されている。2. Description of the Related Art Conventionally, as a substrate for mounting electronic parts, FIG.
As shown in FIG. 1, there is an insulating substrate 9 comprising an insulating substrate 9, an opening 91 formed in the insulating substrate 9, and a heat sink 1 closing one end of the opening 91. At one end of the opening 91,
A step portion 92 having a shape slightly larger than the heat sink 1 is formed.
【０００３】ヒートシンク１の表側面には電子部品搭載
部９０を有する。また，ヒートシンク１は，その表側面
周縁部１０１において接着剤７により上記段部９２内に
接着固定されている。絶縁基板９の内部には内層パター
ン５９が形成されている。上記ヒートシンク１は，ヒー
トシンク本体１３と，該ヒートシンク本体１３の周囲を
被覆しているニッケルメッキ膜１２，金メッキ膜１１と
からなる。ヒートシンク本体１３は銅板を用いている。The heat sink 1 has an electronic component mounting portion 90 on the front surface thereof. In addition, the heat sink 1 is bonded and fixed in the step portion 92 by the adhesive 7 at the peripheral edge portion 101 of the front side surface. An inner layer pattern 59 is formed inside the insulating substrate 9. The heat sink 1 includes a heat sink body 13, a nickel plating film 12 and a gold plating film 11 covering the periphery of the heat sink body 13. The heat sink body 13 uses a copper plate.
【０００４】金メッキ膜１１は，ヒートシンク本体１３
の腐食防止のために設けてある。ニッケルメッキ膜１２
は，電子部品３との密着性を向上させるのために設けて
ある。上記電子部品搭載用基板９９は，電子部品搭載部
９０に，Ａｇペースト２により電子部品３が接着固定さ
れる。Ａｇペースト２は，熱伝導性がよく，耐熱性にも
優れているため電子部品３の接着剤として用いられる。
電子部品３は，ワイヤー５７により内層パターン５９の
一端と電気的に接続される。その後，開口部９１内は封
止樹脂により封止される。尚，図１１における符号５８
はリードピンである。The gold plating film 11 is formed on the heat sink body 13.
It is provided to prevent corrosion of steel. Nickel plating film 12
Are provided to improve the adhesion to the electronic component 3. The electronic component mounting board 99 has the electronic component 3 bonded and fixed to the electronic component mounting portion 90 with the Ag paste 2. Ag paste 2 is used as an adhesive for electronic component 3 because it has good thermal conductivity and excellent heat resistance.
Electronic component 3 is electrically connected to one end of inner layer pattern 59 by wire 57. Thereafter, the inside of the opening 91 is sealed with a sealing resin. Note that reference numeral 58 in FIG.
Is a lead pin.
【０００５】[0005]
【解決しようとする課題】しかしながら，上記電子部品
搭載用基板９９を過酷な温度条件の下で用いる場合に
は，電子部品３が剥離するおそれがある。即ち，過酷な
テスト条件で温度サイクル（─６５〜１５０℃）等の加
速試験を行った場合，電子部品３を接合している上記Ａ
ｇペースト２と，ヒートシンク１の金メッキ膜１１との
密着性が悪くなる。更には，電子部品３がヒートシンク
１から剥離し，ワイヤー５７が切れてオープン不良とな
る可能性があった。本発明はかかる問題点に鑑み，電子
部品とヒートシンクとの密着性に優れた電子部品搭載用
基板及びその製造方法を提供しようとするものである。However, when the electronic component mounting board 99 is used under severe temperature conditions, the electronic component 3 may be peeled off. That is, when an accelerated test such as a temperature cycle (─65 to 150 ° C.) is performed under severe test conditions, the A
The adhesion between the g paste 2 and the gold plating film 11 of the heat sink 1 is deteriorated. Further, there is a possibility that the electronic component 3 is peeled off from the heat sink 1 and the wire 57 is cut, resulting in an open failure. SUMMARY OF THE INVENTION The present invention has been made in view of the above problems, and an object of the present invention is to provide an electronic component mounting substrate having excellent adhesion between an electronic component and a heat sink, and a method of manufacturing the same.
【０００６】[0006]
【課題の解決手段】本発明は，絶縁基板と，該絶縁基板
に穿設された電子部品搭載用の開口部と，該開口部の一
端を塞ぎ，その表側面に電子部品搭載部を有するヒート
シンクとを有する電子部品搭載用基板であって，上記ヒ
ートシンクは，電子部品搭載部においてはＡｇペースト
により電子部品を接着固定するためのニッケルメッキ膜
を露出させていることを特徴とする電子部品搭載用基板
にある。An object of the present invention is to provide an insulating substrate, an opening for mounting electronic components formed in the insulating substrate, and a heat sink having one end of the opening closed and having an electronic component mounting portion on its front surface. Wherein the heat sink comprises an Ag paste in the electronic component mounting portion.
Wherein a nickel plating film for bonding and fixing the electronic component is exposed.
【０００７】本発明において最も注目すべきことは，ヒ
ートシンクの電子部品搭載部にニッケルメッキ膜を露出
させたことである。ここに，電子部品搭載部とは，ヒー
トシンクの表側面における電子部品を搭載する部分をい
う。電子部品は，Ａｇペーストにより上記電子部品搭載
部に接着される。ヒートシンクは，ヒートシンク本体
と，該ヒートシンク本体を被覆しているニッケルメッキ
膜とよりなる。What is most notable in the present invention is that the nickel plating film is exposed at the electronic component mounting portion of the heat sink. Here, the electronic component mounting portion refers to a portion on the front surface of the heat sink where electronic components are mounted. The electronic component is bonded to the electronic component mounting portion with an Ag paste. The heat sink includes a heat sink main body and a nickel plating film covering the heat sink main body.
【０００８】上記ヒートシンク本体には，銅板，及び銅
タングステン等の銅合金等が用いられる。ヒートシンク
における電子部品搭載部以外の部分は，金メッキ膜によ
り被覆されていることが好ましい。これによりヒートシ
ンク本体の腐食を防止することができる。The heat sink body is made of a copper plate or a copper alloy such as copper tungsten. It is preferable that portions other than the electronic component mounting portion of the heat sink are covered with a gold plating film. Thereby, corrosion of the heat sink body can be prevented.
【０００９】また，上記電子部品搭載用基板を製造する
方法としては，電子部品搭載部にニッケルメッキ膜を露
出させたヒートシンクを作製し，該ヒートシンクを絶縁
基板の電子部品搭載用の開口部に接合して，電子部品搭
載用基板を製造する方法であって，上記ヒートシンク
は，ヒートシンク本体の表面にニッケルメッキ膜を施
し，次いで電子部品搭載部をマスキングテープにより被
覆し，次いで金メッキ膜を施し，その後上記マスキング
テープを除去することにより作製することを特徴とする
電子部品搭載用基板の製造方法がある。Further, as a method of manufacturing the electronic component mounting board, a heat sink having a nickel plating film exposed at an electronic component mounting portion is manufactured, and the heat sink is bonded to an electronic component mounting opening of the insulating substrate. And a method of manufacturing an electronic component mounting substrate, wherein the heat sink is provided with a nickel plating film on the surface of the heat sink body, then covering the electronic component mounting portion with a masking tape, and then applying a gold plating film. There is a method for manufacturing an electronic component mounting substrate, which is manufactured by removing the masking tape.
【００１０】また，電子部品搭載用基板の他の製造方法
としては，電子部品搭載部にニッケルメッキ膜を露出さ
せたヒートシンクを作製し，該ヒートシンクを絶縁基板
の電子部品搭載用の開口部に接合して，電子部品搭載用
基板を製造する方法であって，上記ヒートシンクは，ヒ
ートシンク本体の表面にニッケルメッキ膜を施し，次い
で金メッキ膜を施し，次いで電子部品搭載部以外の部分
をマスキングテープにより被覆し，次いで上記マスキン
グテープが被覆されていない部分における金メッキ膜を
除去し，その後上記マスキングテープを除去することに
より作製することを特徴とする電子部品搭載用基板の製
造方法がある。As another method of manufacturing the electronic component mounting substrate, a heat sink having a nickel plating film exposed at the electronic component mounting portion is manufactured, and the heat sink is bonded to the electronic component mounting opening of the insulating substrate. A method for manufacturing a substrate for mounting electronic components, wherein the heat sink is provided with a nickel plating film on the surface of the heat sink body, followed by a gold plating film, and then covering portions other than the electronic component mounting portion with a masking tape. Then, there is a method for manufacturing a substrate for mounting electronic components, which comprises removing the gold plating film in a portion not covered with the masking tape, and then removing the masking tape.
【００１１】[0011]
【作用及び効果】本発明においては，ヒートシンクの電
子部品搭載部にニッケルメッキ膜を露出させている。そ
のため，電子部品を接合するＡｇペーストは，ヒートシ
ンクのニッケルメッキ膜と直接接触することになる。上
記ニッケルメッキ膜は容易に金属酸化膜を形成する。該
金属酸化膜はＡｇペーストとの密着性がよい。従って，
電子部品は，Ａｇペースト及びニッケルメッキ膜を介し
てヒートシンクの電子部品搭載部に強固に接着され，前
記温度サイクルに対しても剥離等の損傷を生ずることは
ない。In the present invention, the nickel plating film is exposed on the electronic component mounting portion of the heat sink. Therefore, the Ag paste for joining the electronic components comes into direct contact with the nickel plating film of the heat sink. The nickel plating film easily forms a metal oxide film. The metal oxide film has good adhesion to the Ag paste. Therefore,
The electronic component is firmly adhered to the electronic component mounting portion of the heat sink via the Ag paste and the nickel plating film, and does not cause damage such as peeling even with the temperature cycle.
【００１２】また，上記のいずれの方法においても，ニ
ッケルメッキ膜の表面に金メッキ膜を施したヒートシン
クにおいて，電子部品搭載部にニッケルメッキ膜を容易
に露出させることができ，また上記の優れた電子部品搭
載用基板を製造することができる。したがって，本発明
によれば，電子部品とヒートシンクとの密着性に優れた
電子部品搭載用基板を提供することができる。Further, in any of the above methods, the nickel plating film can be easily exposed to the electronic component mounting portion in the heat sink in which the gold plating film is formed on the surface of the nickel plating film. A component mounting board can be manufactured. Therefore, according to the present invention, the adhesiveness between the electronic component and the heat sink is excellent.
An electronic component mounting substrate can be provided .
【００１３】[0013]
【実施例】実施例１ 本発明にかかる実施例について，図１〜図４を用いて説
明する。本例の電子部品搭載用基板９９は，図１に示す
ごとく，絶縁基板９と，該絶縁基板９に穿設された電子
部品搭載用の開口部９１と，該開口部９１の一端を塞
ぎ，その表側面に電子部品搭載部９０を有するヒートシ
ンク１とを有する。上記ヒートシンク１は，電子部品搭
載部９０においてはニッケルメッキ膜１２を露出させて
いる。Embodiment 1 An embodiment according to the present invention will be described with reference to FIGS. As shown in FIG. 1, the electronic component mounting board 99 of this embodiment closes one end of the insulating substrate 9, an electronic component mounting opening 91 formed in the insulating substrate 9, and one end of the opening 91. And a heat sink 1 having an electronic component mounting portion 90 on its front side. The heat sink 1 exposes the nickel plating film 12 in the electronic component mounting section 90.
【００１４】ヒートシンク１は，ヒートシンク本体１３
と，該ヒートシンク本体１３を被覆しているニッケルメ
ッキ膜１２と，更にその表面を被覆している金メッキ膜
１１とよりなる。上記ヒートシンク本体１３は，銅板で
ある。ヒートシンク１における電子部品搭載部９０以外
の部分は，図２，図３に示すごとく，金メッキ膜１１に
より被覆されている。これによりヒートシンク本体１３
の腐食を防止することができる。The heat sink 1 comprises a heat sink body 13
And a nickel plating film 12 covering the heat sink body 13 and a gold plating film 11 further covering the surface thereof. The heat sink body 13 is a copper plate. As shown in FIGS. 2 and 3, portions other than the electronic component mounting portion 90 in the heat sink 1 are covered with a gold plating film 11. Thereby, the heat sink body 13
Corrosion can be prevented.
【００１５】開口部９１の一端には，ヒートシンク１よ
りも若干大きい形状の段部９２が形成されている。上記
ヒートシンク１は，その表側面周縁部１０１において接
着剤７により上記段部９２内に接着固定されている。上
記電子部品搭載部９０には，Ａｇペースト２により電子
部品３が接着固定される。その他の構造は，従来例と同
様である。At one end of the opening 91, a step portion 92 slightly larger than the heat sink 1 is formed. The heat sink 1 is bonded and fixed to the inside of the step portion 92 with an adhesive 7 at a peripheral edge portion 101 of the front side surface. The electronic component 3 is bonded and fixed to the electronic component mounting portion 90 with the Ag paste 2. Other structures are the same as the conventional example.
【００１６】次に，上記ヒートシンク１の製造方法につ
いて，図４を用いて説明する。まず，図４（ａ）に示す
ごとく，ヒートシンク本体１３としての銅板を準備す
る。次いで，図４（ｂ）に示すごとく，ヒートシンク本
体１３の表面全体にニッケルメッキ膜１２を施す。次い
で，図４（ｃ）に示すごとく，電子部品搭載部９０とな
るベき部分のみをマスキングテープ８により被覆する。
次いで，図４（ｄ）に示すごとく，上記ヒートシンク１
の表面に金メッキ膜１１を施し，その後上記マスキング
テープ８を除去する。Next, a method of manufacturing the heat sink 1 will be described with reference to FIG. First, as shown in FIG. 4A, a copper plate as the heat sink body 13 is prepared. Next, as shown in FIG. 4B, a nickel plating film 12 is applied to the entire surface of the heat sink body 13. Next, as shown in FIG. 4C, only a beveled portion to be the electronic component mounting portion 90 is covered with the masking tape 8.
Next, as shown in FIG.
A gold plating film 11 is applied to the surface of the substrate, and then the masking tape 8 is removed.
【００１７】次に本例の作用効果について説明する。本
例においてヒートシンク１は，電子部品搭載部９０にお
いて，ニッケルメッキ膜１２が露出している。そのた
め，電子部品３を接着しているＡｇペースト２は，ヒー
トシンク１のニッケルメッキ膜１２と直接接触すること
になる。Ａｇペースト２とニッケルメッキ膜１２とは，
前記のごとく，密着性がよい。Next, the operation and effect of this embodiment will be described. In the present example, the nickel plating film 12 of the heat sink 1 is exposed in the electronic component mounting portion 90. Therefore, the Ag paste 2 to which the electronic component 3 is adhered comes into direct contact with the nickel plating film 12 of the heat sink 1. Ag paste 2 and nickel plating film 12 are:
As described above, the adhesiveness is good.
【００１８】従って，電子部品３は，ヒートシンク１の
電子部品搭載部９０に強固に接着される。前記温度サイ
クルにおいても剥離を生ずることがない。また，ヒート
シンク１における電子部品搭載部９０以外の部分は，金
メッキ膜１１により被覆されている。そのため，ヒート
シンク本体１３の腐食を防止することができる。また，
上記の製造方法によれば，ニッケルメッキ膜１２の表面
に金メッキ膜１１を施したヒートシンク１において，電
子部品搭載部９０にニッケルメッキ膜１２を容易に露出
させることができる。Therefore, the electronic component 3 is firmly adhered to the electronic component mounting portion 90 of the heat sink 1. No peeling occurs even in the temperature cycle. Further, portions other than the electronic component mounting portion 90 in the heat sink 1 are covered with the gold plating film 11. Therefore, corrosion of the heat sink body 13 can be prevented. Also,
According to the above manufacturing method, in the heat sink 1 in which the gold plating film 11 is provided on the surface of the nickel plating film 12, the nickel plating film 12 can be easily exposed to the electronic component mounting portion 90.
【００１９】参考例 本例においては，実施例１に示したヒートシンクを以下
のようにして製造した。まず，図５（ａ）に示すごと
く，ヒートシンク本体１３の表面全体に，ニッケルメッ
キ膜１２，金メッキ膜１１を順次施す。次いで，図５
（ｂ）に示すごとく，電子部品搭載部９０以外の部分を
マスキングテープ８により被覆する。[0019]Reference example In this example, the heat sink shown in Example 1
It was manufactured as follows. First, as shown in FIG.
The entire surface of the heat sink body 13 is covered with nickel plating.
A gold film 12 and a gold plating film 11 are sequentially applied. Next, FIG.
As shown in (b), the parts other than the electronic component mounting part 90 are
Cover with masking tape 8.
【００２０】次いで，図５（ｃ）に示すごとく，上記金
メッキ膜１１における上記マスキングテープ８に被覆さ
れていない部分を，エッチングにより除去し，ニッケル
膜１２を露出させる。その後上記マスキングテープ８を
除去する。その他は，実施例１と同様である。本例にお
いても，実施例１と同様の効果を得ることができる。Next, as shown in FIG. 5C, a portion of the gold plating film 11 which is not covered with the masking tape 8 is removed by etching to expose the nickel film 12. Thereafter, the masking tape 8 is removed. Others are the same as the first embodiment. In this embodiment, the same effect as in the first embodiment can be obtained.
【００２１】実施例２ 本例の電子部品搭載用基板は，図６〜図８に示すごと
く，ヒートシンク１の表側面全体，即ち電子部品搭載用
基板９０側の全表面においてニッケルメッキ膜１２が露
出している。また，開口部９１は，図６に示すごとく，
実施例１のように段部を形成していない。ヒートシンク
１は，その表側面周縁部１０１において，接着剤７によ
り，電子部品搭載用基板９における開口部９１の裏側面
周縁部９１１に接着固定されている。その他は，実施例
１と同様である。本例においても，実施例１と同様の効
果を得ることができる。[0021]Example 2 The electronic component mounting board of this example is as shown in FIGS.
For the entire surface of the heat sink 1, ie, for mounting electronic components
The nickel plating film 12 is exposed on the entire surface on the substrate 90 side.
Is out. The opening 91 is formed as shown in FIG.
A step is not formed as in the first embodiment. heatsink
Reference numeral 1 denotes an adhesive 7 on the peripheral edge portion 101 of the front surface.
The back surface of the opening 91 in the electronic component mounting board 9.
It is adhesively fixed to the peripheral portion 911. Other examples
Same as 1. In this example, the same effect as in the first embodiment is obtained.
Fruit can be obtained.
【００２２】実施例３ 本例の電子部品搭載用基板においては，図９，図１０に
示すごとく，ヒートシンク１は，その表側面及び側面１
０２においてニッケルメッキ膜１２が露出しており，そ
の裏側面のみが金メッキ膜１１により被覆されている。
また，ヒートシンク１の側面１０２は，半田６により開
口部９１の裏面周縁部９１１に接着補強されている。ま
た，ヒートシンク１の側面１０２は，半田６により接合
するためにニッケルメッキ膜１２が露出している。ま
た，開口部９１の表側面周縁部９０１には樹脂封止枠４
が形成されている。[0022]Example 3 In the electronic component mounting board of this example, FIGS.
As shown, the heat sink 1 has its front and side surfaces 1
02, the nickel plating film 12 is exposed.
Is covered with the gold plating film 11 only.
The side surface 102 of the heat sink 1 is opened by the solder 6.
The back surface peripheral portion 911 of the mouth portion 91 is adhesively reinforced. Ma
In addition, the side surface 102 of the heat sink 1 is joined by the solder 6.
For this purpose, the nickel plating film 12 is exposed. Ma
In addition, a resin sealing frame 4 is
Is formed.
【００２３】その他は，実施例２と同様である。本例に
おいては，ヒートシンク１は，半田６により補強接着さ
れているので，絶縁基板９に対して強固に接着してい
る。また，本例においても，実施例２と同様の効果を得
ることができる。The rest is the same as the second embodiment . In this example, since the heat sink 1 is reinforced by the solder 6, it is firmly bonded to the insulating substrate 9. Also, in this embodiment, the same effect as in the second embodiment can be obtained.
【図１】実施例１の電子部品搭載用基板の断面図。FIG. 1 is a sectional view of an electronic component mounting board according to a first embodiment.
【図２】実施例１のヒートシンクの断面図。FIG. 2 is a cross-sectional view of the heat sink according to the first embodiment.
【図３】実施例１のヒートシンクの平面図。FIG. 3 is a plan view of the heat sink according to the first embodiment.
【図４】実施例１のヒートシンクの製造方法を示す製造
工程説明図。FIG. 4 is an explanatory view of a manufacturing process showing a method of manufacturing the heat sink according to the first embodiment.
【図５】参考例のヒートシンクの製造方法を示す製造工
程説明図。FIG. 5 is an explanatory view of a manufacturing process showing a method of manufacturing the heat sink of the reference example .
【図６】実施例２の電子部品搭載用基板の断面図。FIG. 6 is a cross-sectional view of the electronic component mounting board according to the second embodiment.
【図７】実施例２のヒートシンクの断面図。FIG. 7 is a sectional view of a heat sink according to a second embodiment.
【図８】実施例２のヒートシンクの平面図。FIG. 8 is a plan view of a heat sink according to a second embodiment.
【図９】実施例３の電子部品搭載用基板の断面図。FIG. 9 is a sectional view of an electronic component mounting board according to a third embodiment.
【図１０】実施例３のヒートシンクの断面図。FIG. 10 is a sectional view of a heat sink according to a third embodiment.
【図１１】従来例の電子部品搭載用基板の断面図。FIG. 11 is a sectional view of a conventional electronic component mounting substrate.
１．．．ヒートシンク，１１．．．金メッキ膜，１
２．．．ニッケルメッキ膜，１３．．．ヒートシンク本
体，２．．．Ａｇペースト，３．．．電子部品，
７．．．接着剤，８．．．マスキングテープ，９．．．
絶縁基板，９０．．．電子部品搭載部，９１．．．開口
部，９２．．．段部，９９．．．電子部品搭載用基板，1. . . Heat sink, 11. . . Gold plated film, 1
2. . . Nickel plating film, 13. . . 1. heat sink body . . Ag paste, 3. . . Electronic components,
7. . . Adhesive, 8. . . Masking tape, 9; . .
Insulating substrate, 90. . . Electronic component mounting section, 91. . . Opening, 92. . . Step, 99. . . Electronic component mounting board,
───────────────────────────────────────────────────── フロントページの続き (51)Int.Cl.7 識別記号 ＦＩ Ｈ０５Ｋ 1/18 Ｈ０１Ｌ 23/36 Ｃ (58)調査した分野(Int.Cl.7，ＤＢ名) H05K 7/20 H01L 23/12 H01L 23/12 301 H01L 23/36 ──────────────────────────────────────────────────の Continued on the front page (51) Int.Cl. 7 identification code FI H05K 1/18 H01L 23/36 C (58) Investigated field (Int.Cl. 7 , DB name) H05K 7/20 H01L 23 / 12 H01L 23/12 301 H01L 23/36
Claims (1)
子部品搭載用の開口部と，該開口部の一端を塞ぎ，その
表側面に電子部品搭載部を有するヒートシンクとを有す
る電子部品搭載用基板であって， 上記ヒートシンクは，電子部品搭載部においてはＡｇペ
ーストにより電子部品を接着固定するためのニッケルメ
ッキ膜を露出させていることを特徴とする電子部品搭載
用基板。1. An electronic component comprising: an insulating substrate; an opening for mounting an electronic component formed in the insulating substrate; and a heat sink that closes one end of the opening and has an electronic component mounting portion on its front surface. The mounting substrate, wherein the heat sink is an Ag paper in an electronic component mounting portion.
A substrate for mounting an electronic component, wherein a nickel plating film for bonding and fixing the electronic component is exposed by a substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33091192A JP3304447B2 (en) | 1992-11-17 | 1992-11-17 | Substrate for mounting electronic components |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP33091192A JP3304447B2 (en) | 1992-11-17 | 1992-11-17 | Substrate for mounting electronic components |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPH06164176A JPH06164176A (en) | 1994-06-10 |
| JP3304447B2 true JP3304447B2 (en) | 2002-07-22 |
Family
ID=18237863
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP33091192A Expired - Lifetime JP3304447B2 (en) | 1992-11-17 | 1992-11-17 | Substrate for mounting electronic components |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JP3304447B2 (en) |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP3542677B2 (en) * | 1995-02-27 | 2004-07-14 | セイコーエプソン株式会社 | Resin-sealed semiconductor device and method of manufacturing the same |
-
1992
- 1992-11-17 JP JP33091192A patent/JP3304447B2/en not_active Expired - Lifetime
Also Published As
| Publication number | Publication date |
|---|---|
| JPH06164176A (en) | 1994-06-10 |
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