JPS62274753A - Structure of pin grid array package - Google Patents
Structure of pin grid array packageInfo
- Publication number
- JPS62274753A JPS62274753A JP11846886A JP11846886A JPS62274753A JP S62274753 A JPS62274753 A JP S62274753A JP 11846886 A JP11846886 A JP 11846886A JP 11846886 A JP11846886 A JP 11846886A JP S62274753 A JPS62274753 A JP S62274753A
- Authority
- JP
- Japan
- Prior art keywords
- moisture
- pcb
- plastic
- pga
- grid array
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 239000004033 plastic Substances 0.000 claims abstract description 22
- 239000002184 metal Substances 0.000 claims abstract description 20
- 229910052751 metal Inorganic materials 0.000 claims abstract description 20
- 230000002093 peripheral effect Effects 0.000 claims abstract description 14
- 239000000758 substrate Substances 0.000 claims abstract description 3
- 239000000565 sealant Substances 0.000 claims description 13
- 238000007747 plating Methods 0.000 claims description 10
- 239000000463 material Substances 0.000 claims description 4
- 229920005989 resin Polymers 0.000 claims description 4
- 239000011347 resin Substances 0.000 claims description 4
- 239000007769 metal material Substances 0.000 claims 1
- 230000007797 corrosion Effects 0.000 abstract description 3
- 238000005260 corrosion Methods 0.000 abstract description 3
- 238000009413 insulation Methods 0.000 abstract description 3
- 238000000034 method Methods 0.000 abstract description 3
- 239000011248 coating agent Substances 0.000 abstract description 2
- 238000000576 coating method Methods 0.000 abstract description 2
- 230000008595 infiltration Effects 0.000 abstract 3
- 238000001764 infiltration Methods 0.000 abstract 3
- 230000006866 deterioration Effects 0.000 abstract 1
- 150000007529 inorganic bases Chemical class 0.000 abstract 1
- 238000007789 sealing Methods 0.000 description 6
- RYGMFSIKBFXOCR-UHFFFAOYSA-N Copper Chemical compound [Cu] RYGMFSIKBFXOCR-UHFFFAOYSA-N 0.000 description 5
- 229910052802 copper Inorganic materials 0.000 description 5
- 239000010949 copper Substances 0.000 description 5
- 230000000694 effects Effects 0.000 description 3
- 229910000679 solder Inorganic materials 0.000 description 3
- PXHVJJICTQNCMI-UHFFFAOYSA-N Nickel Chemical compound [Ni] PXHVJJICTQNCMI-UHFFFAOYSA-N 0.000 description 2
- 239000003822 epoxy resin Substances 0.000 description 2
- PCHJSUWPFVWCPO-UHFFFAOYSA-N gold Chemical compound [Au] PCHJSUWPFVWCPO-UHFFFAOYSA-N 0.000 description 2
- 239000010931 gold Substances 0.000 description 2
- 229920000647 polyepoxide Polymers 0.000 description 2
- XOMKZKJEJBZBJJ-UHFFFAOYSA-N 1,2-dichloro-3-phenylbenzene Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1Cl XOMKZKJEJBZBJJ-UHFFFAOYSA-N 0.000 description 1
- JAYCNKDKIKZTAF-UHFFFAOYSA-N 1-chloro-2-(2-chlorophenyl)benzene Chemical compound ClC1=CC=CC=C1C1=CC=CC=C1Cl JAYCNKDKIKZTAF-UHFFFAOYSA-N 0.000 description 1
- NMWSKOLWZZWHPL-UHFFFAOYSA-N 3-chlorobiphenyl Chemical compound ClC1=CC=CC(C=2C=CC=CC=2)=C1 NMWSKOLWZZWHPL-UHFFFAOYSA-N 0.000 description 1
- FPWNLURCHDRMHC-UHFFFAOYSA-N 4-chlorobiphenyl Chemical compound C1=CC(Cl)=CC=C1C1=CC=CC=C1 FPWNLURCHDRMHC-UHFFFAOYSA-N 0.000 description 1
- 101100084627 Neurospora crassa (strain ATCC 24698 / 74-OR23-1A / CBS 708.71 / DSM 1257 / FGSC 987) pcb-4 gene Proteins 0.000 description 1
- 101001082832 Saccharomyces cerevisiae (strain ATCC 204508 / S288c) Pyruvate carboxylase 2 Proteins 0.000 description 1
- ATJFFYVFTNAWJD-UHFFFAOYSA-N Tin Chemical compound [Sn] ATJFFYVFTNAWJD-UHFFFAOYSA-N 0.000 description 1
- 239000000853 adhesive Substances 0.000 description 1
- 230000001070 adhesive effect Effects 0.000 description 1
- 239000012298 atmosphere Substances 0.000 description 1
- 238000011888 autopsy Methods 0.000 description 1
- 239000003795 chemical substances by application Substances 0.000 description 1
- 238000007796 conventional method Methods 0.000 description 1
- 239000006071 cream Substances 0.000 description 1
- 238000010586 diagram Methods 0.000 description 1
- 238000007772 electroless plating Methods 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 238000005530 etching Methods 0.000 description 1
- 239000003292 glue Substances 0.000 description 1
- 229910052737 gold Inorganic materials 0.000 description 1
- 230000017525 heat dissipation Effects 0.000 description 1
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 description 1
- 229910052759 nickel Inorganic materials 0.000 description 1
- 239000011368 organic material Substances 0.000 description 1
- 230000000149 penetrating effect Effects 0.000 description 1
- CYFLXLSBHQBMFT-UHFFFAOYSA-N sulfamoxole Chemical group O1C(C)=C(C)N=C1NS(=O)(=O)C1=CC=C(N)C=C1 CYFLXLSBHQBMFT-UHFFFAOYSA-N 0.000 description 1
Classifications
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L23/00—Details of semiconductor or other solid state devices
- H01L23/02—Containers; Seals
- H01L23/10—Containers; Seals characterised by the material or arrangement of seals between parts, e.g. between cap and base of the container or between leads and walls of the container
-
- H—ELECTRICITY
- H01—ELECTRIC ELEMENTS
- H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
- H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
- H01L2924/15—Details of package parts other than the semiconductor or other solid state devices to be connected
- H01L2924/151—Die mounting substrate
- H01L2924/153—Connection portion
- H01L2924/1531—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface
- H01L2924/15312—Connection portion the connection portion being formed only on the surface of the substrate opposite to the die mounting surface being a pin array, e.g. PGA
Abstract
Description
【発明の詳細な説明】
３、発明の詳細な説明
〔産業上の利用分野〕
この発明は、集積回路（以下、Ｉｃと略す）などの実装
に用いるプラスチック製ピングリッドアレイ （以下プ
ラＰＧＡと略す）の耐湿構造に関する。[Detailed Description of the Invention] 3. Detailed Description of the Invention [Field of Industrial Application] This invention relates to a plastic pin grid array (hereinafter abbreviated as plastic PGA) used for mounting integrated circuits (hereinafter abbreviated as Ic), etc. ) regarding its moisture-resistant structure.
本発明はブラＰＧＡにおいて、ブラＰＧＡの外周部から
侵入する湿気を、ブラＰＧＡの外周部の基板両面と、外
周部端面を金属でコーティングする事により、ブラＰＧ
Ａ基板端面からの湿気の侵入を防止し、かつ金属コーテ
ィングした外周部をハンダ等による無機系封止剤で、プ
ラＰＧＡ用の金属蓋を接合する事により、ブラＰＧＡ外
周部及び、封止剤、及び封止剤界面からの湿気の侵入を
防止できるようにしたものである。In the Bra PGA, the present invention prevents moisture from entering from the outer periphery of the Bra PGA by coating both sides of the outer substrate of the Bra PGA and the end face of the outer periphery with metal.
In order to prevent moisture from entering from the edge of the A-board, the metal-coated outer periphery is bonded to the metal lid for plastic PGA using an inorganic sealant such as solder. , and prevent moisture from entering from the sealant interface.
従来、第２図に示すように、ＩＣ搭載部３を金属メッキ
で覆い耐湿性を向上させる方法が知られていた。又プラ
ＰＧＡと蓋との封着も有機系ＩＣ封止剤あるいは有機系
接着剤による封着が知られていた。例えば「日経エレク
トロニクス（’８４−６−１１）Ｊに、このような従来
の構造が示されている。Conventionally, as shown in FIG. 2, a method has been known in which the IC mounting portion 3 is covered with metal plating to improve moisture resistance. It is also known that the plastic PGA and the lid can be sealed using an organic IC sealant or an organic adhesive. For example, such a conventional structure is shown in "Nikkei Electronics ('84-6-11) J.
しかし従来の耐湿構造は、第２図に示すＩＣ搭載部３が
、金属メッキされ耐１！構造をとっていても、高温雰囲
気においた場合は第２図の外周端面２より湿気は侵入す
る。この侵入した湿気は第４図の１に示す有機系樹脂材
からなる印刷基板（以下Ｐ、Ｃ，Ｂと略す）内部におい
て、スルーホール１３の相互間の絶縁抵抗を低下せしめ
る欠点があった。また、ＰＣＢと蓋との封着に有機系の
材質を使用しているため、湿気が第５図の１４に示す封
着剤とＰＣＢＩの界面から侵入し、ＩＣを腐食させる欠
点があった。However, in the conventional moisture-resistant structure, the IC mounting part 3 shown in FIG. 2 is plated with metal and has a moisture resistance of 1! Even with this structure, if the device is placed in a high temperature atmosphere, moisture will enter from the outer peripheral end surface 2 shown in FIG. This infiltrated moisture has the disadvantage of lowering the insulation resistance between the through holes 13 inside the printed circuit board (hereinafter abbreviated as P, C, and B) made of an organic resin material shown at 1 in FIG. 4. Furthermore, since an organic material is used to seal the PCB and the lid, there is a drawback that moisture enters through the interface between the sealant and the PCBI as shown in 14 in FIG. 5, corroding the IC.
そこで、本発明は従来のこのような欠点を解決するため
、高温高温の雰囲気においてもＰＣＢ内への湿気侵入を
遮断してスルーホール相互間の拒絶抵抗の低下を防止し
、またＰＣＢと封着剤の界面から湿気侵入を防止しＩＣ
の腐食を防止し耐湿構造を得る為になされたものである
。Therefore, in order to solve these conventional drawbacks, the present invention blocks moisture intrusion into the PCB even in high-temperature atmospheres, prevents a decrease in rejection resistance between through holes, and also prevents the sealing between the PCB and the PCB. Prevents moisture intrusion from the interface of the agent and
This was done to prevent corrosion and provide a moisture-resistant structure.
上記問題点を解決するために本発明は、プラＰＧＡ外周
端面及外周縁を第３図の６に示すように金属メッキを１
０μ以上の厚みに付け、また第３図７に示すように無機
系封着剤を用いることにより、ＰＣＢ内部及び第５図の
１４と１に示す封着剤とＰＣＢの界面からの湿気の侵入
を遮断する。In order to solve the above-mentioned problems, the present invention provides metal plating on the outer peripheral end face and outer peripheral edge of the plastic PGA as shown in 6 in Fig. 3.
By attaching it to a thickness of 0μ or more and using an inorganic sealant as shown in Figure 3, 7, moisture can be prevented from penetrating inside the PCB and from the interface between the sealant and the PCB as shown in 14 and 1 in Figure 5. cut off.
上記のように構成された第１図に示すＰＧＡは湿気の侵
入口となる外周部端面及び外周縁を第３図６に示す金属
膜で覆い、かつ第３図７に示す無機系封着剤を用いるこ
とによりＰＣＢ端面及び封着剤とＰＣＢの界面から侵入
してくるン塁気を遮断することが可能となる。このこと
によりスルーホール相互間の絶縁抵抗の低下およびＩＣ
の湿気による腐食を防止する事ができる。The PGA shown in FIG. 1 configured as described above has the outer peripheral end face and the outer peripheral edge, which serve as an entry point for moisture, covered with a metal film shown in FIG. 3 6, and an inorganic sealant shown in FIG. 3 7. By using this, it becomes possible to block air entering from the PCB end face and the interface between the sealant and the PCB. This reduces the insulation resistance between the through holes and the IC
Corrosion caused by moisture can be prevented.
以下にこの発明の実施例を図面に基づいて説明する。第
１図は本発明にがかるプラＰＧＡの斜視図である。第３
図はプラＰＣＡ外周端面及び外周縁の断面を示す略図で
ある。第１図の１に示すＰＣＢ上に必要パタンをエツチ
ングで形成後、第４図の１３に示すビン立て用スルーホ
ール形成時に、第１図の２に示すＰＣＢ外周端面（１１
を活性化処理し、第３図の５に示すように無電解メッキ
法にて銅を０．０５〜０．２ μｍ付着させる。その後
５Ａ／ｄｍ′の電流密度で１０分間銅メツキを行い約１
０μｍの銅を付着させて、第３図の６に示す銅メツキ部
を形成する。その後ニッケルメッキを行いワイヤボンド
部に金メッキし、スルーホール部にビン立てを行う。第
３図の９に示すようにＩＣを搭載し金線αυでＰ ＣＢ
＋１１と結線した後、第３図の１０に示すようにエポ
キシ系の樹脂でＩＣ封止を行う。この上に耐湿性及放熱
性を向上させるために第３図８に示す金属性の蓋をかぶ
せる。蓋の外周を第３図の７に示す厚さ５０μｍ、巾が
第３図の４に示す銅パタンの平面寸法と同等以下の鉛・
錫半田製角形ワンシャを乗せ２２０〜２４０℃のりフロ
ー炉を通し第３図の８に示す金属蓋とバタン６を封着す
る・なお角形ワノンヤ以外に、クリーム半田封止も採用
できる。Embodiments of the present invention will be described below based on the drawings. FIG. 1 is a perspective view of a plastic PGA according to the present invention. Third
The figure is a schematic diagram showing a cross section of the outer peripheral end face and outer peripheral edge of the plastic PCA. After forming the necessary pattern on the PCB shown in 1 in FIG. 1 by etching, when forming the through hole for the bottle stand shown in 13 in FIG.
is activated, and copper is deposited to a thickness of 0.05 to 0.2 μm by electroless plating as shown in 5 in FIG. After that, copper plating was performed for 10 minutes at a current density of 5A/dm', and the
Copper with a thickness of 0 μm is deposited to form a copper plating portion shown at 6 in FIG. After that, nickel plating is performed, gold plating is applied to the wire bond area, and bottle stand is applied to the through hole area. As shown in 9 in Figure 3, the IC is mounted and the gold wire αυ is used to connect the PCB.
After connecting to +11, the IC is sealed with epoxy resin as shown at 10 in FIG. A metal lid shown in FIG. 3 and 8 is placed over this to improve moisture resistance and heat dissipation. The outer periphery of the lid is made of lead metal with a thickness of 50 μm as shown in 7 in Figure 3, and a width equal to or smaller than the planar dimensions of the copper pattern shown in 4 in Figure 3.
A square piece made of tin solder is placed and passed through a glue flow furnace at 220 to 240°C to seal the metal lid and button 6 shown at 8 in Figure 3.In addition to the square piece, cream solder sealing can also be used.
以上のような実施例において、ブラＰＧＡに侵入するｌ
？気は、第３図の６及び７に示す金属層によって８断さ
れる。In the embodiments described above, l that invades the bra PGA
? The air is interrupted by the metal layers shown at 6 and 7 in FIG.
この発明は以上説明したようにプラＰＧＡのＰＣＢ端面
に金属メッキ層を設ける事により無機系封止剤を使用す
る事が可能となり、ＰＧＡに侵入する湿気を遮断し、Ｉ
Ｃの信頼性を向上させる効果がある。As explained above, this invention makes it possible to use an inorganic sealant by providing a metal plating layer on the end face of the PCB of a plastic PGA, which blocks moisture from entering the PGA and prevents moisture from entering the PGA.
This has the effect of improving the reliability of C.
第１図はこの発明にかかるプラスチック製ＰＧＡの斜視
図、第２図は従来のプラスチック製ＰＧＡの斜視図、第
３図はこの発明にかかるＰＣＢ外周縁を金属メッキし、
無機系封着剤で蓋を封着したプラＰＧＡの断面図である
。第４図はＰＣＢ内スルホール部の拡大図、第５図は従
来方法によるプラＰＧＡ及び蓋封着の断面図である。
１・・・ＰＣＢ
２゛・・ＰＣＢ外周外周端金属メッキ
３・・・ＰＣＢ上のＩＣ搭載用凹部
４・・・ＰＣＢ外周縁上の蓋封着用金属パタン５・・・
ＰＣＢ外周端面上の無電解金属メソキロ・・・上記５上
の電解金属メッキ
７・・・蓋封止用無機系封着剤
８・・・ＰＧＡ用金属蓋
９・・・ＩＣ
１０・・・ＩＣＣ出土用エポキシレジ
ン１１・・Ａｕワイヤ
１２・・・リード足
１３・・・スルーホール
１４・・・蓋封止用を機系封着剤
以上
出願人 セイコー電子工業株式会社
ＰＣＢ内スルホーノＬ剖Ｉ声ス図
第５図FIG. 1 is a perspective view of a plastic PGA according to the present invention, FIG. 2 is a perspective view of a conventional plastic PGA, and FIG. 3 is a perspective view of a plastic PGA according to the present invention.
FIG. 2 is a cross-sectional view of a plastic PGA whose lid is sealed with an inorganic sealant. FIG. 4 is an enlarged view of the through-hole portion in the PCB, and FIG. 5 is a cross-sectional view of the plastic PGA and lid sealing according to the conventional method. 1...PCB 2゛...Metal plating on the outer edge of the PCB 3...Recess for IC mounting on the PCB 4...Metal pattern for lid sealing on the outer edge of the PCB 5...
Electroless metal mesochrome on the outer peripheral end surface of PCB... Electrolytic metal plating on 5 above 7... Inorganic sealant for lid sealing 8... Metal lid for PGA 9... IC 10... ICC Excavated epoxy resin 11...Au wire 12...Lead leg 13...Through hole 14...Mechanical sealant for lid sealing Applicant Seiko Electronics Co., Ltd. Sulfono L autopsy inside PCB I voice Figure 5
Claims (2)
ラスチック製ピングリッドアレイにおいて、前記有機系
樹脂材の印刷基板外周端面及び外周部の基板両面からな
る外周縁を金属メッキで接続して被覆したことを特徴と
するプラスチック製ピングリッドアレイの構造。(1) In a plastic pin grid array based on a printed circuit board made of an organic resin material, the outer peripheral end face of the printed circuit board made of the organic resin material and the outer peripheral edge of both sides of the substrate at the outer periphery are connected and covered with metal plating. The structure of the plastic pin grid array is characterized by:
、前記有機系樹脂材の印刷基板外周縁の金属メッキ部に
無機系封止材を用いて、金属材からなる蓋を封着せしめ
たことを特徴とする特許請求の範囲第１項記載のプラス
チック製ピングリッドアレイの構造。(2) In the plastic pin grid array, an inorganic sealant is used to seal a lid made of a metal material to the metal plated portion of the outer periphery of the printed circuit board made of the organic resin material. A structure of a plastic pin grid array according to claim 1.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846886A JPS62274753A (en) | 1986-05-23 | 1986-05-23 | Structure of pin grid array package |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11846886A JPS62274753A (en) | 1986-05-23 | 1986-05-23 | Structure of pin grid array package |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS62274753A true JPS62274753A (en) | 1987-11-28 |
Family
ID=14737415
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11846886A Pending JPS62274753A (en) | 1986-05-23 | 1986-05-23 | Structure of pin grid array package |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS62274753A (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5103292A (en) * | 1989-11-29 | 1992-04-07 | Olin Corporation | Metal pin grid array package |
| EP0779657A3 (en) * | 1995-12-13 | 1998-11-11 | Oki Electric Industry Co., Ltd. | Surface-mounted semiconductor package and its manufacturing method |
-
1986
- 1986-05-23 JP JP11846886A patent/JPS62274753A/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| US5103292A (en) * | 1989-11-29 | 1992-04-07 | Olin Corporation | Metal pin grid array package |
| EP0779657A3 (en) * | 1995-12-13 | 1998-11-11 | Oki Electric Industry Co., Ltd. | Surface-mounted semiconductor package and its manufacturing method |
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