JPH0254882A - Soldering method - Google Patents
Soldering methodInfo
- Publication number
- JPH0254882A JPH0254882A JP20600188A JP20600188A JPH0254882A JP H0254882 A JPH0254882 A JP H0254882A JP 20600188 A JP20600188 A JP 20600188A JP 20600188 A JP20600188 A JP 20600188A JP H0254882 A JPH0254882 A JP H0254882A
- Authority
- JP
- Japan
- Prior art keywords
- soldering
- lead wire
- conductor
- positioning
- wire
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000005476 soldering Methods 0.000 title claims abstract description 21
- 238000000034 method Methods 0.000 title claims description 9
- 239000004020 conductor Substances 0.000 claims abstract description 22
- WABPQHHGFIMREM-UHFFFAOYSA-N lead(0) Chemical compound [Pb] WABPQHHGFIMREM-UHFFFAOYSA-N 0.000 abstract description 19
- 239000000463 material Substances 0.000 abstract description 7
- 239000000853 adhesive Substances 0.000 abstract description 5
- 230000001070 adhesive effect Effects 0.000 abstract description 5
- 230000015556 catabolic process Effects 0.000 abstract 1
- 230000000694 effects Effects 0.000 description 2
- 239000012787 coverlay film Substances 0.000 description 1
- 238000005516 engineering process Methods 0.000 description 1
- 229920003223 poly(pyromellitimide-1,4-diphenyl ether) Polymers 0.000 description 1
- 229910000679 solder Inorganic materials 0.000 description 1
- 239000000758 substrate Substances 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
Abstract
Description
【発明の詳細な説明】
〔産業上の利用分野〕
本発明は浮動型磁気ヘッドに関し、特に磁気ヘッドと信
号を増幅するＩＣ回路を実装したフレキシブルプリント
（配線）ケーブル（以下ＦＰＣという）を接続するマグ
ネットワイヤー（以下リード線という）とＦＰＣの半田
付は方法に関する。[Detailed Description of the Invention] [Field of Industrial Application] The present invention relates to a floating magnetic head, and particularly to a method for connecting a magnetic head to a flexible printed (wiring) cable (hereinafter referred to as FPC) on which an IC circuit for amplifying signals is mounted. Soldering of magnet wire (hereinafter referred to as lead wire) and FPC relates to a method.
従来、この種の浮動型磁気ヘッドの半田付は方法は第２
図（ａ） 、 （ｂ）に示すように、フレキシブル基材
１と導体３とを接着剤２により接着し、この導体３をさ
らにフレキシブル基材５と接着剤４によりはさみこんで
導体３を保護しており、磁気ヘッドからのリード線の半
田付けされる導体３の半田付は蔀６は凹凸のない平面状
であり、リード線７を人間がビンセット等で保持しなが
ら半田付けを行なっていた。Conventionally, the soldering method for this type of floating magnetic head was the second method.
As shown in Figures (a) and (b), a flexible base material 1 and a conductor 3 are bonded together with an adhesive 2, and this conductor 3 is further sandwiched between a flexible base material 5 and an adhesive 4 to protect the conductor 3. When soldering the conductor 3 to which the lead wire from the magnetic head is soldered, the lip 6 has a flat surface with no irregularities, and the lead wire 7 is soldered while being held by a person with a bottle set or the like. Ta.
上述した従来の浮動型磁気ヘッドの半田付は方法はリー
ド線を半田付けする導体が凹凸のない平面状であるため
、導体にリード線を半田付けする際の導体とリード線の
位置合せ及び固定がむずかしく、自動化・機械化が困難
という欠点があった。The method of soldering the conventional floating magnetic head described above is that the conductor to which the lead wire is soldered is flat with no irregularities, so it is difficult to align and fix the conductor and the lead wire when soldering the lead wire to the conductor. The drawback was that it was difficult to automate and mechanize.
また、半田付けの際の位置合せ及び固定がむずかしいた
め、リード線にストレスを与えやすく、信顆性を要求さ
れる浮動型磁気ヘッドにおいて、断線の危険を含むとい
う欠点があった。Furthermore, since positioning and fixing during soldering are difficult, stress is likely to be applied to the lead wires, and there is a risk of wire breakage in floating magnetic heads that require high reliability.
本発明の目的は前記課題を解決した半田付は方法を提供
することにある。An object of the present invention is to provide a soldering method that solves the above problems.
前記目的を達成するなめ、本発明はマグネットワイヤー
を導体パターンに半田付けする方法において、マグネッ
トワイヤーを、導体パターンに設けた位置決め穴に差込
んで位置決めを行い半田付けするものである。In order to achieve the above object, the present invention provides a method for soldering a magnet wire to a conductor pattern, in which the magnet wire is inserted into a positioning hole provided in the conductor pattern, positioned, and soldered.
次に、本発明について図面を参照して説明する。 Next, the present invention will be explained with reference to the drawings.
第１図（ａ）は本発明の一実施例を示すＦＰＣのリード
線半田付は部分の一部正面図、（ｂ）は第１図（ａ）の
Ａ−Ａ線断面図である０本発明はリード線７を半田付け
する導体３の半田付は部６上にリード線７を位置決め固
定する位置決め穴８を有しており、浅水８の中にリード
線７の先端を挿入することにより位置決め固定し、リー
ド線７を導体３の半田付は部６に半田付けするものであ
る０図中、２は接着剤、１，５はフレキシブル基材であ
り、これらは従来と同じ構成である。FIG. 1(a) is a front view of a part of an FPC lead wire soldering section showing an embodiment of the present invention, and FIG. 1(b) is a cross-sectional view taken along line A-A in FIG. 1(a). The present invention has a positioning hole 8 for positioning and fixing the lead wire 7 on the soldering part 6 of the conductor 3 to which the lead wire 7 is soldered, and by inserting the tip of the lead wire 7 into shallow water 8. Position and fix, and solder the lead wire 7 to the part 6 of the conductor 3. In the figure, 2 is an adhesive, and 1 and 5 are flexible base materials, which have the same structure as the conventional one. .
本発明は半田付は部６の位置決め穴８によりリード線７
を位置決め固定するため、半田付けが容易に、しかも自
動的・機械的に行うことが可能となる。In the present invention, the lead wire 7 is soldered by the positioning hole 8 of the part 6.
Since the parts are positioned and fixed, soldering can be easily done automatically and mechanically.
尚、実施例では導体パターンとしてフレキシブル基材１
を用いたが、フレキシブルカプトンフィル基板、導体及
びカバーレイフィルムよりなるフレキシブルプリントケ
ーブル等を用いてもよい。In addition, in the example, the flexible base material 1 is used as the conductor pattern.
However, a flexible printed cable made of a flexible Kapton fill substrate, a conductor, and a coverlay film, etc. may also be used.
以上説明したように本発明はリード線を導体に半田付け
する際にリード線を位置決め固定して半田付けすること
により、自動化１機械化が容易に実現可能となり、高い
経済性を実現できる。また、半田付けの際の位置合せ及
び固定が可能となるなめ、リード線にストレスを与える
機会が減少し、信頼性を要求される浮動型磁気ヘッドに
おいて、断線の危険を減少できる効果を有する。As explained above, in the present invention, by positioning and fixing the lead wires and soldering them to the conductor, automation 1 mechanization can be easily realized and high economic efficiency can be realized. Furthermore, since positioning and fixing during soldering are possible, there is less chance of applying stress to the lead wires, which has the effect of reducing the risk of wire breakage in floating magnetic heads that require reliability.
第１図（ａ）は本発明の一実施例のリード線とＦＰＣ導
体半田付は部分を示す正面図、（ｂ）は第１図（ａ）の
Ａ−Ａ＠＠面図、第２図（ａ）は従来の浮動型磁気ヘッ
ドに使用されているリード線とＲＰＣ導体半田付は部分
を示す正面図、（ｂ）は第１図（ａ）のＡ−Ａｉ断面図
である。
１．５・・・フレキシブル基材
２．４・・・接着剤 ３・・・導体７・・・リー
ドＩＮ Ｓ・・・位置決め穴第１図FIG. 1(a) is a front view showing the lead wire and FPC conductor soldering portion of an embodiment of the present invention, FIG. 1(b) is an A-A @@ side view of FIG. 1(a), and FIG. 1(a) is a front view showing the lead wire and RPC conductor soldering used in a conventional floating magnetic head, and FIG. 1(b) is a sectional view taken along line A-Ai in FIG. 1(a). 1.5...Flexible base material 2.4...Adhesive 3...Conductor 7...Lead IN S...Positioning hole Fig. 1
Claims (1)
る方法において、マグネットワイヤーを、導体パターン
に設けた位置決め穴に差込んで位置決めを行い半田付け
することを特徴とする半田付け方法。(1) A method of soldering a magnet wire to a conductor pattern, which is characterized in that the magnet wire is inserted into a positioning hole provided in the conductor pattern, positioned, and soldered.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20600188A JPH0254882A (en) | 1988-08-19 | 1988-08-19 | Soldering method |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP20600188A JPH0254882A (en) | 1988-08-19 | 1988-08-19 | Soldering method |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPH0254882A true JPH0254882A (en) | 1990-02-23 |
Family
ID=16516264
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP20600188A Pending JPH0254882A (en) | 1988-08-19 | 1988-08-19 | Soldering method |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPH0254882A (en) |
-
1988
- 1988-08-19 JP JP20600188A patent/JPH0254882A/en active Pending
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