JPS59167087A - Method of bonding hybrid ic substrate - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION (Field of Industrial Application) The present invention relates to a hybrid IC board bonding method that can be used for bonding circuit boards of electrical equipment.

(Conventional structure and its problems) Conventionally, when the electrodes of a circuit board, which have large differences in thermal expansion coefficient and hygroscopic expansion coefficient, are directly soldered together.

Due to changes in environmental temperature and humidity, the stress caused by the difference in the amount of J' method applied to each other is applied as shear stress to the soldered parts, which may cause cracks in the soldered joint or peeling of the electrode part of the circuit board. It was common for this to happen.

(Object of the Invention) The present invention prevents the above-mentioned drawbacks, maintains a constant distance between the wires placed between the electrodes of mutually soldered circuits, and can be formed all at once. It has been made possible.

(Structure of the Invention) The present invention comprises a hybrid IC substrate having a ceramic or metal substrate and a material having a significantly different coefficient of expansion due to heat or moisture absorption, such as a resin-laminated steel laminated printed wiring board.
In order to connect two boards by soldering, first, metal wires are arranged and fixed to the circuit electrodes of the hybrid IC board and then soldered, and the resin laminated steel printed wiring board side has a slit into which the hybrid IC board fits. A circuit electrode is provided near the slit, a side substrate is fitted thereto, and the other end of the metal wire and the circuit electrode provided near the slit are soldered together.

(Description of Embodiments) FIG. 1 is a perspective view showing the structure of an embodiment of a hybrid + 4 is an electrically insulating fixing tape.

First, a circuit is formed on the hybrid IC board 1 by thick film printing or the like, and a plurality of circuit electrodes 2 are provided at the ends for connection to other circuit boards.

Next, after applying paste solder to the circuit electrode 2,
A plurality of metal wires 3 having a predetermined length and a round or flat cross section are lined up in the same number as the circuit electrodes 2 at the same spacing as the electrode spacing, and the center portion is attached to the hybrid IC board using an electrically insulating fixing tape 4. In this state, one end of the metal wire 1ffA'3 is placed on top of the circuit electrode 2 and heated, and the metal wire 3
A circuit electrode 2 is soldered to one end of the circuit electrode 7.

Next, as shown in FIG. 2, after inserting the hybrid IC board 1 into the slit of the resin-laminated steel printed wiring board 5 on which the slits 1 to 1 to which the prepared hybrid IC board 1 is fitted are formed, soldered metal wire 3
The other end and the circuit electrode 6 provided in the vicinity of the slit of the substrate 5 are soldered to complete the bonding. Note that 7 in the figure indicates the soldered part.

Figure 3 shows the cross-sectional structure of the hybrid IC board at the position of the circuit electrode 2, in which (a) shows a round metal wire;
(b) shows the case where a metal wire with a flat cross section is used.

(Effects of the Invention) As explained above, in the joining method of the present invention, the shear stress applied to the soldering parts due to the size change of the mutual substrates is not applied directly to the parts, and the metal wires are not directly applied to the soldering parts. Soldering has the advantage of making the part extremely stable against changes in environmental temperature and humidity, and when a flat cross section is used for the metal wire, when fixed at regular intervals with insulating tape, It has the advantage of being able to improve the viscosity of

[Brief explanation of drawings]

FIG. 1 is a perspective view showing the configuration of an embodiment of a hybrid IC board used in the present invention, FIG. 2 is a cross-sectional view showing a bonded state of the hybrid IC board and a resin-laminated steel-covered printed wiring board, and FIG. FIG. 3 is a cross-sectional view showing the relationship between the circuit electrode portion of the hafbrid IC board and the metal wire. 1...Hybrid IC board, 2, 6...Circuit electrode, 3...Metal wire, 4...Electrically insulating fixing tape, 5...Resin laminated steel laminated printed wiring board, 7...Soldered Part 6 Figure 1 Figure 2 Figure 3 (al (b)

Claims (2)

[Claims] (1) In the method of joining by soldering between a hybrid IC board made of ceramic or metal, etc. and a rewiring board, such as a resin-laminated copper-clad printed wiring board, which has a significantly different coefficient of expansion due to heat or moisture absorption, an appropriate length can be used. The cut metal wire is fixed to the hybrid IC board with an electrically insulating tape-like substance at a predetermined interval in the center of the wafer, and one end of the metal wire is connected to the circuit electrode provided at the end of the hybrid IC board. For soldering, insert the connected thing into the slit 1 hole of the resin laminated copper-clad printed wiring board that has the slit hole to which the hybrid IC board fits.
A method for joining a hybrid IC board, comprising soldering a circuit electrode provided near the slit hole to the other end of the metal wire. (2) A method for bonding hybrid IC substrates according to claim (1), characterized in that the metal wire has a flat cross section.