JPS58103160A - Remounting of tape carrier - Google Patents

Remounting of tape carrier

Info

Publication number
JPS58103160A
JPS58103160A JP20395781A JP20395781A JPS58103160A JP S58103160 A JPS58103160 A JP S58103160A JP 20395781 A JP20395781 A JP 20395781A JP 20395781 A JP20395781 A JP 20395781A JP S58103160 A JPS58103160 A JP S58103160A
Authority
JP
Japan
Prior art keywords
tape carrier
bonding
wiring
wirings
positions
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP20395781A
Other languages
Japanese (ja)
Inventor
Takayuki Yamaguchi
隆行 山口
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ricoh Co Ltd
Original Assignee
Ricoh Co Ltd
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ricoh Co Ltd filed Critical Ricoh Co Ltd
Priority to JP20395781A priority Critical patent/JPS58103160A/en
Publication of JPS58103160A publication Critical patent/JPS58103160A/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L23/00—Details of semiconductor or other solid state devices
    • H01L23/48—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor
    • H01L23/488—Arrangements for conducting electric current to or from the solid state body in operation, e.g. leads, terminal arrangements ; Selection of materials therefor consisting of soldered or bonded constructions
    • H01L23/498—Leads, i.e. metallisations or lead-frames on insulating substrates, e.g. chip carriers
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/0002—Not covered by any one of groups H01L24/00, H01L24/00 and H01L2224/00
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/225—Correcting or repairing of printed circuits
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/30—Assembling printed circuits with electric components, e.g. with resistor
    • H05K3/32—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits
    • H05K3/34—Assembling printed circuits with electric components, e.g. with resistor electrically connecting electric components or wires to printed circuits by soldering
    • H05K3/341—Surface mounted components
    • H05K3/3421—Leaded components

Landscapes

  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Electric Connection Of Electric Components To Printed Circuits (AREA)
  • Wire Bonding (AREA)

Abstract

PURPOSE:To enable to increase the number of times of remounting of the tape carrier, and to form a electrode pattern in a simple shape by a method wherein the different tape carrier provided with tape carrier wirings to make the bonding positions of tape carrier wirings and electrodes as to come to the different positions from the original bonding positions is used. CONSTITUTION:The tape carrier 17 having the same shape of the wirings 8 as compared with the original tape carrier 19, but having length of the tape carrier long, and having the parts to be bonded with the wirings 18 to the electrodes 16 as to come to the positions on the line (b) separated by the distance L2 from the original positions is used. By mounting the tape carrier 17, the bonding parts of the electrodes 16 and the wirings 18 are transferred to the new positions 14 separated from the original positions 12 by the distance L2, and the new bonding parts are formed. While although the bonding parts 13 of the wirings 8 and outside wirings 9 are formed at the original positions again, because bonding is performed by soldering of the fellow copper wirings, bonding can be performed again even at the same positions.

Description

【発明の詳細な説明】 本発明は、サーマルヘッドや等倍イメージセンサ−の如
き混成集積化された素子に、Ｉ（４−搭載し友テープキ
ャリア全突装する際の再実装方法に関する。DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a remounting method when a hybrid integrated device such as a thermal head or a 1-magnification image sensor is mounted with an I (4) and a tape carrier is fully loaded.

サーマルヘッドなど、多数の！極を有する素子をＩＣ（
本明細書ではＬＳＩなども含めて集積回路一般１２ＩＣ
と称す）で駆動する方式の装置において、ＩＣを搭載し
たテープキャリアを素子の電極と外部配線との間に接続
した装置が知られている。そのような装置において、テ
ープキャリアの配線と素子の電極あるいは外部配線との
ボンディングに失敗した場合、又はそれらのポンディン
グ後にＩＣの不良が発見された場合には、そのテープキ
ャリアを素子及び外部配線から剥離し、再度テープキャ
リアを実装しなければならない。Many such as thermal heads! An element with a pole is an IC (
In this specification, 12 ICs in general including LSI etc.
There is known a device driven by a device in which a tape carrier on which an IC is mounted is connected between an electrode of an element and an external wiring. In such devices, if bonding between the tape carrier wiring and the element electrodes or external wiring fails, or if a defective IC is discovered after bonding, the tape carrier is bonded to the element and external wiring. The tape carrier must be removed and remounted.

第１図にテープキャリアの再実装を考慮した従来のサー
マルヘッドの分解斜視図を示す。図において、ｌはセラ
ミックの基板で、その基板ｌ上には鎖線で囲まれた領域
２に配列される発熱抵抗体と、それらの各発熱抵抗体に
連結している多数の金電極８が設けられている。図では
４本の電極８のみが示されているが、実際にはもつと多
数存在する。電極８はＬ字形にパターン形成され、テー
プキャリア４の配線５とはその折曲部分６においてボン
ディングされる。テープキャリア４はＩＣ７ｆ：搭載し
、そのＩＣ７に接続されると共に端部がテープキャリア
側縁から突出している配線５及び８を備えて仏る。配線
５及び８は銅で形成されているが、配線５の電極８とボ
ンディングされる部分には錫メッキが施され、また配線
８の外部配線９とボンディングされる部分には半田メッ
キが施されている。ｌＯは表面に銅の外部配線９を有す
るガラスエポキシ基板である。FIG. 1 shows an exploded perspective view of a conventional thermal head in consideration of remounting of the tape carrier. In the figure, l is a ceramic substrate, and on the substrate l, heating resistors arranged in an area 2 surrounded by a chain line and a large number of gold electrodes 8 connected to each of the heating resistors are provided. It is being Although only four electrodes 8 are shown in the figure, there are actually many electrodes 8. The electrode 8 is patterned into an L-shape and is bonded to the wiring 5 of the tape carrier 4 at its bent portion 6. The tape carrier 4 is equipped with an IC 7f, and is connected to the IC 7 and has wiring lines 5 and 8 whose ends protrude from the side edge of the tape carrier. The wires 5 and 8 are made of copper, but the portion of the wire 5 that is bonded to the electrode 8 is plated with tin, and the portion of the wire 8 that is bonded to the external wire 9 is plated with solder. ing. IO is a glass epoxy substrate having copper external wiring 9 on its surface.

二点鎖線で示される領域ｌｌは、テープキャリア４が最
初に実装されていた位置を示し、そのときのチーツーキ
ャリア４の配線５と電極８の折曲部分６とのボンディン
グ部分は記号１２で表わされる部分であり、またテープ
キャリア４の配線８と外部配線９とのポンディング部分
は記号１８で表わされる部分であったとする。Region ll indicated by a two-dot chain line indicates the position where the tape carrier 4 was initially mounted, and the bonding portion between the wiring 5 of the Qi-two carrier 4 and the bent portion 6 of the electrode 8 at that time is indicated by symbol 12. It is assumed that the bonding portion between the wiring 8 of the tape carrier 4 and the external wiring 9 is a portion represented by the symbol 18.

ここで、ボンディングの失敗やＩＣの不良により、一度
ボンデイングにより実装したテープキャリアを剥離し、
再度実装しなおすとする。ポンディング部１８は半田付
けされているだけであるの可能である。しかし、ボンデ
ィング部１２には金−錫共晶が生じているので、剥離後
電極３の同一場所への再ポンディングが困難となり、特
に、電極密度が高くなると、電極３やテープキャリア配
線５が細くなり、ポンディング部１２の剥離の際に電極
８が基板ｌから剥離したり、テープキャリア配線５が切
断したりするため、剥離後電極８の同一場所への再ポン
ディングは殆ど不可能となる。Here, due to bonding failure or IC failure, the tape carrier that was once mounted by bonding is peeled off.
Let's try implementing it again. It is possible that the bonding part 18 is only soldered. However, since gold-tin eutectic occurs in the bonding part 12, it becomes difficult to re-bond the electrode 3 to the same place after peeling, and especially when the electrode density becomes high, the electrode 3 and the tape carrier wiring 5 When the bonding portion 12 is peeled off, the electrode 8 may be peeled off from the substrate l or the tape carrier wiring 5 may be cut, so it is almost impossible to re-pond the electrode 8 to the same location after peeling off. Become.

そこで、テープキャリアの再実装の際は、電極８とテー
プキャリア配線５との新しいポンディング部が元のポン
ディング部１２から適当な距離Ｌ１だけ離れた位置１４
に来るように、同じテープキャリア７を電極８の折曲部
６に沿って距離Ｌｌ゛だけ移動させた後にボンディング
を行なっている。Therefore, when remounting the tape carrier, the new bonding portion between the electrode 8 and the tape carrier wiring 5 is placed at a position 14 that is an appropriate distance L1 away from the original bonding portion 12.
Bonding is performed after the same tape carrier 7 is moved by a distance Ll' along the bending part 6 of the electrode 8 so that the same tape carrier 7 reaches the position shown in FIG.

このときテープキャリア配線８と外部配線９とのポンデ
ィング部の位置も、元の位置１３から新しい位置１５へ
と距離Ｌｔだけ移動する。At this time, the position of the bonding portion between the tape carrier wiring 8 and the external wiring 9 also moves from the original position 13 to the new position 15 by a distance Lt.

しかしながら、サーマルヘッドや等倍イメージセンサ−
などにおいては電極８及びテープキャリア４が左右に繰
り返して配列されるので、上記の従来方法では電極８の
折曲部６を長くすることができず、したがって再ポンデ
ィングの回数が１〜２回に制約される問題がある。さら
に、電極８が折曲部６を有するため、電極パターンが複
雑となシコストが上昇し歩留りが低下するなど、製造上
も問題がおる。However, thermal heads and life-size image sensors
In such cases, the electrodes 8 and tape carriers 4 are arranged repeatedly from side to side, so the above conventional method cannot lengthen the bent portions 6 of the electrodes 8, and therefore the number of re-ponding is 1 to 2 times. There is a problem with restrictions on Further, since the electrode 8 has the bent portion 6, there are also manufacturing problems, such as a complicated electrode pattern, which increases cost and reduces yield.

本発明は、上記問題点に鑑み、再実装回数を多くするこ
とができると共に、電極パターンを単純な形状にするテ
ープキャリアの再実装方法を提供することを目的とする
ものである。SUMMARY OF THE INVENTION In view of the above-mentioned problems, it is an object of the present invention to provide a tape carrier remounting method that can increase the number of times of remounting and has a simple electrode pattern.

すなわち、本発明は電極めボンディングを行なう部分を
外部配線方向にほぼ直角方向の直線部分とすると共に、
一度寮装したテープキャリアを剥離して再実装するとき
は、テープキャリア配線と電極とのボンディング位置が
元のボンディング位置と：ま異なる位置にくるようなテ
ープキャリア配線を備えた別のテープキャリアを用いる
ことにより、上記目的を達成せんとするものである。That is, in the present invention, the portion where electrode bonding is performed is a straight portion substantially perpendicular to the external wiring direction, and
When peeling off and remounting a tape carrier that has been installed in a dormitory, use another tape carrier with tape carrier wiring so that the bonding position between the tape carrier wiring and the electrode is different from the original bonding position. By using this, the above objective is achieved.

以下、−冥施例により本発明の詳細な説明する。Hereinafter, the present invention will be explained in detail with reference to examples.

第２図は一実施例の分解斜視図であり、基板１上に設け
られている電極１６は直線部分のみからなり、第１図の
如き折曲部６を備えていない。電極１６と外部配線９と
は互いにほぼ直交し、厳密に９０度であることは必ずし
も必要ではないが、テープキャリア実装上から９０度に
近い方が好ましい。テープキャリア１７の配線のうち、
電極１６とボンディングされる配線１８は、電極１６と
平行で、その端部がテープキャリア１７の端部から突出
するように配列されている。テープキャリア１７の他の
配線８、外部配線９などその他の構造は第１図に示した
ものと同じである。FIG. 2 is an exploded perspective view of one embodiment, in which the electrode 16 provided on the substrate 1 consists only of straight parts and does not have the bent part 6 as shown in FIG. The electrode 16 and the external wiring 9 are substantially orthogonal to each other, and although it is not necessarily necessary that the angle be exactly 90 degrees, it is preferable that the angle be close to 90 degrees from the viewpoint of mounting the tape carrier. Among the wiring of tape carrier 17,
The wiring 18 to be bonded to the electrode 16 is arranged parallel to the electrode 16 so that its end protrudes from the end of the tape carrier 17. The other structures of the tape carrier 17, such as the other wiring 8 and the external wiring 9, are the same as those shown in FIG.

本実施例において、最初に二点鎖線で示されるテープキ
ャリア１９が実装されていたものとする。In this embodiment, it is assumed that the tape carrier 19 indicated by the two-dot chain line is initially mounted.

そのとき、テープキャリア１９の配線１８が電極１６と
ボンディングされる部分が１線位置にあり、電１ｉｉ１
６とのポンディング部分が記号１２で示される位置にあ
ったとする。そしてテープキャリア１９の他の配線８と
外部配線９とのポンディング部は記号１８で示される位
置にあったものとする。At that time, the portion of the tape carrier 19 where the wiring 18 is bonded to the electrode 16 is at the 1st line position, and the electrode 1ii1
Assume that the bonding portion with 6 is located at the position indicated by symbol 12. It is assumed that the bonding portion between the other wiring 8 of the tape carrier 19 and the external wiring 9 is located at a position indicated by symbol 18.

いま、テープキャリア１９の実装にボンディングの失敗
があったり、実装後、ＩＣの不良が発見されたりして、
テープキャリア１９１！Ｉ：剥離し、再びテープキャリ
アｌ’装するものとする。本実施例では、再実装のテー
プキャリアとして、第２図に示す如く、元のテープキャ
リア１９と比べて配線８の形状は同じであるが、テープ
キャリアの長さが艮り、そして配線１８が電極１６とボ
ンディングされる部分が元の位置からＬ２離れたｂ線位
置に来るようなテープキャリア１７ｉ使用する。Currently, there is a bonding failure when mounting the tape carrier 19, or a defective IC is discovered after mounting.
Tape carrier 191! I: Peel off and reinstall tape carrier l'. In this embodiment, as a remounted tape carrier, as shown in FIG. 2, the shape of the wiring 8 is the same as that of the original tape carrier 19, but the length of the tape carrier is increased, and the wiring 18 is A tape carrier 17i is used such that the part to be bonded to the electrode 16 is located at the b-line position, which is L2 away from the original position.

このテープキャリアｌ’ｌ実装すれば、電極１６と配線
１８とのボンディング部は元の位置１２からＬ２離れた
新しい位置１４へと移動して、新たなボンディングが形
成される。一方、配線８と外部配線９とのボンディング
部１８は、元の位置に再び形成されるが、このボンディ
ングは銅配線同士の半田付けであるので同一位置でも再
ボンディングが形成される。When this tape carrier l'l is mounted, the bonding portion between the electrode 16 and the wiring 18 moves from the original position 12 to a new position 14 separated by L2, and a new bond is formed. On the other hand, the bonding portion 18 between the wiring 8 and the external wiring 9 is formed again at the original position, but since this bonding is done by soldering the copper wirings together, the bonding is also formed at the same position.

本発明では、再実装されるテープキャリアとして、テー
プ形状が元のテープキャリア１９と同じを用いてもよい
。また、配線８の長さも元のテープキャリア１９と異な
るテープキャリアを用いてもよい。In the present invention, a tape carrier having the same shape as the original tape carrier 19 may be used as the remounted tape carrier. Further, a tape carrier may be used in which the length of the wiring 8 is different from that of the original tape carrier 19.

以上詳述した如く、本発明は電極のボンディングを行な
う部分を外部配線方向にほぼ直角方向の直線部分とする
と共に、再実装されるテープキャリアとして、テープキ
ャリア配線とｍＷとのボンディング位置が元のボンディ
ング位置とは異なる位置にくるようなテープキャリア配
線を備えた別のテープキャリアを用いるようにしたもの
で、電極とテープキャリア配線とのボンディングのやり
直しを行なう部分は外部配線方向にほぼ直角方向の直線
部分となり、この直線部分の方向は実装密度とは無関係
な方向であるので、その長さく第２図ではり。）を十分
に長くすることができ、したがってボンディングのやＶ
直しを多数回行なうことができる。また、電極パターン
を直線部分だけの単純なパターンとすることができるの
で、素子の製造コヌトを低下させ、歩留Ｖｔ向上させる
ことができる。As described in detail above, the present invention makes the part where the electrode is bonded a straight part that is approximately perpendicular to the direction of the external wiring, and the bonding position between the tape carrier wiring and mW is set to the original position as the tape carrier is remounted. A separate tape carrier with tape carrier wiring placed at a different position from the bonding position is used, and the part where the bonding between the electrode and the tape carrier wiring is to be re-bonded is placed almost perpendicular to the external wiring direction. The direction of this straight line is unrelated to the packaging density, so its length is the beam in Figure 2. ) can be made long enough so that the bonding and V
Repairs can be made multiple times. Moreover, since the electrode pattern can be made into a simple pattern with only straight line portions, the manufacturing cost of the device can be reduced and the yield Vt can be improved.

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のテープキャリア再実装方法を示す分解斜
視断面図、第２図は本発明の一実施例を示す分解斜視断
面図士ある。 ３．１６・・・電極、　４．１７・・・再実装されるテ
ープキャリア、　５．８．１８・・・テープキャリア配
線、　７・・・ＩＣ，ｇ・・・外部配線、　１１．１９
・・・元のテープキャリア、　１２．１８・・・元のボ
ンディング位置、　１４．１５・・・新たなボンディン
グ位置。 特許出願人　株式会社リコー 代理人弁珊士青山葆外２名 第１ＩＩ 第２図FIG. 1 is an exploded perspective sectional view showing a conventional tape carrier remounting method, and FIG. 2 is an exploded perspective sectional view showing an embodiment of the present invention. 3.16... Electrode, 4.17... Tape carrier to be remounted, 5.8.18... Tape carrier wiring, 7... IC, g... External wiring, 11.19
...original tape carrier, 12.18...original bonding position, 14.15...new bonding position. Patent Applicant: Ricoh Co., Ltd. Agent and Attorney, 2 Aoyama Sogai No. 1 II Figure 2

Claims (1)

【特許請求の範囲】[Claims] （１）　　複数の電極を有する索子と外部配線とを、Ｉ
ＣＩ搭載したテープキャリアを介して接続してなる装置
において、前記電極とテープキャリア配線とをポンディ
ングする部分を前記外部配線方向にほぼ直角方向の直線
部分とすると共に、既に実装された前記テープキャリア
を剥離して再実装するときは、前記電極とテープキャリ
ア配線とのボンディング位置が元のボンディング位置と
は異なる位置にくるようなテープキャリア配線會備えた
別のテープキャリアを用いることを特徴とするテープキ
ャリアの再実装方法。(1) Connect a cable having a plurality of electrodes and external wiring to an I
In a device that is connected via a tape carrier equipped with a CI, the part where the electrode and the tape carrier wiring are bonded is a straight part that is substantially perpendicular to the external wiring direction, and the tape carrier that is already mounted When peeling off and remounting, another tape carrier is used that has a tape carrier wiring arrangement such that the bonding position between the electrode and the tape carrier wiring is different from the original bonding position. How to remount the tape carrier.
JP20395781A 1981-12-16 1981-12-16 Remounting of tape carrier Pending JPS58103160A (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP20395781A JPS58103160A (en) 1981-12-16 1981-12-16 Remounting of tape carrier

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP20395781A JPS58103160A (en) 1981-12-16 1981-12-16 Remounting of tape carrier

Publications (1)

Publication Number Publication Date
JPS58103160A true JPS58103160A (en) 1983-06-20

Family

ID=16482456

Family Applications (1)

Application Number Title Priority Date Filing Date
JP20395781A Pending JPS58103160A (en) 1981-12-16 1981-12-16 Remounting of tape carrier

Country Status (1)

Country Link
JP (1) JPS58103160A (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01170028A (en) * 1987-12-25 1989-07-05 Hitachi Ltd Semiconductor device

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH01170028A (en) * 1987-12-25 1989-07-05 Hitachi Ltd Semiconductor device

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