JPS60104248A - 化学銅めつき液中のキレ−ト剤濃度測定法 - Google Patents
化学銅めつき液中のキレ−ト剤濃度測定法Info
- Publication number
- JPS60104248A JPS60104248A JP59137118A JP13711884A JPS60104248A JP S60104248 A JPS60104248 A JP S60104248A JP 59137118 A JP59137118 A JP 59137118A JP 13711884 A JP13711884 A JP 13711884A JP S60104248 A JPS60104248 A JP S60104248A
- Authority
- JP
- Japan
- Prior art keywords
- concentration
- chelating agent
- copper
- plating solution
- chemical
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
Classifications
-
- G—PHYSICS
- G01—MEASURING; TESTING
- G01N—INVESTIGATING OR ANALYSING MATERIALS BY DETERMINING THEIR CHEMICAL OR PHYSICAL PROPERTIES
- G01N31/00—Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods
- G01N31/16—Investigating or analysing non-biological materials by the use of the chemical methods specified in the subgroup; Apparatus specially adapted for such methods using titration
- G01N31/162—Determining the equivalent point by means of a discontinuity
- G01N31/164—Determining the equivalent point by means of a discontinuity by electrical or electrochemical means
Landscapes
- Health & Medical Sciences (AREA)
- Chemical & Material Sciences (AREA)
- Life Sciences & Earth Sciences (AREA)
- Physics & Mathematics (AREA)
- Electrochemistry (AREA)
- Molecular Biology (AREA)
- Chemical Kinetics & Catalysis (AREA)
- Analytical Chemistry (AREA)
- Biochemistry (AREA)
- General Health & Medical Sciences (AREA)
- General Physics & Mathematics (AREA)
- Immunology (AREA)
- Pathology (AREA)
- Chemically Coating (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59137118A JPS60104248A (ja) | 1984-07-04 | 1984-07-04 | 化学銅めつき液中のキレ−ト剤濃度測定法 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP59137118A JPS60104248A (ja) | 1984-07-04 | 1984-07-04 | 化学銅めつき液中のキレ−ト剤濃度測定法 |
Related Parent Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP6333777A Division JPS53149389A (en) | 1977-06-01 | 1977-06-01 | Measurement method of copper ions and chelating agent concentration in chemical copper plating solution |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS60104248A true JPS60104248A (ja) | 1985-06-08 |
| JPS6143660B2 JPS6143660B2 (enrdf_load_stackoverflow) | 1986-09-29 |
Family
ID=15191243
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP59137118A Granted JPS60104248A (ja) | 1984-07-04 | 1984-07-04 | 化学銅めつき液中のキレ−ト剤濃度測定法 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS60104248A (enrdf_load_stackoverflow) |
Cited By (4)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007517186A (ja) * | 2003-06-13 | 2007-06-28 | シャーリット,ユージン | 無電解めっき浴における錯化剤濃度の測定 |
| US8118988B2 (en) * | 2008-01-31 | 2012-02-21 | Eci Technology, Inc. | Analysis of copper ion and complexing agent in copper plating baths |
| JP2017122650A (ja) * | 2016-01-07 | 2017-07-13 | 株式会社ニイタカ | キレート剤の定量方法 |
| CN107202831A (zh) * | 2017-06-05 | 2017-09-26 | 深圳市华星光电技术有限公司 | 一种铜酸刻蚀液中铜离子浓度的测定方法 |
Families Citing this family (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| KR101924107B1 (ko) * | 2017-04-07 | 2018-11-30 | 금호타이어 주식회사 | 반 공기입 타이어 |
-
1984
- 1984-07-04 JP JP59137118A patent/JPS60104248A/ja active Granted
Cited By (5)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007517186A (ja) * | 2003-06-13 | 2007-06-28 | シャーリット,ユージン | 無電解めっき浴における錯化剤濃度の測定 |
| EP1634069B1 (en) * | 2003-06-13 | 2008-11-19 | Eugene Shalyt | Measurement of complexing agent concentration in an electroless plating bath |
| US8118988B2 (en) * | 2008-01-31 | 2012-02-21 | Eci Technology, Inc. | Analysis of copper ion and complexing agent in copper plating baths |
| JP2017122650A (ja) * | 2016-01-07 | 2017-07-13 | 株式会社ニイタカ | キレート剤の定量方法 |
| CN107202831A (zh) * | 2017-06-05 | 2017-09-26 | 深圳市华星光电技术有限公司 | 一种铜酸刻蚀液中铜离子浓度的测定方法 |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6143660B2 (enrdf_load_stackoverflow) | 1986-09-29 |
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