JPS599995A - Method of mounting part of hybrid integrated circuit device - Google Patents

Abstract

(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for attaching components to both sides of a circuit board of a hybrid integrated circuit device, and particularly provides a method effective for high-density packaging of a hybrid integrated circuit device.

When increasing the degree of integration of a hybrid integrated circuit device, a method is used to increase the degree of integration by attaching chip components without lead wires, LSIs such as flat packages, etc. to both sides of the circuit board inside the hybrid integrated circuit device. . The conventional method will be described below with reference to FIG. An adhesive layer is applied to one surface of a circuit board 1 having an electrode 2 to which a component is attached, a chip component 4 is mounted, the adhesive 6 is hardened, and the chip component 4 is fixed. Next, an adhesive 6' is applied to the other side in the same manner, a surface-mounted component 6 such as a flat package is placed thereon, the adhesive 6' is cured, and the surface-mounted component 6 is fixed. Next, after inserting the external leads 7 into the circuit board on which components have been mounted, the mounted components and external leads are soldered by immersing them in molten solder, and then covered with an exterior resin (not shown) to produce a hybrid integrated circuit device. was. However, surface mounted part 6 is LSI
If you have a large number of leads such as
Solder touches occur between the lead parts of the SI, which requires a lot of work to repair.Also, it requires a lot of man-hours because it requires applying adhesive to both sides of the circuit board.

The purpose of the present invention is to reduce the process of applying adhesive and to
It is an object of the present invention to provide a component mounting method for a hybrid integrated circuit device that completely eliminates solder touch failures in components having a large number of leads.

The above purpose is to apply an adhesive to one side of a circuit board to fix the parts, dip it into a molten solder bath and solder it, and at the same time apply solder to the electrodes on the other side. Next, an embodiment of the present invention, which can be achieved by placing a component such as an LSI on the soldered part, heating it, and making a solder connection, will be described below with reference to FIGS. 2 and 3. Figure 2 shows chip components mounted on one side of the circuit board.
FIG. 3 is a diagram illustrating this embodiment in which an LSI is mounted on the other surface and connected by solder, following FIG. 2, and 1 is a circuit board, 2t ,
2r+ is an electrode, 5″ is a connecting agent, 4′ is a chip component, 5′
, 5'' is solder, 6' is LSI, and 7' is an external lead.

In FIG. 2, the chip component 4 on one side of the circuit board 1'
Adhesive 6'' is applied to the place where the chip 4' is to be mounted, and the chip component 4' is mounted thereon.The adhesive 3'' is then cured and the chip component 4' is fixed. Next, the external lead 7' is inserted into the circuit board 1' on which the chip component 4' is mounted, and immersed in the VC in a molten solder bath, and the electrode 2' and the chip component 4' are connected by soldering 5'.
and connect the external lead 7'. At this time, circuit board 1'
Solder 5# is attached to the electrode 2'' on the other side of the board in the form of pick-up solder.Next, as shown in Figure 46, the lead of LSI 6' is mounted to match the electrode 2#, and the solder is applied with heat. By melting 5#, soldering is performed to connect the leads of J and SI 6' and electrode 2#.After that, an exterior resin is applied to complete the hybrid integrated circuit device.

In other words, since the chip component 4' is fixed to one side of the circuit board 1' with an adhesive 6' and dipped in solder, the solder 5'' is attached to the electrode 2'' on the other side. This Santa 5″ 1 is it 4
Since it is defined as a certain amount by the pattern shape of k2'', LS
Since only the lead portion of I is soldered, there is no risk of short-circuiting between the leads of the LSI, and soldering defects can be completely eliminated.

According to the present invention, when components are mounted on both sides of a circuit board, the components on one side (σ) are connected by solder dipping, and at the same time the other side is polarized and soldered. There are no soldering defects between the leads, and the process of applying adhesive is reduced, resulting in fewer man-hours.

[Brief explanation of the drawing]

FIG. 1 is a cross-sectional view of a circuit board with mounted components assembled according to a conventional technique, and FIGS. 2 and 6 are cross-sectional views of a circuit board with mounted components assembled according to an embodiment of the present invention. 1'...Circuit board 3''...Adhesive 4'...
Chip parts 6', LSI-43 (30 years old)

Claims (1)

[Claims] In a method for attaching mounted components to both sides of a circuit board of a hybrid integrated circuit, first, the mounted components are fixed to one side of the circuit board with an adhesive, dipped in molten solder to be soldered, and simultaneously attached to the other side of the circuit board. The mounting components on the surface are soldered to the electrodes to be soldered. Second, the mounting components are placed on the soldered electrodes, and then heated to melt the solder and attach an electrical wire to the circuit board. A method for attaching components of a hybrid integrated circuit device, characterized in that the components are joined together.