JPS5991694U - Infrared heat treatment equipment - Google Patents

Infrared heat treatment equipment

Info

Publication number
JPS5991694U
JPS5991694U JP18882982U JP18882982U JPS5991694U JP S5991694 U JPS5991694 U JP S5991694U JP 18882982 U JP18882982 U JP 18882982U JP 18882982 U JP18882982 U JP 18882982U JP S5991694 U JPS5991694 U JP S5991694U
Authority
JP
Japan
Prior art keywords
heat treatment
treatment equipment
infrared heat
semiconductor substrate
support stand
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP18882982U
Other languages
Japanese (ja)
Inventor
山仲 格
Original Assignee
松下電子工業株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 松下電子工業株式会社 filed Critical 松下電子工業株式会社
Priority to JP18882982U priority Critical patent/JPS5991694U/en
Publication of JPS5991694U publication Critical patent/JPS5991694U/en
Pending legal-status Critical Current

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  • Resistance Heating (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。
(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第1図は従来例を説明するための断面図、第2図J第3
図は本考案の実施例を説明するための断面図である。 1・・・・・・グラファイトヒーター、2・・・・・・
シャッター、3・・・・・・支持台、4・・・・・・半
導体基板、5・・・・・・凹部。
Figure 1 is a sectional view for explaining the conventional example, Figure 2
The figure is a sectional view for explaining an embodiment of the present invention. 1...Graphite heater, 2...
Shutter, 3... Support stand, 4... Semiconductor substrate, 5... Concave portion.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体基板を加熱する加熱部と、この加熱部により加熱
される半導体基板を支持する支持台とを有し、前記支持
台には前記半導体基板を収納する凹部が設けられている
ことを特徴とする赤外線加熱処理装置。
The device is characterized in that it has a heating section that heats a semiconductor substrate, and a support stand that supports the semiconductor substrate heated by the heating section, and that the support stand is provided with a recess that accommodates the semiconductor substrate. Infrared heat treatment equipment.
JP18882982U 1982-12-13 1982-12-13 Infrared heat treatment equipment Pending JPS5991694U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP18882982U JPS5991694U (en) 1982-12-13 1982-12-13 Infrared heat treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP18882982U JPS5991694U (en) 1982-12-13 1982-12-13 Infrared heat treatment equipment

Publications (1)

Publication Number Publication Date
JPS5991694U true JPS5991694U (en) 1984-06-21

Family

ID=30407266

Family Applications (1)

Application Number Title Priority Date Filing Date
JP18882982U Pending JPS5991694U (en) 1982-12-13 1982-12-13 Infrared heat treatment equipment

Country Status (1)

Country Link
JP (1) JPS5991694U (en)

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