JPS59125832U - heat treatment equipment - Google Patents

heat treatment equipment

Info

Publication number
JPS59125832U
JPS59125832U JP1962183U JP1962183U JPS59125832U JP S59125832 U JPS59125832 U JP S59125832U JP 1962183 U JP1962183 U JP 1962183U JP 1962183 U JP1962183 U JP 1962183U JP S59125832 U JPS59125832 U JP S59125832U
Authority
JP
Japan
Prior art keywords
heat treatment
treatment equipment
core tube
furnace
heating
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP1962183U
Other languages
Japanese (ja)
Other versions
JPH0319222Y2 (en
Inventor
大越　隆之
小松　靖秀
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1962183U priority Critical patent/JPS59125832U/en
Publication of JPS59125832U publication Critical patent/JPS59125832U/en
Application granted granted Critical
Publication of JPH0319222Y2 publication Critical patent/JPH0319222Y2/ja
Granted legal-status Critical Current

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  • Liquid Deposition Of Substances Of Which Semiconductor Devices Are Composed (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来装置の構成を示す模式図、第２図は本考案
の一実施例を示す模式図である。 １・・・炉芯管、３・・・加熱炉、１１・・・ヒータ、
１２・・・強制空冷用ファン。FIG. 1 is a schematic diagram showing the configuration of a conventional device, and FIG. 2 is a schematic diagram showing an embodiment of the present invention. 1... Furnace core tube, 3... Heating furnace, 11... Heater,
12... Forced air cooling fan.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 炉芯管と、該炉芯管内の処理物を加熱する加熱炉と、該
加熱炉から露出した前記炉芯管の処理物取出口側を加熱
、冷却する加熱及び冷却機機構とから構成したことを特
徴とする熱処理装置。Consisting of a furnace core tube, a heating furnace that heats the processed material in the furnace core tube, and a heating and cooling machine mechanism that heats and cools the processed material outlet side of the furnace core tube exposed from the heating furnace. A heat treatment device featuring:
JP1962183U 1983-02-14 1983-02-14 heat treatment equipment Granted JPS59125832U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1962183U JPS59125832U (en) 1983-02-14 1983-02-14 heat treatment equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1962183U JPS59125832U (en) 1983-02-14 1983-02-14 heat treatment equipment

Publications (2)

Publication Number Publication Date
JPS59125832U true JPS59125832U (en) 1984-08-24
JPH0319222Y2 JPH0319222Y2 (en) 1991-04-23

Family

ID=30150761

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1962183U Granted JPS59125832U (en) 1983-02-14 1983-02-14 heat treatment equipment

Country Status (1)

Country Link
JP (1) JPS59125832U (en)

Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56153728A (en) * 1980-04-30 1981-11-27 Kokusai Electric Co Ltd Electric furnace having uniform temperature distribution region
JPS57112011A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Heat treatment equipment for semiconductor wafer
JPS5835428A (en) * 1981-08-27 1983-03-02 Mitsubishi Electric Corp Temperature memory element
JPS5934627A (en) * 1982-08-23 1984-02-25 Hitachi Ltd Heat treatment device for semiconductor

Patent Citations (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS56153728A (en) * 1980-04-30 1981-11-27 Kokusai Electric Co Ltd Electric furnace having uniform temperature distribution region
JPS57112011A (en) * 1980-12-29 1982-07-12 Fujitsu Ltd Heat treatment equipment for semiconductor wafer
JPS5835428A (en) * 1981-08-27 1983-03-02 Mitsubishi Electric Corp Temperature memory element
JPS5934627A (en) * 1982-08-23 1984-02-25 Hitachi Ltd Heat treatment device for semiconductor

Also Published As

Publication number Publication date
JPH0319222Y2 (en) 1991-04-23

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