JPS5990664A - 液体供給装置および付着物除去方法 - Google Patents

液体供給装置および付着物除去方法

Info

Publication number
JPS5990664A
JPS5990664A JP58141791A JP14179183A JPS5990664A JP S5990664 A JPS5990664 A JP S5990664A JP 58141791 A JP58141791 A JP 58141791A JP 14179183 A JP14179183 A JP 14179183A JP S5990664 A JPS5990664 A JP S5990664A
Authority
JP
Japan
Prior art keywords
edge
fluid
flat surface
chuck
slot
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58141791A
Other languages
English (en)
Japanese (ja)
Other versions
JPS6255906B2 (enExample
Inventor
リツキ−・エイ・コツトマン
ロバ−ト・イ−・テリル
アン・イ−・ワイズ
トニ−・イ−・アレバト
スチ−ブン・デイ−・テイタス
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Texas Instruments Inc
Original Assignee
Texas Instruments Inc
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Texas Instruments Inc filed Critical Texas Instruments Inc
Publication of JPS5990664A publication Critical patent/JPS5990664A/ja
Publication of JPS6255906B2 publication Critical patent/JPS6255906B2/ja
Granted legal-status Critical Current

Links

Classifications

    • G—PHYSICS
    • G03—PHOTOGRAPHY; CINEMATOGRAPHY; ANALOGOUS TECHNIQUES USING WAVES OTHER THAN OPTICAL WAVES; ELECTROGRAPHY; HOLOGRAPHY
    • G03F—PHOTOMECHANICAL PRODUCTION OF TEXTURED OR PATTERNED SURFACES, e.g. FOR PRINTING, FOR PROCESSING OF SEMICONDUCTOR DEVICES; MATERIALS THEREFOR; ORIGINALS THEREFOR; APPARATUS SPECIALLY ADAPTED THEREFOR
    • G03F7/00—Photomechanical, e.g. photolithographic, production of textured or patterned surfaces, e.g. printing surfaces; Materials therefor, e.g. comprising photoresists; Apparatus specially adapted therefor
    • G03F7/26—Processing photosensitive materials; Apparatus therefor
    • G03F7/30—Imagewise removal using liquid means
    • G03F7/3021—Imagewise removal using liquid means from a wafer supported on a rotating chuck
    • Y—GENERAL TAGGING OF NEW TECHNOLOGICAL DEVELOPMENTS; GENERAL TAGGING OF CROSS-SECTIONAL TECHNOLOGIES SPANNING OVER SEVERAL SECTIONS OF THE IPC; TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10—TECHNICAL SUBJECTS COVERED BY FORMER USPC
    • Y10S—TECHNICAL SUBJECTS COVERED BY FORMER USPC CROSS-REFERENCE ART COLLECTIONS [XRACs] AND DIGESTS
    • Y10S134/00—Cleaning and liquid contact with solids
    • Y10S134/902—Semiconductor wafer

Landscapes

  • Physics & Mathematics (AREA)
  • General Physics & Mathematics (AREA)
  • Coating Apparatus (AREA)
  • Manufacturing Of Magnetic Record Carriers (AREA)
  • Exposure Of Semiconductors, Excluding Electron Or Ion Beam Exposure (AREA)
  • Photosensitive Polymer And Photoresist Processing (AREA)
  • Application Of Or Painting With Fluid Materials (AREA)
  • Cleaning Or Drying Semiconductors (AREA)
JP58141791A 1982-08-03 1983-08-02 液体供給装置および付着物除去方法 Granted JPS5990664A (ja)

Applications Claiming Priority (4)

Application Number Priority Date Filing Date Title
US06/404,678 US4439243A (en) 1982-08-03 1982-08-03 Apparatus and method of material removal with fluid flow within a slot
US404798 1982-08-03
US404679 1982-08-03
US404678 1995-03-15

Publications (2)

Publication Number Publication Date
JPS5990664A true JPS5990664A (ja) 1984-05-25
JPS6255906B2 JPS6255906B2 (enExample) 1987-11-21

Family

ID=23600589

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58141791A Granted JPS5990664A (ja) 1982-08-03 1983-08-02 液体供給装置および付着物除去方法

Country Status (2)

Country Link
US (1) US4439243A (enExample)
JP (1) JPS5990664A (enExample)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02315A (ja) * 1987-11-28 1990-01-05 Dainippon Screen Mfg Co Ltd 基板のレジスト除去洗浄方法
JPH0473604A (ja) * 1990-07-13 1992-03-09 Mitsubishi Electric Corp 照光装置
JP2007508684A (ja) * 2003-10-08 2007-04-05 ステアーグ ハマテヒ アクチエンゲゼルシャフト 基板を縁洗浄するための装置および方法

Families Citing this family (68)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4855016A (en) * 1987-07-16 1989-08-08 Texas Instruments Incorporated Method for etching aluminum film doped with copper
US4867841A (en) * 1987-07-16 1989-09-19 Texas Instruments Incorporated Method for etch of polysilicon film
US4891488A (en) * 1987-07-16 1990-01-02 Texas Instruments Incorporated Processing apparatus and method
US4832779A (en) * 1987-07-16 1989-05-23 Texas Instruments Incorporated Processing apparatus
US4822450A (en) * 1987-07-16 1989-04-18 Texas Instruments Incorporated Processing apparatus and method
US4838984A (en) * 1987-07-16 1989-06-13 Texas Instruments Incorporated Method for etching films of mercury-cadmium-telluride and zinc sulfid
US4857132A (en) * 1987-07-16 1989-08-15 Texas Instruments Incorporated Processing apparatus for wafers
US4904621A (en) * 1987-07-16 1990-02-27 Texas Instruments Incorporated Remote plasma generation process using a two-stage showerhead
US4837113A (en) * 1987-07-16 1989-06-06 Texas Instruments Incorporated Method for depositing compound from group II-VI
US4818326A (en) * 1987-07-16 1989-04-04 Texas Instruments Incorporated Processing apparatus
US4849067A (en) * 1987-07-16 1989-07-18 Texas Instruments Incorporated Method for etching tungsten
US4832777A (en) * 1987-07-16 1989-05-23 Texas Instruments Incorporated Processing apparatus and method
US4816098A (en) * 1987-07-16 1989-03-28 Texas Instruments Incorporated Apparatus for transferring workpieces
US4842687A (en) * 1987-07-16 1989-06-27 Texas Instruments Incorporated Method for etching tungsten
US4830705A (en) * 1987-07-16 1989-05-16 Texas Instruments Incorporated Method for etch of GaAs
US4863558A (en) * 1987-07-16 1989-09-05 Texas Instruments Incorporated Method for etching tungsten
US4838990A (en) * 1987-07-16 1989-06-13 Texas Instruments Incorporated Method for plasma etching tungsten
US4842676A (en) * 1987-07-16 1989-06-27 Texas Instruments Incorporated Process for etch of tungsten
US4877757A (en) * 1987-07-16 1989-10-31 Texas Instruments Incorporated Method of sequential cleaning and passivating a GaAs substrate using remote oxygen plasma
US4874723A (en) * 1987-07-16 1989-10-17 Texas Instruments Incorporated Selective etching of tungsten by remote and in situ plasma generation
US4872938A (en) * 1987-07-16 1989-10-10 Texas Instruments Incorporated Processing apparatus
US4828649A (en) * 1987-07-16 1989-05-09 Texas Instruments Incorporated Method for etching an aluminum film doped with silicon
US4844773A (en) * 1987-07-16 1989-07-04 Texas Instruments Incorporated Process for etching silicon nitride film
US4820377A (en) * 1987-07-16 1989-04-11 Texas Instruments Incorporated Method for cleanup processing chamber and vacuum process module
US4832778A (en) * 1987-07-16 1989-05-23 Texas Instruments Inc. Processing apparatus for wafers
US4855160A (en) * 1987-07-16 1989-08-08 Texas Instruments Incorporated Method for passivating wafer
US4830700A (en) * 1987-07-16 1989-05-16 Texas Instruments Incorporated Processing apparatus and method
US4842686A (en) * 1987-07-17 1989-06-27 Texas Instruments Incorporated Wafer processing apparatus and method
US4988533A (en) * 1988-05-27 1991-01-29 Texas Instruments Incorporated Method for deposition of silicon oxide on a wafer
US5009240A (en) * 1989-07-07 1991-04-23 United States Of America Wafer cleaning method
AT395951B (de) * 1991-02-19 1993-04-26 Union Ind Compr Gase Gmbh Reinigung von werkstuecken mit organischen rueckstaenden
US5444921A (en) * 1994-02-02 1995-08-29 Vlsi Technology, Inc. Edge bead removal gap gauge
US5931721A (en) 1994-11-07 1999-08-03 Sumitomo Heavy Industries, Ltd. Aerosol surface processing
US5967156A (en) * 1994-11-07 1999-10-19 Krytek Corporation Processing a surface
US6413436B1 (en) * 1999-01-27 2002-07-02 Semitool, Inc. Selective treatment of the surface of a microelectronic workpiece
US6264752B1 (en) 1998-03-13 2001-07-24 Gary L. Curtis Reactor for processing a microelectronic workpiece
WO2000061498A2 (en) * 1999-04-13 2000-10-19 Semitool, Inc. System for electrochemically processing a workpiece
US6350319B1 (en) 1998-03-13 2002-02-26 Semitool, Inc. Micro-environment reactor for processing a workpiece
US6423642B1 (en) 1998-03-13 2002-07-23 Semitool, Inc. Reactor for processing a semiconductor wafer
US6318385B1 (en) 1998-03-13 2001-11-20 Semitool, Inc. Micro-environment chamber and system for rinsing and drying a semiconductor workpiece
US20050217707A1 (en) * 1998-03-13 2005-10-06 Aegerter Brian K Selective processing of microelectronic workpiece surfaces
US6632292B1 (en) 1998-03-13 2003-10-14 Semitool, Inc. Selective treatment of microelectronic workpiece surfaces
TW452828B (en) * 1998-03-13 2001-09-01 Semitool Inc Micro-environment reactor for processing a microelectronic workpiece
JP3563605B2 (ja) * 1998-03-16 2004-09-08 東京エレクトロン株式会社 処理装置
US6497801B1 (en) * 1998-07-10 2002-12-24 Semitool Inc Electroplating apparatus with segmented anode array
US7217325B2 (en) * 1999-01-22 2007-05-15 Semitool, Inc. System for processing a workpiece
US6511914B2 (en) 1999-01-22 2003-01-28 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6680253B2 (en) 1999-01-22 2004-01-20 Semitool, Inc. Apparatus for processing a workpiece
US6492284B2 (en) 1999-01-22 2002-12-10 Semitool, Inc. Reactor for processing a workpiece using sonic energy
US6548411B2 (en) 1999-01-22 2003-04-15 Semitool, Inc. Apparatus and methods for processing a workpiece
US7160421B2 (en) * 1999-04-13 2007-01-09 Semitool, Inc. Turning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7438788B2 (en) * 1999-04-13 2008-10-21 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US7189318B2 (en) * 1999-04-13 2007-03-13 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US7020537B2 (en) * 1999-04-13 2006-03-28 Semitool, Inc. Tuning electrodes used in a reactor for electrochemically processing a microelectronic workpiece
US20030038035A1 (en) * 2001-05-30 2003-02-27 Wilson Gregory J. Methods and systems for controlling current in electrochemical processing of microelectronic workpieces
US7264698B2 (en) * 1999-04-13 2007-09-04 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6916412B2 (en) * 1999-04-13 2005-07-12 Semitool, Inc. Adaptable electrochemical processing chamber
JP2000331975A (ja) * 1999-05-19 2000-11-30 Ebara Corp ウエハ洗浄装置
US6516815B1 (en) * 1999-07-09 2003-02-11 Applied Materials, Inc. Edge bead removal/spin rinse dry (EBR/SRD) module
US6286231B1 (en) 2000-01-12 2001-09-11 Semitool, Inc. Method and apparatus for high-pressure wafer processing and drying
US20050183959A1 (en) * 2000-04-13 2005-08-25 Wilson Gregory J. Tuning electrodes used in a reactor for electrochemically processing a microelectric workpiece
WO2002004887A1 (en) * 2000-07-08 2002-01-17 Semitool, Inc. Methods and apparatus for processing microelectronic workpieces using metrology
US20050061676A1 (en) * 2001-03-12 2005-03-24 Wilson Gregory J. System for electrochemically processing a workpiece
AU2002343330A1 (en) * 2001-08-31 2003-03-10 Semitool, Inc. Apparatus and methods for electrochemical processing of microelectronic workpieces
US6824612B2 (en) 2001-12-26 2004-11-30 Applied Materials, Inc. Electroless plating system
US20040108212A1 (en) * 2002-12-06 2004-06-10 Lyndon Graham Apparatus and methods for transferring heat during chemical processing of microelectronic workpieces
US7378084B2 (en) * 2005-07-01 2008-05-27 Playtex Products, Inc. Sunless tanning composition and method of sunless tanning
CN112967995B (zh) * 2021-02-01 2022-12-30 泉芯集成电路制造(济南)有限公司 一种芯片夹具、芯片清洗装置及芯片刻蚀装置

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5212372A (en) * 1975-07-15 1977-01-29 Takeda Maiyaa Kk Spindle driving gear for torsional lace machine

Family Cites Families (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4027686A (en) * 1973-01-02 1977-06-07 Texas Instruments Incorporated Method and apparatus for cleaning the surface of a semiconductor slice with a liquid spray of de-ionized water
JPS5329674A (en) * 1976-08-31 1978-03-20 Mitsubishi Electric Corp Photoresist applicator

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS5212372A (en) * 1975-07-15 1977-01-29 Takeda Maiyaa Kk Spindle driving gear for torsional lace machine

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPH02315A (ja) * 1987-11-28 1990-01-05 Dainippon Screen Mfg Co Ltd 基板のレジスト除去洗浄方法
JPH0473604A (ja) * 1990-07-13 1992-03-09 Mitsubishi Electric Corp 照光装置
JP2007508684A (ja) * 2003-10-08 2007-04-05 ステアーグ ハマテヒ アクチエンゲゼルシャフト 基板を縁洗浄するための装置および方法

Also Published As

Publication number Publication date
JPS6255906B2 (enExample) 1987-11-21
US4439243A (en) 1984-03-27

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