JPS5989581U - Multilayer bus line - Google Patents
Multilayer bus lineInfo
- Publication number
- JPS5989581U JPS5989581U JP18639482U JP18639482U JPS5989581U JP S5989581 U JPS5989581 U JP S5989581U JP 18639482 U JP18639482 U JP 18639482U JP 18639482 U JP18639482 U JP 18639482U JP S5989581 U JPS5989581 U JP S5989581U
- Authority
- JP
- Japan
- Prior art keywords
- multilayer
- conductor
- hole conductor
- bus line
- passing
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第1図は従来の多層化パスラインの構成を示す ′−
斜視断面図、第2図はこの発明の一実施例による多層化
パスラインの構成を示す斜視断面図である。
図中、1は誘電体基板、2は接着シート、3はパターン
、4はスルホール導体、4aはスルホール導体G、5は
同軸線路、6は穴である。なお、−中同一あるいは相当
部分には同一符号を付して示しである。Figure 1 shows the configuration of a conventional multilayer pass line.
FIG. 2 is a perspective sectional view showing the structure of a multilayer pass line according to an embodiment of the present invention. In the figure, 1 is a dielectric substrate, 2 is an adhesive sheet, 3 is a pattern, 4 is a through-hole conductor, 4a is a through-hole conductor G, 5 is a coaxial line, and 6 is a hole. It should be noted that the same or equivalent parts are indicated by the same reference numerals.
Claims (1)
複数枚多層一体化し、かつ上記パターンを上記誘電体基
板に形成したスルホール導体を介して外部と接続し、併
せて上記誘電体基板と垂直にマイクロ波を通過させる機
能を具備して成る多層化パスラインにおいて、マイクロ
波を通過させる機能を多層一体化された誘電体基板に形
成したスルホール導体の内面を外部導体とし、上記スル
ーホール導体内に貫通させた導体ピンを内部導体とした
同軸線路にもたせた事を特徴とする多層化パスライン。A plurality of dielectric substrates each having a pattern for passing a control signal are integrated into a multilayer structure, and the pattern is connected to the outside via a through-hole conductor formed on the dielectric substrate. In a multilayer pass line having the function of passing microwaves, the inner surface of a through-hole conductor formed on a multilayer integrated dielectric substrate with the function of passing microwaves is used as the outer conductor, and the inner surface of the through-hole conductor is formed within the through-hole conductor. A multilayer pass line characterized by having a coaxial line with a conductor pin passed through it as an internal conductor.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18639482U JPS5989581U (en) | 1982-12-09 | 1982-12-09 | Multilayer bus line |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP18639482U JPS5989581U (en) | 1982-12-09 | 1982-12-09 | Multilayer bus line |
Publications (1)
Publication Number | Publication Date |
---|---|
JPS5989581U true JPS5989581U (en) | 1984-06-18 |
Family
ID=30402614
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP18639482U Pending JPS5989581U (en) | 1982-12-09 | 1982-12-09 | Multilayer bus line |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS5989581U (en) |
-
1982
- 1982-12-09 JP JP18639482U patent/JPS5989581U/en active Pending
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