JPS58106968U - printed wiring board - Google Patents
printed wiring boardInfo
- Publication number
- JPS58106968U JPS58106968U JP483182U JP483182U JPS58106968U JP S58106968 U JPS58106968 U JP S58106968U JP 483182 U JP483182 U JP 483182U JP 483182 U JP483182 U JP 483182U JP S58106968 U JPS58106968 U JP S58106968U
- Authority
- JP
- Japan
- Prior art keywords
- wiring board
- printed wiring
- insulating substrate
- insertion hole
- component terminal
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Landscapes
- Structures For Mounting Electric Components On Printed Circuit Boards (AREA)
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来のプリント配線板における電子部品端子固
着構造を示す断面図、第３図乃至第４図は本考案による
プリント配線板の各実施例の構成を示す断面図である。
図において、１１，２１，４１．４２．５１・・・・・
・絶縁基板、１２，２２．ｉ５，４５’，５４・・・・
・・貫通孔、１８，２３，４６．４６’，５５・・・・
・・スルーホールめっき層、１４，２４，４８．５６・
・二・電子部品端子。FIG. 1 is a sectional view showing a conventional electronic component terminal fixing structure on a printed wiring board, and FIGS. 3 to 4 are sectional views showing the configuration of each embodiment of the printed wiring board according to the present invention. In the figure, 11, 21, 41. 42, 51...
- Insulating substrate, 12, 22. i5, 45', 54...
...Through hole, 18, 23, 46.46', 55...
・Through hole plating layer, 14, 24, 48.56・
・2.Electronic component terminal.
Claims (1)
を貫通する如く部品端子挿入孔が配設され、前記部品端
子挿入孔はその開口縁部の直径が当該プリント配線板の
内部における直径よりも大とされてなることを特徴とす
るプリント配線板。A conductor layer is provided on the main surface of the insulating substrate, and a component terminal insertion hole is provided so as to pass through the insulating substrate, and the component terminal insertion hole has an opening edge whose diameter is within the printed wiring board. A printed wiring board characterized by being larger than its diameter.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP483182U JPS58106968U (en) | 1982-01-18 | 1982-01-18 | printed wiring board |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP483182U JPS58106968U (en) | 1982-01-18 | 1982-01-18 | printed wiring board |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS58106968U true JPS58106968U (en) | 1983-07-21 |
Family
ID=30017661
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP483182U Pending JPS58106968U (en) | 1982-01-18 | 1982-01-18 | printed wiring board |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS58106968U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007243205A (en) * | 1998-12-02 | 2007-09-20 | Teradyne Inc | Printed circuit board assembly |
| JP2014011308A (en) * | 2012-06-29 | 2014-01-20 | Mitsubishi Electric Corp | Printed circuit board |
-
1982
- 1982-01-18 JP JP483182U patent/JPS58106968U/en active Pending
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JP2007243205A (en) * | 1998-12-02 | 2007-09-20 | Teradyne Inc | Printed circuit board assembly |
| JP4669496B2 (en) * | 1998-12-02 | 2011-04-13 | テラダイン・インコーポレーテッド | Printed circuit board assembly |
| JP2014011308A (en) * | 2012-06-29 | 2014-01-20 | Mitsubishi Electric Corp | Printed circuit board |
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