JPS5988820A - シ−トプラズマを利用した化合物半導体薄膜製造装置 - Google Patents

シ−トプラズマを利用した化合物半導体薄膜製造装置

Info

Publication number
JPS5988820A
JPS5988820A JP19887182A JP19887182A JPS5988820A JP S5988820 A JPS5988820 A JP S5988820A JP 19887182 A JP19887182 A JP 19887182A JP 19887182 A JP19887182 A JP 19887182A JP S5988820 A JPS5988820 A JP S5988820A
Authority
JP
Japan
Prior art keywords
sheet plasma
substrate
compound semiconductor
plasma
sheet
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP19887182A
Other languages
English (en)
Japanese (ja)
Other versions
JPH023291B2 (enrdf_load_stackoverflow
Inventor
Muneharu Komiya
小宮 宗治
Joshin Uramoto
上進 浦本
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Ulvac Inc
Original Assignee
Ulvac Inc
Nihon Shinku Gijutsu KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Ulvac Inc, Nihon Shinku Gijutsu KK filed Critical Ulvac Inc
Priority to JP19887182A priority Critical patent/JPS5988820A/ja
Publication of JPS5988820A publication Critical patent/JPS5988820A/ja
Publication of JPH023291B2 publication Critical patent/JPH023291B2/ja
Granted legal-status Critical Current

Links

Classifications

    • HELECTRICITY
    • H01ELECTRIC ELEMENTS
    • H01LSEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L21/00Processes or apparatus adapted for the manufacture or treatment of semiconductor or solid state devices or of parts thereof
    • H01L21/02Manufacture or treatment of semiconductor devices or of parts thereof
    • H01L21/02104Forming layers
    • H01L21/02365Forming inorganic semiconducting materials on a substrate
    • H01L21/02612Formation types
    • H01L21/02617Deposition types
    • H01L21/02631Physical deposition at reduced pressure, e.g. MBE, sputtering, evaporation

Landscapes

  • Engineering & Computer Science (AREA)
  • Physics & Mathematics (AREA)
  • Condensed Matter Physics & Semiconductors (AREA)
  • General Physics & Mathematics (AREA)
  • Manufacturing & Machinery (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Physical Deposition Of Substances That Are Components Of Semiconductor Devices (AREA)
  • Crystals, And After-Treatments Of Crystals (AREA)
JP19887182A 1982-11-15 1982-11-15 シ−トプラズマを利用した化合物半導体薄膜製造装置 Granted JPS5988820A (ja)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP19887182A JPS5988820A (ja) 1982-11-15 1982-11-15 シ−トプラズマを利用した化合物半導体薄膜製造装置

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP19887182A JPS5988820A (ja) 1982-11-15 1982-11-15 シ−トプラズマを利用した化合物半導体薄膜製造装置

Publications (2)

Publication Number Publication Date
JPS5988820A true JPS5988820A (ja) 1984-05-22
JPH023291B2 JPH023291B2 (enrdf_load_stackoverflow) 1990-01-23

Family

ID=16398304

Family Applications (1)

Application Number Title Priority Date Filing Date
JP19887182A Granted JPS5988820A (ja) 1982-11-15 1982-11-15 シ−トプラズマを利用した化合物半導体薄膜製造装置

Country Status (1)

Country Link
JP (1) JPS5988820A (enrdf_load_stackoverflow)

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119676A (ja) * 1984-11-15 1986-06-06 Ulvac Corp シ−トプラズマとレ−ザ光を利用した成膜装置
JPS61176121A (ja) * 1985-01-31 1986-08-07 Tokai Univ シ−トプラズマを利用した真空プロセス装置
JPS6350464A (ja) * 1986-08-19 1988-03-03 Toobi:Kk シ−トプラズマ・イオンプレ−テイング方法とその装置
US5178905A (en) * 1988-11-24 1993-01-12 Canon Kabushiki Kaisha Process for the formation of a functional deposited film by hydrogen radical-assisted cvd method utilizing hydrogen gas plasma in sheet-like state
US9620260B2 (en) 2012-12-14 2017-04-11 Autonetworks Technologies, Ltd. Insulating coated wire and method for manufacturing the same

Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577129A (en) * 1980-06-17 1982-01-14 Fujitsu Ltd Treating method and device for sputtering
JPS57156031A (en) * 1981-03-20 1982-09-27 Matsushita Electric Ind Co Ltd Formation of thin film and vacuum deposition device
JPS58166930A (ja) * 1982-03-05 1983-10-03 インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン 中和されたイオン・ビ−ムを発生させる装置

Patent Citations (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS577129A (en) * 1980-06-17 1982-01-14 Fujitsu Ltd Treating method and device for sputtering
JPS57156031A (en) * 1981-03-20 1982-09-27 Matsushita Electric Ind Co Ltd Formation of thin film and vacuum deposition device
JPS58166930A (ja) * 1982-03-05 1983-10-03 インタ−ナシヨナル ビジネス マシ−ンズ コ−ポレ−シヨン 中和されたイオン・ビ−ムを発生させる装置

Cited By (5)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61119676A (ja) * 1984-11-15 1986-06-06 Ulvac Corp シ−トプラズマとレ−ザ光を利用した成膜装置
JPS61176121A (ja) * 1985-01-31 1986-08-07 Tokai Univ シ−トプラズマを利用した真空プロセス装置
JPS6350464A (ja) * 1986-08-19 1988-03-03 Toobi:Kk シ−トプラズマ・イオンプレ−テイング方法とその装置
US5178905A (en) * 1988-11-24 1993-01-12 Canon Kabushiki Kaisha Process for the formation of a functional deposited film by hydrogen radical-assisted cvd method utilizing hydrogen gas plasma in sheet-like state
US9620260B2 (en) 2012-12-14 2017-04-11 Autonetworks Technologies, Ltd. Insulating coated wire and method for manufacturing the same

Also Published As

Publication number Publication date
JPH023291B2 (enrdf_load_stackoverflow) 1990-01-23

Similar Documents

Publication Publication Date Title
Rimini Ion implantation: basics to device fabrication
US5811820A (en) Parallel ion optics and apparatus for high current low energy ion beams
JPS60221566A (ja) 薄膜形成装置
Yamada Materials processing by cluster ion beams: history, technology, and applications
US5631524A (en) Switching apparatus
KR20080089646A (ko) 이온 주입 방법 및 이를 위해 사용되는 이온 소스
Liu et al. Formation of buried oxide in silicon using separation by plasma implantation of oxygen
KR100583909B1 (ko) 이온 도핑 장치 및 도핑 방법
US4533831A (en) Non-mass-analyzed ion implantation
TWI246105B (en) System and method for removing particles entrained in an ion beam
JPS5988820A (ja) シ−トプラズマを利用した化合物半導体薄膜製造装置
US3940615A (en) Wide angle isotope separator
JP2934456B2 (ja) 表面処理方法及びその装置
JP3341387B2 (ja) 微細構造材料の製造方法並びにその製造装置、および微細構造を有する発光素子
JPS61135126A (ja) プラズマ処理装置
JPH05206515A (ja) 超微粒子発光素子及びその製造装置
Hüfner Introduction and basic principles
JP2600243B2 (ja) 高純度金属の堆積方法
JP2019096517A (ja) イオン注入方法、イオン注入装置
KR100665846B1 (ko) 반도체 소자 제조를 위한 박막 형성방법
Weaver Reactions of the silicon (100) crystal surface with hyperthermal chlorine molecules and radicals
RU2135633C1 (ru) Способ вакуумного нанесения тонких пленок
Ryding et al. Industrial ion implantation machines
JPS5826821B2 (ja) 分子線エピタキシヤル成長装置
JPS6114652B2 (enrdf_load_stackoverflow)