JPS598721A - 半導体封止用液状エポキシ樹脂組成物 - Google Patents
半導体封止用液状エポキシ樹脂組成物Info
- Publication number
- JPS598721A JPS598721A JP11938082A JP11938082A JPS598721A JP S598721 A JPS598721 A JP S598721A JP 11938082 A JP11938082 A JP 11938082A JP 11938082 A JP11938082 A JP 11938082A JP S598721 A JPS598721 A JP S598721A
- Authority
- JP
- Japan
- Prior art keywords
- epoxy resin
- liquid epoxy
- resin composition
- liquid
- component
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Granted
Links
- 239000004850 liquid epoxy resins (LERs) Substances 0.000 title claims abstract description 29
- 239000000203 mixture Substances 0.000 title claims abstract description 26
- 239000004065 semiconductor Substances 0.000 title claims description 25
- 238000007789 sealing Methods 0.000 title claims description 5
- 239000003822 epoxy resin Substances 0.000 claims abstract description 26
- 229920000647 polyepoxide Polymers 0.000 claims abstract description 26
- 239000003795 chemical substances by application Substances 0.000 claims abstract description 24
- 150000008065 acid anhydrides Chemical class 0.000 claims abstract description 16
- 150000001875 compounds Chemical class 0.000 claims abstract description 12
- 239000007788 liquid Substances 0.000 claims abstract description 9
- VYPSYNLAJGMNEJ-UHFFFAOYSA-N Silicium dioxide Chemical compound O=[Si]=O VYPSYNLAJGMNEJ-UHFFFAOYSA-N 0.000 claims abstract description 7
- 239000007822 coupling agent Substances 0.000 claims abstract description 7
- 229910002026 crystalline silica Inorganic materials 0.000 claims abstract description 4
- 229920003986 novolac Polymers 0.000 claims abstract description 4
- 235000012239 silicon dioxide Nutrition 0.000 claims abstract description 4
- 238000005538 encapsulation Methods 0.000 claims description 16
- 239000011342 resin composition Substances 0.000 claims description 8
- 239000005350 fused silica glass Substances 0.000 claims description 3
- 238000002156 mixing Methods 0.000 claims description 3
- MWSKJDNQKGCKPA-UHFFFAOYSA-N 6-methyl-3a,4,5,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1CC(C)=CC2C(=O)OC(=O)C12 MWSKJDNQKGCKPA-UHFFFAOYSA-N 0.000 claims description 2
- 239000004020 conductor Substances 0.000 claims description 2
- VYKXQOYUCMREIS-UHFFFAOYSA-N methylhexahydrophthalic anhydride Chemical group C1CCCC2C(=O)OC(=O)C21C VYKXQOYUCMREIS-UHFFFAOYSA-N 0.000 claims description 2
- DQZNLOXENNXVAD-UHFFFAOYSA-N trimethoxy-[2-(7-oxabicyclo[4.1.0]heptan-4-yl)ethyl]silane Chemical compound C1C(CC[Si](OC)(OC)OC)CCC2OC21 DQZNLOXENNXVAD-UHFFFAOYSA-N 0.000 claims description 2
- 239000004593 Epoxy Substances 0.000 claims 1
- BPSIOYPQMFLKFR-VIFPVBQESA-N trimethoxy-[3-[[(2r)-oxiran-2-yl]methoxy]propyl]silane Chemical group CO[Si](OC)(OC)CCCOC[C@H]1CO1 BPSIOYPQMFLKFR-VIFPVBQESA-N 0.000 claims 1
- 238000006460 hydrolysis reaction Methods 0.000 abstract description 12
- 230000007062 hydrolysis Effects 0.000 abstract description 9
- MUTGBJKUEZFXGO-OLQVQODUSA-N (3as,7ar)-3a,4,5,6,7,7a-hexahydro-2-benzofuran-1,3-dione Chemical compound C1CCC[C@@H]2C(=O)OC(=O)[C@@H]21 MUTGBJKUEZFXGO-OLQVQODUSA-N 0.000 abstract description 3
- 238000013329 compounding Methods 0.000 abstract description 3
- 239000011256 inorganic filler Substances 0.000 abstract 2
- 229910003475 inorganic filler Inorganic materials 0.000 abstract 2
- BPSIOYPQMFLKFR-UHFFFAOYSA-N trimethoxy-[3-(oxiran-2-ylmethoxy)propyl]silane Chemical compound CO[Si](OC)(OC)CCCOCC1CO1 BPSIOYPQMFLKFR-UHFFFAOYSA-N 0.000 abstract 1
- 150000001412 amines Chemical class 0.000 description 9
- 230000007423 decrease Effects 0.000 description 8
- LNEPOXFFQSENCJ-UHFFFAOYSA-N haloperidol Chemical compound C1CC(O)(C=2C=CC(Cl)=CC=2)CCN1CCCC(=O)C1=CC=C(F)C=C1 LNEPOXFFQSENCJ-UHFFFAOYSA-N 0.000 description 8
- 238000006243 chemical reaction Methods 0.000 description 7
- 125000002887 hydroxy group Chemical group [H]O* 0.000 description 6
- 238000002347 injection Methods 0.000 description 6
- 239000007924 injection Substances 0.000 description 6
- 239000000945 filler Substances 0.000 description 5
- 229920005989 resin Polymers 0.000 description 5
- 239000011347 resin Substances 0.000 description 5
- 230000001476 alcoholic effect Effects 0.000 description 4
- ADCOVFLJGNWWNZ-UHFFFAOYSA-N antimony trioxide Chemical compound O=[Sb]O[Sb]=O ADCOVFLJGNWWNZ-UHFFFAOYSA-N 0.000 description 4
- 125000003700 epoxy group Chemical group 0.000 description 4
- 238000000465 moulding Methods 0.000 description 4
- 239000007787 solid Substances 0.000 description 4
- IISBACLAFKSPIT-UHFFFAOYSA-N bisphenol A Chemical compound C=1C=C(O)C=CC=1C(C)(C)C1=CC=C(O)C=C1 IISBACLAFKSPIT-UHFFFAOYSA-N 0.000 description 3
- 238000005266 casting Methods 0.000 description 3
- 230000000694 effects Effects 0.000 description 3
- 229910052739 hydrogen Inorganic materials 0.000 description 3
- 239000001257 hydrogen Substances 0.000 description 3
- -1 if necessary Substances 0.000 description 3
- KMOUUZVZFBCRAM-OLQVQODUSA-N (3as,7ar)-3a,4,7,7a-tetrahydro-2-benzofuran-1,3-dione Chemical compound C1C=CC[C@@H]2C(=O)OC(=O)[C@@H]21 KMOUUZVZFBCRAM-OLQVQODUSA-N 0.000 description 2
- RNFJDJUURJAICM-UHFFFAOYSA-N 2,2,4,4,6,6-hexaphenoxy-1,3,5-triaza-2$l^{5},4$l^{5},6$l^{5}-triphosphacyclohexa-1,3,5-triene Chemical compound N=1P(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP(OC=2C=CC=CC=2)(OC=2C=CC=CC=2)=NP=1(OC=1C=CC=CC=1)OC1=CC=CC=C1 RNFJDJUURJAICM-UHFFFAOYSA-N 0.000 description 2
- UFHFLCQGNIYNRP-UHFFFAOYSA-N Hydrogen Chemical compound [H][H] UFHFLCQGNIYNRP-UHFFFAOYSA-N 0.000 description 2
- PNEYBMLMFCGWSK-UHFFFAOYSA-N aluminium oxide Inorganic materials [O-2].[O-2].[O-2].[Al+3].[Al+3] PNEYBMLMFCGWSK-UHFFFAOYSA-N 0.000 description 2
- 230000015572 biosynthetic process Effects 0.000 description 2
- 239000003086 colorant Substances 0.000 description 2
- 230000000052 comparative effect Effects 0.000 description 2
- 239000003085 diluting agent Substances 0.000 description 2
- 239000003063 flame retardant Substances 0.000 description 2
- 238000004519 manufacturing process Methods 0.000 description 2
- 238000000034 method Methods 0.000 description 2
- 239000006082 mold release agent Substances 0.000 description 2
- ISWSIDIOOBJBQZ-UHFFFAOYSA-N phenol group Chemical group C1(=CC=CC=C1)O ISWSIDIOOBJBQZ-UHFFFAOYSA-N 0.000 description 2
- 230000001737 promoting effect Effects 0.000 description 2
- 229920002050 silicone resin Polymers 0.000 description 2
- KXGFMDJXCMQABM-UHFFFAOYSA-N 2-methoxy-6-methylphenol Chemical compound [CH]OC1=CC=CC([CH])=C1O KXGFMDJXCMQABM-UHFFFAOYSA-N 0.000 description 1
- SJECZPVISLOESU-UHFFFAOYSA-N 3-trimethoxysilylpropan-1-amine Chemical compound CO[Si](OC)(OC)CCCN SJECZPVISLOESU-UHFFFAOYSA-N 0.000 description 1
- UUEWCQRISZBELL-UHFFFAOYSA-N 3-trimethoxysilylpropane-1-thiol Chemical compound CO[Si](OC)(OC)CCCS UUEWCQRISZBELL-UHFFFAOYSA-N 0.000 description 1
- 241000984642 Cura Species 0.000 description 1
- 238000004566 IR spectroscopy Methods 0.000 description 1
- 239000004698 Polyethylene Substances 0.000 description 1
- 238000010521 absorption reaction Methods 0.000 description 1
- 239000002253 acid Substances 0.000 description 1
- 125000004018 acid anhydride group Chemical group 0.000 description 1
- 230000009471 action Effects 0.000 description 1
- 125000002723 alicyclic group Chemical group 0.000 description 1
- XAGFODPZIPBFFR-UHFFFAOYSA-N aluminium Chemical compound [Al] XAGFODPZIPBFFR-UHFFFAOYSA-N 0.000 description 1
- 229910052782 aluminium Inorganic materials 0.000 description 1
- 125000003277 amino group Chemical group 0.000 description 1
- 150000008064 anhydrides Chemical class 0.000 description 1
- 239000004841 bisphenol A epoxy resin Substances 0.000 description 1
- 238000005282 brightening Methods 0.000 description 1
- 239000006229 carbon black Substances 0.000 description 1
- 125000002843 carboxylic acid group Chemical group 0.000 description 1
- 239000004203 carnauba wax Substances 0.000 description 1
- 235000013869 carnauba wax Nutrition 0.000 description 1
- 239000004927 clay Substances 0.000 description 1
- 229910052570 clay Inorganic materials 0.000 description 1
- 230000003247 decreasing effect Effects 0.000 description 1
- 150000002148 esters Chemical class 0.000 description 1
- SBRXLTRZCJVAPH-UHFFFAOYSA-N ethyl(trimethoxy)silane Chemical compound CC[Si](OC)(OC)OC SBRXLTRZCJVAPH-UHFFFAOYSA-N 0.000 description 1
- 230000002349 favourable effect Effects 0.000 description 1
- 238000001879 gelation Methods 0.000 description 1
- 239000003365 glass fiber Substances 0.000 description 1
- 238000010438 heat treatment Methods 0.000 description 1
- FLBJFXNAEMSXGL-UHFFFAOYSA-N het anhydride Chemical compound O=C1OC(=O)C2C1C1(Cl)C(Cl)=C(Cl)C2(Cl)C1(Cl)Cl FLBJFXNAEMSXGL-UHFFFAOYSA-N 0.000 description 1
- FPYJFEHAWHCUMM-UHFFFAOYSA-N maleic anhydride Chemical compound O=C1OC(=O)C=C1 FPYJFEHAWHCUMM-UHFFFAOYSA-N 0.000 description 1
- 239000011159 matrix material Substances 0.000 description 1
- 238000002844 melting Methods 0.000 description 1
- 230000008018 melting Effects 0.000 description 1
- 239000010445 mica Substances 0.000 description 1
- 229910052618 mica group Inorganic materials 0.000 description 1
- 239000003607 modifier Substances 0.000 description 1
- 239000004843 novolac epoxy resin Substances 0.000 description 1
- 229920001568 phenolic resin Polymers 0.000 description 1
- 239000005011 phenolic resin Substances 0.000 description 1
- 150000002989 phenols Chemical class 0.000 description 1
- 229920000573 polyethylene Polymers 0.000 description 1
- 229920001296 polysiloxane Polymers 0.000 description 1
- 239000000843 powder Substances 0.000 description 1
- 238000002360 preparation method Methods 0.000 description 1
- 230000008569 process Effects 0.000 description 1
- 230000035484 reaction time Effects 0.000 description 1
- 230000009257 reactivity Effects 0.000 description 1
- 230000009467 reduction Effects 0.000 description 1
- 230000002269 spontaneous effect Effects 0.000 description 1
- 238000003860 storage Methods 0.000 description 1
- 239000000454 talc Substances 0.000 description 1
- 229910052623 talc Inorganic materials 0.000 description 1
- 150000003512 tertiary amines Chemical class 0.000 description 1
- 238000001721 transfer moulding Methods 0.000 description 1
- XLYOFNOQVPJJNP-UHFFFAOYSA-N water Substances O XLYOFNOQVPJJNP-UHFFFAOYSA-N 0.000 description 1
- 239000001993 wax Substances 0.000 description 1
Landscapes
- Compositions Of Macromolecular Compounds (AREA)
- Epoxy Resins (AREA)
- Structures Or Materials For Encapsulating Or Coating Semiconductor Devices Or Solid State Devices (AREA)
- Organic Insulating Materials (AREA)
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11938082A JPS598721A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP11938082A JPS598721A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Publications (2)
| Publication Number | Publication Date |
|---|---|
| JPS598721A true JPS598721A (ja) | 1984-01-18 |
| JPS6238365B2 JPS6238365B2 (enrdf_load_stackoverflow) | 1987-08-18 |
Family
ID=14760074
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP11938082A Granted JPS598721A (ja) | 1982-07-07 | 1982-07-07 | 半導体封止用液状エポキシ樹脂組成物 |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS598721A (enrdf_load_stackoverflow) |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190418A (ja) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | 半導体封止用液状エポキシ樹脂組成物 |
| JPS612726A (ja) * | 1984-06-14 | 1986-01-08 | Sumitomo Bakelite Co Ltd | 液状エポキシ樹脂組成物 |
| US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54127458A (en) * | 1978-03-27 | 1979-10-03 | Sumitomo Bakelite Co Ltd | Colorless and transparent epoxy resin composition |
-
1982
- 1982-07-07 JP JP11938082A patent/JPS598721A/ja active Granted
Patent Citations (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS54127458A (en) * | 1978-03-27 | 1979-10-03 | Sumitomo Bakelite Co Ltd | Colorless and transparent epoxy resin composition |
Cited By (3)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS60190418A (ja) * | 1984-03-12 | 1985-09-27 | Mitsubishi Electric Corp | 半導体封止用液状エポキシ樹脂組成物 |
| JPS612726A (ja) * | 1984-06-14 | 1986-01-08 | Sumitomo Bakelite Co Ltd | 液状エポキシ樹脂組成物 |
| US6495270B1 (en) | 1998-02-19 | 2002-12-17 | Hitachi Chemical Company, Ltd. | Compounds, hardening accelerator, resin composition, and electronic part device |
Also Published As
| Publication number | Publication date |
|---|---|
| JPS6238365B2 (enrdf_load_stackoverflow) | 1987-08-18 |
Similar Documents
| Publication | Publication Date | Title |
|---|---|---|
| JPH06345847A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPH05259316A (ja) | 樹脂封止型半導体装置 | |
| JP6307352B2 (ja) | 光半導体封止用樹脂組成物および光半導体装置 | |
| JPS598721A (ja) | 半導体封止用液状エポキシ樹脂組成物 | |
| JP3102276B2 (ja) | エポキシ樹脂組成物の製造方法及び半導体封止用エポキシ樹脂組成物 | |
| JPS598722A (ja) | 半導体封止用液状エポキシ樹脂組成物 | |
| JP2004203911A (ja) | 封止用樹脂組成物および樹脂封止型半導体装置 | |
| JPH08337634A (ja) | エポキシ樹脂組成物及び樹脂封止型半導体装置 | |
| JPH11172075A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPS60190418A (ja) | 半導体封止用液状エポキシ樹脂組成物 | |
| JP2003155393A (ja) | エポキシ樹脂組成物及び半導体装置 | |
| JPS6231735B2 (enrdf_load_stackoverflow) | ||
| JPS62240312A (ja) | 封止用樹脂組成物 | |
| KR100529258B1 (ko) | 반도체 봉지재용 에폭시 수지 조성물 | |
| JPH01188518A (ja) | エポキシ樹脂組成物及びそれを用いた樹脂封止型半導体装置 | |
| JPH11286594A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JP2002194064A (ja) | 半導体封止用樹脂組成物、およびそれを用いた半導体装置 | |
| JPH06239976A (ja) | エポキシ樹脂組成物および半導体封止装置 | |
| JP3417283B2 (ja) | 封止用のエポキシ樹脂組成物および半導体装置封止方法 | |
| JPH04328117A (ja) | 半導体封止用エポキシ樹脂組成物 | |
| JPH1112442A (ja) | 封止用樹脂組成物および半導体封止装置 | |
| JPS6222822A (ja) | 封止用樹脂組成物 | |
| JPH03115455A (ja) | 封止用樹脂組成物及び樹脂封止型半導体装置 | |
| JPS6333416A (ja) | 封止用樹脂組成物 | |
| JPH09176286A (ja) | エポキシ樹脂組成物及び樹脂封止型半導体装置 |