JPS5970755A - エネルギ・ビームを用いた電気化学的処理方法 - Google Patents

エネルギ・ビームを用いた電気化学的処理方法

Info

Publication number
JPS5970755A
JPS5970755A JP58109441A JP10944183A JPS5970755A JP S5970755 A JPS5970755 A JP S5970755A JP 58109441 A JP58109441 A JP 58109441A JP 10944183 A JP10944183 A JP 10944183A JP S5970755 A JPS5970755 A JP S5970755A
Authority
JP
Japan
Prior art keywords
laser
plating
workpiece
mask
tank
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Granted
Application number
JP58109441A
Other languages
English (en)
Japanese (ja)
Other versions
JPH0253511B2 (enExample
Inventor
ラボミア・タラス・ロ−マンキユ−
ロバ−ト・ジエイコブ・フオン・ガツトフエルド
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
International Business Machines Corp
Original Assignee
International Business Machines Corp
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by International Business Machines Corp filed Critical International Business Machines Corp
Publication of JPS5970755A publication Critical patent/JPS5970755A/ja
Publication of JPH0253511B2 publication Critical patent/JPH0253511B2/ja
Granted legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/243—Reinforcing of the conductive pattern characterised by selective plating, e.g. for finish plating of pads
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D21/00—Processes for servicing or operating cells for electrolytic coating
    • C25D21/02—Heating or cooling
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/02—Electroplating of selected surface areas
    • C25D5/024—Electroplating of selected surface areas using locally applied electromagnetic radiation, e.g. lasers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25D—PROCESSES FOR THE ELECTROLYTIC OR ELECTROPHORETIC PRODUCTION OF COATINGS; ELECTROFORMING; APPARATUS THEREFOR
    • C25D5/00—Electroplating characterised by the process; Pretreatment or after-treatment of workpieces
    • C25D5/60—Electroplating characterised by the structure or texture of the layers
    • C25D5/605—Surface topography of the layers, e.g. rough, dendritic or nodular layers
    • C25D5/611—Smooth layers
    • C—CHEMISTRY; METALLURGY
    • C25—ELECTROLYTIC OR ELECTROPHORETIC PROCESSES; APPARATUS THEREFOR
    • C25F—PROCESSES FOR THE ELECTROLYTIC REMOVAL OF MATERIALS FROM OBJECTS; APPARATUS THEREFOR
    • C25F3/00—Electrolytic etching or polishing
    • C25F3/02—Etching
    • C25F3/14—Etching locally
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/10—Using electric, magnetic and electromagnetic fields; Using laser light
    • H05K2203/107—Using laser light
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K2203/00—Indexing scheme relating to apparatus or processes for manufacturing printed circuits covered by H05K3/00
    • H05K2203/15—Position of the PCB during processing
    • H05K2203/1545—Continuous processing, i.e. involving rolls moving a band-like or solid carrier along a continuous production path
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/0011—Working of insulating substrates or insulating layers
    • H05K3/0017—Etching of the substrate by chemical or physical means
    • H05K3/0026—Etching of the substrate by chemical or physical means by laser ablation
    • H05K3/0032—Etching of the substrate by chemical or physical means by laser ablation of organic insulating material
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/02—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding
    • H05K3/06—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process
    • H05K3/07—Apparatus or processes for manufacturing printed circuits in which the conductive material is applied to the surface of the insulating support and is thereafter removed from such areas of the surface which are not intended for current conducting or shielding the conductive material being removed chemically or electrolytically, e.g. by photo-etch process being removed electrolytically
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/10—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern
    • H05K3/108—Apparatus or processes for manufacturing printed circuits in which conductive material is applied to the insulating support in such a manner as to form the desired conductive pattern by semi-additive methods; masks therefor
    • H—ELECTRICITY
    • H05—ELECTRIC TECHNIQUES NOT OTHERWISE PROVIDED FOR
    • H05K—PRINTED CIRCUITS; CASINGS OR CONSTRUCTIONAL DETAILS OF ELECTRIC APPARATUS; MANUFACTURE OF ASSEMBLAGES OF ELECTRICAL COMPONENTS
    • H05K3/00—Apparatus or processes for manufacturing printed circuits
    • H05K3/22—Secondary treatment of printed circuits
    • H05K3/24—Reinforcing of the conductive pattern
    • H05K3/241—Reinforcing of the conductive pattern characterised by the electroplating method; means therefor, e.g. baths or apparatus

Landscapes

  • Chemical & Material Sciences (AREA)
  • Engineering & Computer Science (AREA)
  • Chemical Kinetics & Catalysis (AREA)
  • Electrochemistry (AREA)
  • Materials Engineering (AREA)
  • Metallurgy (AREA)
  • Organic Chemistry (AREA)
  • Physics & Mathematics (AREA)
  • Electromagnetism (AREA)
  • Optics & Photonics (AREA)
  • Manufacturing & Machinery (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Electroplating Methods And Accessories (AREA)
  • ing And Chemical Polishing (AREA)
  • Chemically Coating (AREA)
  • Laser Beam Processing (AREA)
JP58109441A 1982-09-30 1983-06-20 エネルギ・ビームを用いた電気化学的処理方法 Granted JPS5970755A (ja)

Applications Claiming Priority (2)

Application Number Priority Date Filing Date Title
US06/429,657 US4432855A (en) 1982-09-30 1982-09-30 Automated system for laser mask definition for laser enhanced and conventional plating and etching
US429657 1982-09-30

Publications (2)

Publication Number Publication Date
JPS5970755A true JPS5970755A (ja) 1984-04-21
JPH0253511B2 JPH0253511B2 (enExample) 1990-11-16

Family

ID=23704181

Family Applications (1)

Application Number Title Priority Date Filing Date
JP58109441A Granted JPS5970755A (ja) 1982-09-30 1983-06-20 エネルギ・ビームを用いた電気化学的処理方法

Country Status (3)

Country Link
US (1) US4432855A (enExample)
EP (1) EP0106977A3 (enExample)
JP (1) JPS5970755A (enExample)

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62185892A (ja) * 1986-02-10 1987-08-14 Kurihara Tokin Kojo:Kk 電気メツキによる立体的模様形成方法
JPH0222493A (ja) * 1989-05-30 1990-01-25 Mitsubishi Electric Corp 加工装置

Families Citing this family (41)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US4832798A (en) * 1987-12-16 1989-05-23 Amp Incorporated Method and apparatus for plating composite
US4877644A (en) * 1988-04-12 1989-10-31 Amp Incorporated Selective plating by laser ablation
GB8825219D0 (en) * 1988-10-27 1988-11-30 Mbm Technology Ltd Fine featured electrical circuits
WO1990012481A1 (en) * 1989-04-11 1990-10-18 Northern Telecom Limited Method of making an impressing tool
US5258098A (en) * 1991-06-17 1993-11-02 Cycam, Inc. Method of production of a surface adapted to promote adhesion
GB9200494D0 (en) * 1992-01-10 1992-02-26 Leonard Ian Methods and apparatus for electrochemical machining
DE4229399C2 (de) * 1992-09-03 1999-05-27 Deutsch Zentr Luft & Raumfahrt Verfahren und Vorrichtung zum Herstellen einer Funktionsstruktur eines Halbleiterbauelements
US5641391A (en) * 1995-05-15 1997-06-24 Hunter; Ian W. Three dimensional microfabrication by localized electrodeposition and etching
JPH1098251A (ja) * 1996-09-23 1998-04-14 Matsushita Electric Ind Co Ltd 蒸着された金属配線および誘電配線のｕｖレーザーアニーリングおよび洗浄
US6211080B1 (en) 1996-10-30 2001-04-03 Matsushita Electric Industrial Co., Ltd. Repair of dielectric-coated electrode or circuit defects
AU2864499A (en) 1998-03-05 1999-09-20 Etchtech Sweden Ab Method of etching
US6180912B1 (en) 1998-03-31 2001-01-30 Matsushita Electric Industrial Co., Ltd. Fan-out beams for repairing an open defect
US6060127A (en) * 1998-03-31 2000-05-09 Matsushita Electric Industrial Co., Ltd. Mechanically restricted laser deposition
SG76591A1 (en) * 1999-02-27 2000-11-21 Aem Tech Engineers Pte Ltd Method for selective plating of a metal substrate using laser developed masking layer and apparatus for carrying out the method
DE19934584A1 (de) * 1999-07-23 2001-01-25 Inovan Stroebe Verfahren zum Herstellen von Kontakten
DE10135349A1 (de) † 2001-07-20 2003-02-06 Imo Ingo Mueller E K Verfahren zur selektiven Galvanisierung eines bandartigen, metallischen Trägermaterials
US20060030149A1 (en) * 2004-08-06 2006-02-09 Steven Leith Depositing material on photosensitive material
US8529738B2 (en) * 2005-02-08 2013-09-10 The Trustees Of Columbia University In The City Of New York In situ plating and etching of materials covered with a surface film
US8496799B2 (en) * 2005-02-08 2013-07-30 The Trustees Of Columbia University In The City Of New York Systems and methods for in situ annealing of electro- and electroless platings during deposition
WO2007027907A2 (en) * 2005-09-02 2007-03-08 The Trustees Of Columbia University In The City Of New York A system and method for obtaining anisotropic etching of patterned substrates
JP4666255B2 (ja) * 2005-12-27 2011-04-06 日本電気株式会社 符号化データ選定、符号化データ設定、再符号化データ生成及び再符号化の方法及び装置
JP4833762B2 (ja) * 2006-08-07 2011-12-07 株式会社オートネットワーク技術研究所 部分めっき方法およびコネクタ端子ならびにコネクタ端子の製造方法
WO2008018471A1 (en) * 2006-08-07 2008-02-14 Autonetworks Technologies, Ltd. Partial plating method, laser plating apparatus, and plated member
US20080083706A1 (en) * 2006-10-05 2008-04-10 Mu-Gahat Enterprises, Llc Reverse side film laser circuit etching
US7633035B2 (en) * 2006-10-05 2009-12-15 Mu-Gahat Holdings Inc. Reverse side film laser circuit etching
WO2008070786A1 (en) * 2006-12-06 2008-06-12 The Trustees Of Columbia University In The City Of New York Microfluidic systems and methods for screening plating and etching bath compositions
US20090061251A1 (en) * 2007-08-27 2009-03-05 Mu-Gahat Enterprises, Llc Laser circuit etching by additive deposition
US20090061112A1 (en) * 2007-08-27 2009-03-05 Mu-Gahat Enterprises, Llc Laser circuit etching by subtractive deposition
WO2009124180A2 (en) * 2008-04-02 2009-10-08 The Trustees Of Columbia University In The City Of New York In situ plating and soldering of materials covered with a surface film
US8985050B2 (en) * 2009-11-05 2015-03-24 The Trustees Of Columbia University In The City Of New York Substrate laser oxide removal process followed by electro or immersion plating
CN102510788B (zh) * 2010-06-14 2014-12-24 三菱电机株式会社 激光加工装置以及激光加工方法
CN101863394A (zh) * 2010-06-30 2010-10-20 佛山塑料集团股份有限公司 一种在塑料薄膜上加工图案的工艺
JP5472950B2 (ja) * 2012-06-19 2014-04-16 Ｊｅインターナショナル株式会社 マスキング剤および表面処理基材の製造方法
CN102817051B (zh) * 2012-09-14 2015-02-11 中国科学院半导体研究所 一种激光脉冲电镀系统
CN102925938B (zh) * 2012-09-14 2015-06-03 中国科学院半导体研究所 一种对激光镀层进行处理的系统
DE102014017886A1 (de) * 2014-12-04 2016-06-09 Auto-Kabel Management Gmbh Verfahren zum Herstellen eines elektrischen Anschlussteils
WO2016140661A1 (en) * 2015-03-04 2016-09-09 TKS Industrial Company Method and apparatus for removing residue from electrocoated articles
KR102781391B1 (ko) * 2015-09-09 2025-03-17 일렉트로 싸이언티픽 인더스트리이즈 인코포레이티드 작업물들을 레이저 가공하기 위한 레이저 가공 장치, 방법들 및 관련된 배열들
JP7596842B2 (ja) * 2021-02-19 2024-12-10 トヨタ自動車株式会社 配線基板の製造方法
CN116377533A (zh) * 2023-04-12 2023-07-04 汕尾市栢林电子封装材料有限公司 一种基于电子基板的局部镀金方法
CN119320968A (zh) * 2024-11-01 2025-01-17 深圳市和美科技有限公司 局部电镀工艺及电镀系统

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946168A (enExample) * 1972-09-11 1974-05-02

Family Cites Families (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
US3791938A (en) * 1971-11-22 1974-02-12 R Healy Method and apparatus for fabricating selectively plated electrical contacts
US4217183A (en) * 1979-05-08 1980-08-12 International Business Machines Corporation Method for locally enhancing electroplating rates
DE3037271A1 (de) * 1980-10-02 1982-05-19 Harald 5840 Schwerte Albrecht Verfahren zur glaettung von metallisch beschichteten blechen

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS4946168A (enExample) * 1972-09-11 1974-05-02

Cited By (2)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS62185892A (ja) * 1986-02-10 1987-08-14 Kurihara Tokin Kojo:Kk 電気メツキによる立体的模様形成方法
JPH0222493A (ja) * 1989-05-30 1990-01-25 Mitsubishi Electric Corp 加工装置

Also Published As

Publication number Publication date
EP0106977A2 (en) 1984-05-02
JPH0253511B2 (enExample) 1990-11-16
US4432855A (en) 1984-02-21
EP0106977A3 (en) 1984-08-15

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