JPS596851U - flat semiconductor device - Google Patents
flat semiconductor deviceInfo
- Publication number
- JPS596851U JPS596851U JP10161382U JP10161382U JPS596851U JP S596851 U JPS596851 U JP S596851U JP 10161382 U JP10161382 U JP 10161382U JP 10161382 U JP10161382 U JP 10161382U JP S596851 U JPS596851 U JP S596851U
- Authority
- JP
- Japan
- Prior art keywords
- flat semiconductor
- semiconductor device
- pressurizing
- plate
- semiconductor element
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は平形半導体装置の正面図である。第２図は従来
技術による平型半導体装置の加圧装置の一部正面図を含
む断面図である。第３図は本考案による一実施例の平形
半導体装置の加圧装置の一部正面図を含む゛断面図であ
る。
なお図において、１・・・・・・平形半導体素子、２・
・・・・・ヒートシンク、３・・・・・・絶縁板、４−
−−−−−シャフト、５・・・・・・筐体金属板、６・
・・・・・加圧ボルト、７．７′・・・・・・バネ部、
８・・・・・・バネ座、９・・・・・・皿バネ、□１０
．１３・・・・・・加圧皿、１１・・・・・・貼き穴、
１２゜１５’、１５’、１５“′・・・・・・ケガキ線
、１４・・・・・・長穴、２０．３０・・・・・・先端
面である。FIG. 1 is a front view of a flat semiconductor device. FIG. 2 is a sectional view including a partial front view of a pressurizing device for a flat semiconductor device according to the prior art. FIG. 3 is a sectional view including a partial front view of a pressurizing device for a flat semiconductor device according to an embodiment of the present invention. In the figure, 1... flat semiconductor element, 2...
... Heat sink, 3 ... Insulation plate, 4-
-----Shaft, 5... Housing metal plate, 6.
・・・・・・Pressure bolt, 7.7′・・・Spring part,
8...Spring seat, 9...Disc spring, □10
．． 13... Pressure plate, 11... Pasting hole,
12゜15', 15', 15'''...marking line, 14...long hole, 20.30...tip surface.
Claims (1)
縁板とを一軸方向に配置して中心軸に加圧するための加
圧装置を具備する平形半導体装置において、前記加圧装
置は少なくとも加圧ボルトと、バネ座と、加圧皿と、バ
ネとを有し、前記加圧皿に加圧値を目盛った長大を設置
したことを特徴とする平形半導体装置。In a flat semiconductor device comprising a pressurizing device for disposing a flat semiconductor element, a heat sink and an insulating plate of the flat semiconductor element in a uniaxial direction and applying pressure to a central axis, the pressurizing device includes at least a pressure bolt; 1. A flat semiconductor device comprising a spring seat, a pressurizing plate, and a spring, the pressurizing plate having an elongated scale on which pressure values are calibrated.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10161382U JPS596851U (en) | 1982-07-05 | 1982-07-05 | flat semiconductor device |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP10161382U JPS596851U (en) | 1982-07-05 | 1982-07-05 | flat semiconductor device |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS596851U true JPS596851U (en) | 1984-01-17 |
Family
ID=30239883
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP10161382U Pending JPS596851U (en) | 1982-07-05 | 1982-07-05 | flat semiconductor device |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS596851U (en) |
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145558A (en) * | 1983-02-09 | 1984-08-21 | Hitachi Ltd | Laminated stack for semiconductor rectifying device |
| JPS61156822A (en) * | 1984-12-28 | 1986-07-16 | Toshiba Corp | Compression bonded semiconductor device |
-
1982
- 1982-07-05 JP JP10161382U patent/JPS596851U/en active Pending
Cited By (2)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPS59145558A (en) * | 1983-02-09 | 1984-08-21 | Hitachi Ltd | Laminated stack for semiconductor rectifying device |
| JPS61156822A (en) * | 1984-12-28 | 1986-07-16 | Toshiba Corp | Compression bonded semiconductor device |
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