JPS58158445U

JPS58158445U - Jig for semiconductor device testing

Info

Publication number: JPS58158445U
Application number: JP5519482U
Authority: JP
Inventors: 順一鈴木
Original assignee: 日本電気株式会社
Priority date: 1982-04-16
Filing date: 1982-04-16
Publication date: 1983-10-22

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Abstract] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

[Brief explanation of the drawing]

第１図ａは半導体素子の一例を示す平面図、第１図すは
第１図ａの右側面図、第１図Ｃは第１図ａの下方からみ
た側面図、第２図ａは従来の半導体素子試験用治具例を
示す平面図、第２図すは第２図ａの左側面図、第２図Ｃ
は第２図ａの下方からみた側面図、第３図ａは本考案に
係る抑え治具の平面図、第３図すは第３図ａのＡ−Ａ’
線断面図、第３図Ｃは第３図ａの下方からみた側面図、
第４図ａは本考案のバイアス電極板上にスプリングを取
付けた状態の平面図、第４図すは第４図ａの左側面図、
第４図Ｃの第４図ａの下方からみた側面図、第５図ａは
本考案の一実施例を示す平面図、第５図すは第５図ａの
左側面図、第５図Ｃは第５図ａの下方からみた側面図で
ある。２・・・・・・放熱板、３．４・・・・・・電極引出用
外部リード、６，７・・・・・・バイアス供給用電極、
９・・・・・・放熱フィン、１６・・・・・・抑え治具
、１７・・・・・・固定ネジ、１９．２０・・・・・・
バイアス供給用電極スプリング。 −文シ］ント３ト４Fig. 1a is a plan view showing an example of a semiconductor device, Fig. 1 is a right side view of Fig. 1a, Fig. 1C is a side view seen from below Fig. 1a, Fig. 2a is a conventional A plan view showing an example of a jig for testing semiconductor devices, Figure 2 is a left side view of Figure 2a, Figure 2C
is a side view of FIG. 2a seen from below, FIG. 3a is a plan view of the holding jig according to the present invention, and FIG.
A line sectional view, FIG. 3C is a side view seen from below of FIG. 3A,
Fig. 4a is a plan view of a state in which a spring is attached to the bias electrode plate of the present invention, Fig. 4 is a left side view of Fig. 4a,
Figure 4C is a side view seen from below in Figure 4a, Figure 5a is a plan view showing an embodiment of the present invention, Figure 5 is a left side view of Figure 5a, Figure 5C is a side view of FIG. 5a seen from below; 2... Heat sink, 3.4... External lead for electrode extraction, 6,7... Electrode for bias supply,
9... Heat dissipation fin, 16... Holding jig, 17... Fixing screw, 19.20...
Electrode spring for bias supply. - Sentence point 3 point 4

Claims

[Scope of utility model registration request]

a screw for fixing the semiconductor device under test to a heat dissipation fin, the electrode lead being inserted between a pair of electrodes that supply a bias to the electrode lead of the semiconductor device under test and facing each other; A jig for testing a semiconductor device, characterized in that it is integrally assembled with a jig for pressing the opposing bias supply electrodes onto the electrode lead.