JPS5965552U - semiconductor thyristor device - Google Patents

semiconductor thyristor device

Info

Publication number
JPS5965552U
JPS5965552U JP1982160087U JP16008782U JPS5965552U JP S5965552 U JPS5965552 U JP S5965552U JP 1982160087 U JP1982160087 U JP 1982160087U JP 16008782 U JP16008782 U JP 16008782U JP S5965552 U JPS5965552 U JP S5965552U
Authority
JP
Japan
Prior art keywords
brazed
thyristor device
semiconductor
semiconductor thyristor
main surface
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982160087U
Other languages
Japanese (ja)
Inventor
中軽米　進
Original Assignee
日本電気株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 日本電気株式会社 filed Critical 日本電気株式会社
Priority to JP1982160087U priority Critical patent/JPS5965552U/en
Publication of JPS5965552U publication Critical patent/JPS5965552U/en
Pending legal-status Critical Current

Links

Classifications

    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L24/00—Arrangements for connecting or disconnecting semiconductor or solid-state bodies; Methods or apparatus related thereto
    • H01L24/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L24/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L24/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/01—Means for bonding being attached to, or being formed on, the surface to be connected, e.g. chip-to-package, die-attach, "first-level" interconnects; Manufacturing methods related thereto
    • H01L2224/34—Strap connectors, e.g. copper straps for grounding power devices; Manufacturing methods related thereto
    • H01L2224/39—Structure, shape, material or disposition of the strap connectors after the connecting process
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2224/00—Indexing scheme for arrangements for connecting or disconnecting semiconductor or solid-state bodies and methods related thereto as covered by H01L24/00
    • H01L2224/80—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected
    • H01L2224/83—Methods for connecting semiconductor or other solid state bodies using means for bonding being attached to, or being formed on, the surface to be connected using a layer connector
    • H01L2224/838—Bonding techniques
    • H01L2224/83801—Soldering or alloying
    • H—ELECTRICITY
    • H01—ELECTRIC ELEMENTS
    • H01L—SEMICONDUCTOR DEVICES NOT COVERED BY CLASS H10
    • H01L2924/00—Indexing scheme for arrangements or methods for connecting or disconnecting semiconductor or solid-state bodies as covered by H01L24/00
    • H01L2924/0001—Technical content checked by a classifier
    • H01L2924/00014—Technical content checked by a classifier the subject-matter covered by the group, the symbol of which is combined with the symbol of this group, being disclosed without further technical details

Landscapes

  • Engineering & Computer Science (AREA)
  • Computer Hardware Design (AREA)
  • Microelectronics & Electronic Packaging (AREA)
  • Power Engineering (AREA)
  • Thyristors (AREA)
  • Wire Bonding (AREA)
  • Die Bonding (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は、従来のサイリスタペレット、第２図は、従来
のサイリスタ組立図、第３図ａ、　　ｂは、本考案実施
例のカソード連結線、第４図はその組立図である。 なお、図中の符号は、１・・・・・・Ｎベース、２・・
曲Ｐベース、３・・・・・・Ｐエミッタ、４・・・・・
・Ｎエミッタ、５・・・・・・Ｐベース露出部、６・・
・・・・カソード電極、７・・・・・・アノード電極、
８・・・・・・ゲート電極、１１・・・・・・スタッド
、１２・・・・・・下部補強板、１３・・・・・・ペレ
ット、１４・・・・・・上部補強板、１５．１５’・・
・・・・カソード連結線、１６．１６’・・・・・・ゲ
ートリード線、７・・・・・・ろう材、である。FIG. 1 is a conventional thyristor pellet, FIG. 2 is an assembly diagram of a conventional thyristor, FIGS. 3a and 3b are cathode connection lines of an embodiment of the present invention, and FIG. 4 is an assembly diagram thereof. Note that the symbols in the figure are 1...N base, 2...
Song P base, 3...P emitter, 4...
・N emitter, 5...P base exposed part, 6...
... Cathode electrode, 7 ... Anode electrode,
8... Gate electrode, 11... Stud, 12... Lower reinforcing plate, 13... Pellet, 14... Upper reinforcing plate, 15.15'...
. . . Cathode connection wire, 16.16' . . . Gate lead wire, 7 . . . Brazing material.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 半導体ペレットの第１の主表面が熱補償板を介して、ス
タッドにろう付けされ、第２の主表面のキード部にゲー
トリード線、カソード部に熱補償板を介してカソード連
結線がそれぞれろう付けされている半導体サイリスタ装
置において、前記カソード連結線に、前記ゲートリード
線の幅より広いスリットを設けたことを特徴とする半導
体サイリスク装置。The first main surface of the semiconductor pellet is brazed to the stud via a heat compensator, the gate lead wire is brazed to the keyed part of the second main surface, and the cathode connecting wire is brazed to the cathode part via the heat compensator. A semiconductor thyristor device, characterized in that the cathode connecting line is provided with a slit wider than the width of the gate lead line.
JP1982160087U 1982-10-22 1982-10-22 semiconductor thyristor device Pending JPS5965552U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982160087U JPS5965552U (en) 1982-10-22 1982-10-22 semiconductor thyristor device

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982160087U JPS5965552U (en) 1982-10-22 1982-10-22 semiconductor thyristor device

Publications (1)

Publication Number Publication Date
JPS5965552U true JPS5965552U (en) 1984-05-01

Family

ID=30352211

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982160087U Pending JPS5965552U (en) 1982-10-22 1982-10-22 semiconductor thyristor device

Country Status (1)

Country Link
JP (1) JPS5965552U (en)

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