JPS596526A - Treatment apparatus of semiconductor substrate - Google Patents

Abstract

PURPOSE:To enable automatic treatment of a substrate by conducting a necessary treatment to a wafer or a pellet on the basis of the results of the automatically read identification marks on the wafer or the pellet. CONSTITUTION:A wafer 1 with a required identification mark 2 on is fed to a pre-determined position, and set on a position where automatic reading of the identification mark 2 by a reader 3 on the basis of an orientation flat 1a is possible. In this state, each probe 4 of the reader 3 contacts with each identification mark 2, reads automatically the data from each identification mark 2, such as the name of the model of a product and mask version on the basis of a binary digit, and identifies the content. According to the result of the reading and the identification what to operate next is decided, and the reader 3 selects a treatment apparatus 5 and commands the treatment apparatus 5 to conduct a required manufacture or process or inspection to the wafer 1. The treatment apparatus 5 conducts the required treatment to the wafer 1 according to the command from the reader 3, and after that the wafer 1 is sent to a next step.

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a semiconductor substrate processing apparatus, and particularly to a semiconductor substrate processing apparatus that enables automatic processing.

Conventionally, in the manufacturing process of semiconductor products, when a semiconductor substrate such as a wafer or pellet is subjected to necessary manufacturing processing or inspection, an identification mark (identification data) is used to identify the model name, mask version, etc. of the semiconductor substrate to be processed. It is convenient to label each semiconductor substrate as an identification mark and perform necessary processing on each semiconductor substrate based on the identification mark. This is becoming more and more important with the trend of diversification.

However, in the past, it has been proposed to mask the model name, etc., but when the identification mark is actually read and discriminated, the operator has to look at it with the naked eye. Therefore, the conventional method does not contribute to the automation of processing in any way.

SUMMARY OF THE INVENTION Therefore, in view of the above-mentioned problems, an object of the present invention is to provide a semiconductor substrate processing apparatus that can automatically and effectively perform reading, discrimination, and processing of identification data, etc. of a semiconductor substrate.

To achieve this objective, the semiconductor substrate processing apparatus according to the present invention automatically reads the identification mark attached to the wafer 1 or the pellet, and performs the necessary processing on the wafer or pellet based on the reading result. This enables automated processing of semiconductor substrates.

Hereinafter, the present invention will be explained in detail according to embodiments shown in the drawings.

FIG. 1 is a plan view of a wafer with an identification mark (R-specific data) used in the present invention, and FIG. 2 is a schematic explanatory diagram showing an embodiment of a semiconductor substrate processing apparatus according to the present invention.

In the wafer shown in FIG. 1, identification marks (identification data) 2 such as the model name of the wafer 1 and a mask badge are attached to predetermined locations on the wafer 1.

Various types of identification marks 2 can be used, but in the example shown in Fig. 1, each identification mark is displayed in binary numbers to facilitate automatic reading and discrimination. Any layer 1 location on the wafer 1 may be written using any mask.

As shown in FIG. 2, the processing apparatus of the present invention for automatically processing wafers with identification marks as shown in FIG. It is equipped with a reading device 3 that has a plurality of probes 4 for discrimination.

This reading device 3 is a processing device! connected to t5,
The processing device 5 can be any semiconductor manufacturing processing device or inspection device, and performs necessary processing on the wafer 1 based on the reading result by the reading device 3.

Further, the reading device 3 is connected to a storage device 6 for storing necessary data such as data representing processing steps,
This storage device 6 can also exchange data with the processing device 5, if necessary.

Next, the operation of this embodiment will be explained.

The wafer 1 with the required identification mark 2 attached thereto is fed to a predetermined position by a supply means (not shown), and the identification mark 2 is read by the reader 3 based on the orientation of the wafer 1 (7) 1a. Set in a position where automatic reading is possible.

In this state, each probe 4 of the reading device 3 is brought into contact with each identification mark 2 on the wafer 1, and the data, such as the product model name, is read from each identification mark 2.

It automatically reads the mask barge, etc. based on binary numbers and determines its contents.

Based on the reading and discrimination results, the next operation to be performed on the wafer 1 is determined, and the reading and stacking device 3 selects the processing device 5 that will perform that task and performs the required manufacturing process on the processing device 5. Alternatively, a command is given to perform an inspection on the wafer ttc. Further, the reading device 3 causes the storage device 6 to store necessary data representing processing steps related to the wafer IK.

The processing device 5 performs necessary processing on the wafer IK based on the command button from the reading device 3. The wafer l that has been processed is sent to the next process.

Therefore, according to this embodiment, reading 1 discrimination of the identification mark 2 on the wafer 1 and processing based on the result can all be performed automatically and efficiently, and individual processing or overall processing can be automated. Is possible.

Figure 3 shows an identification mark @ (identification data I') to which the present invention can be applied.
It is an enlarged plan view of #heret. In this example, all necessary identification marks (identification data) 2a are written on each pellet 7 using a mask.

In this case, the data content of the identification mark 112a on the bellet 7 can be easily and automatically read by the reading device 3 even when busy.
Based on the determination result, the next treatment to be performed on the pellet 7 is determined, and the appropriate treatment device 5 is selected.

In the above embodiment, a probe 4 is used in the reading section of the reading device 3 to contact the identification mark 2a and read the data content, but an optical reading means using laser light or the like may be used instead of the probe. It is also possible to use

As described above, according to the present invention, it is possible to automatically and efficiently perform reading/zero determination of various types of identification data, etc. of a semiconductor substrate, and various processes based thereon.

[Brief explanation of the drawing]

FIG. 1 is a plan view of a wafer with an identification mark used in the present invention, FIG. 2 is a schematic explanatory diagram showing an embodiment of a semiconductor substrate processing apparatus according to the present invention, and FIG. 3 is a plan view of a wafer with an identification mark used in the present invention. FIG. 3 is an enlarged plan view of a bellet with an identification mark. DESCRIPTION OF SYMBOLS 1... Wafer, 2.2a... Identification mark (identification data), 3... Reading device, 4... Probe, 5... Processing device, 6... Storage device, 7...・Berrett. Figure 1 1 Figure 2 Figure 3 Figure-10

Claims (1)

[Scope of Claims] 1. A reading device that automatically reads an identification mark attached to a wafer or pellet, and a process that performs required processing on the wafer or pellet based on the reading result by this reading device. 1. A semiconductor substrate processing apparatus comprising: 2. The semiconductor substrate processing apparatus according to claim 1, wherein the identification mark is displayed in binary numbers.