JPS595975Y2 - Resin-encapsulated semiconductor device assembly jig - Google Patents
Resin-encapsulated semiconductor device assembly jigInfo
- Publication number
- JPS595975Y2 JPS595975Y2 JP6142475U JP6142475U JPS595975Y2 JP S595975 Y2 JPS595975 Y2 JP S595975Y2 JP 6142475 U JP6142475 U JP 6142475U JP 6142475 U JP6142475 U JP 6142475U JP S595975 Y2 JPS595975 Y2 JP S595975Y2
- Authority
- JP
- Japan
- Prior art keywords
- jig
- round bar
- resin
- lead
- semiconductor device
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Expired
Links
Landscapes
- Encapsulation Of And Coatings For Semiconductor Or Solid State Devices (AREA)
Description
【考案の詳細な説明】
この考案は樹脂封止型半導体装置組立用泊具に関するも
ので、特に治其の加工を容易にすることによって、安価
な治具が得られるような治其の改良に関するものである
。[Detailed description of the invention] This invention relates to a jig for assembling a resin-encapsulated semiconductor device, and in particular, it relates to an improvement of the jig so that an inexpensive jig can be obtained by making the jig easier to process. It is something.
第1ないし3図に関し、樹脂封止型トランジスタの従来
の組立治具およびトランジスタ製作工程について説明す
る。With reference to FIGS. 1 to 3, a conventional assembly jig for a resin-sealed transistor and a transistor manufacturing process will be described.
第1図に示すように、所定のピッチで多数の平行な溝5
を形戊した下泊具1のこれらの溝に、所定長さに切断さ
れた丸棒状リード6を3本1組で多数組位置決めする。As shown in FIG. 1, a large number of parallel grooves 5 at a predetermined pitch
A large number of sets of three round rod-shaped leads 6 cut to a predetermined length are positioned in these grooves of the undercarriage tool 1 having the shape of .
溝5の深さは丸棒状リード6の直径より僅かに小で、丸
棒状リード6はこの溝内に位置決めされた時、その外周
の一部が下治具1の平面より僅かに突出する。The depth of the groove 5 is slightly smaller than the diameter of the round lead 6, and when the round lead 6 is positioned within this groove, a part of its outer periphery protrudes slightly from the plane of the lower jig 1.
次に九棒状リードを位置決め保持している下治具1上に
上治具2をねじ3で取付ける。Next, the upper jig 2 is attached with screws 3 onto the lower jig 1 which positions and holds the nine-bar shaped lead.
すなわち、ねじ3は上治具2の孔7を貫通して下治具1
のねし7L4に螺合し、下治具1上に上治具2を固定し
、丸棒状リード6を挾んで保持する。That is, the screw 3 passes through the hole 7 of the upper jig 2 and connects to the lower jig 1.
The upper jig 2 is fixed onto the lower jig 1 by screwing onto the tie 7L4, and the round rod-shaped lead 6 is held between the ends.
この場合丸棒状リードの長さ方向の位置決めは第2図に
示すような治具部分8を使用して行なう。In this case, the lengthwise positioning of the round rod-shaped lead is performed using a jig portion 8 as shown in FIG.
すなわち、下治具1は治具部分8上にピン(図示せず)
で保持され、下治具1上に保持された丸棒状リード6の
端が治具部分8の肩部8′に当接することによって丸棒
状リード6の長さ方向が定まる。That is, the lower jig 1 has a pin (not shown) on the jig portion 8.
The length direction of the round bar lead 6 is determined by the end of the round bar lead 6 held on the lower jig 1 coming into contact with the shoulder 8' of the jig portion 8.
以上のように丸棒状リード6を上下治具2,1で保持し
た後、以下の工程でトランジスタが製作される。After the round bar-shaped lead 6 is held by the upper and lower jigs 2 and 1 as described above, a transistor is manufactured in the following steps.
すなわち第3図に示すように、丸棒状リード6の先端を
平らにする工程、平らにした面の一つにろう材13を介
して半導体素子9を固着する工程、半導体素子9上の電
極10.11と他の丸棒状リー ド6の平面との金属細
線12による接続工程、および樹脂(図示せず)による
,封止工程である。That is, as shown in FIG. 3, a step of flattening the tip of the round rod-shaped lead 6, a step of fixing a semiconductor element 9 to one of the flattened surfaces via a brazing material 13, and an electrode 10 on the semiconductor element 9. .11 and the flat surface of another round bar-shaped lead 6 using a thin metal wire 12, and a sealing process using a resin (not shown).
上記の各工程において、能率よく作業を行なうには、丸
棒状リード6を保持する溝5を高精度に加工する必要が
あり、特に前記の上下治具1,2を自動供給で取扱う場
合には精度を要する。In order to work efficiently in each of the above steps, it is necessary to machine the groove 5 that holds the round bar-shaped lead 6 with high precision, especially when handling the above-mentioned upper and lower jigs 1 and 2 by automatic feeding. Requires precision.
したがって、治具が極めて高価となる欠点があった。Therefore, there was a drawback that the jig was extremely expensive.
この考案は叙上の欠点を除去することを目的とし、大量
に生産するにあたって、安価な丸棒状リード固定泊具を
提供することを意図するものである。This invention aims to eliminate the above-mentioned drawbacks and is intended to provide a round rod-shaped lead fixing device that is inexpensive and suitable for mass production.
次に、この考案の実施例を示す第4図以下に関して説明
する。Next, FIG. 4 and subsequent figures showing an embodiment of this invention will be explained.
第4図に示すように、溝加工しない下治具16を治具部
分14上に固定する。As shown in FIG. 4, a lower jig 16 that is not to be grooved is fixed on the jig portion 14.
治具部分14は位置決め用で、従来の下治具1に形或さ
れていたと同様な精度を要する溝15を有し、この溝に
よって丸棒状リード6を下治具16上に位置決めしうる
。The jig portion 14 is for positioning and has a groove 15 which requires the same precision as that formed on the conventional lower jig 1, and the round rod-shaped lead 6 can be positioned on the lower jig 16 by this groove.
このように丸棒状リード6を位置決めして置いた下治具
16の上には次に、第5図に示すような上泊具18を従
来と同様な方法すなわちねじ止めで涸定する。Next, on top of the lower jig 16 in which the round rod-shaped lead 6 has been positioned and placed, an upper fixture 18 as shown in FIG. 5 is fixed in the same manner as in the prior art, that is, by screwing.
図示例では上泊具18はそれが丸棒状リード(第5図に
示さず)に接する面に、丸棒状リード6の材質により軟
かい弾性材料からなる弾性体19を具えている。In the illustrated example, the upper sleeper 18 is provided with an elastic body 19 made of a softer elastic material than the material of the round rod lead 6 on the surface thereof that contacts the round rod lead (not shown in FIG. 5).
弾性体19の材料の例はシリコンゴム等である。An example of the material of the elastic body 19 is silicone rubber.
したがって上下治具18,16は弾性体19を介して丸
棒状リード6を挾んで保持する。Therefore, the upper and lower jigs 18 and 16 sandwich and hold the round rod-shaped lead 6 via the elastic body 19.
丸棒状リード6を固定して保持した後は、丸棒状リード
6を位置決め保持した状態で上、下治具18,19を治
具部分14から分離して、以下従来と同様の方法で訃ラ
ンジスタの組立がなされる。After fixing and holding the round bar-shaped lead 6, the upper and lower jigs 18 and 19 are separated from the jig part 14 while the round bar-shaped lead 6 is positioned and held. is assembled.
しかして、この治具部分14は、分離後の上、千治具に
替って別の上、下治具に対しても利用できるため、複数
の上、下治具に対して共通に利用することができる。Therefore, this jig portion 14 can also be used for other upper and lower jigs instead of the upper and lower jigs after separation, so it can be used in common for multiple upper and lower jigs. can do.
この考案においては多数個を使用することを要する上、
下治具に精度の高い溝を加工する必要がなく、1個だけ
使用する治具部分14だけに丸棒状リード6を位置決め
するための高精度を要する溝15を加工すればよいので
、治具は極めて安価となる。This idea requires the use of a large number of units, and
There is no need to machine a highly accurate groove in the lower jig, and it is only necessary to machine a groove 15, which requires high precision for positioning the round bar-shaped lead 6, in only one part of the jig 14. is extremely cheap.
また前述のように、軟かい弾性体を介して丸棒状り・一
ド6を保持するので、丸棒状リードの外観、品質にも良
好な結果が得られる。Furthermore, as described above, since the round rod lead 6 is held through a soft elastic body, good results can be obtained in terms of the appearance and quality of the round rod lead.
トランジスタ組立の実施例だけを述べたが、この考案が
1・ランジスタ以外の他の丸棒状のリードを用いる樹脂
封止型半導体装置の組立においても同様に用いられうろ
ことが容易に理解できるであろう。Although only an example of transistor assembly has been described, it is easy to understand that this invention can be similarly used in the assembly of resin-sealed semiconductor devices using round bar-shaped leads other than 1. transistors. Dew.
第1図は樹脂封止型半導体装置の組立に使用される従来
の治具に丸棒状リードを取付けた状態を示す分解斜視図
、第2図は第1図の従来の治具を丸棒状リードの長さ方
向の位置決めのための治具部分に取付けた状態を示す斜
視図、第3図は従来の治具を用いて樹脂封止型半導体装
置を組立てる工程の説明図、第4図はこの考案の樹脂封
止型半導体装置組立用治具に丸棒状リードを挿入した状
態を示す斜視図、第5図は上泊具の一実施例を示す斜視
図である。
1・・・・・・下治具、2・・・・・・上治具、3・・
・・・・ねじ、4・・・・・・ねじ孔、5・・・・・・
溝、6・・・・・・丸棒状リード、7・・・・・・孔、
8・・・・・・治具部分、8′・・・・・・肩部、9・
・・・・・半導体素子、10,11・・・・・・電極、
12・・・・・・金属細線、13・・・・・・ろう材、
14・・・・・・治具部分、15・・・・・・溝、16
・・・・・・下治具、18・・・・・・上治具、19・
・・・・・弾性体。Figure 1 is an exploded perspective view showing a conventional jig used for assembling resin-encapsulated semiconductor devices with round bar-shaped leads attached, and Figure 2 shows the conventional jig shown in Figure 1 with round bar-shaped leads attached. Fig. 3 is an explanatory diagram of the process of assembling a resin-sealed semiconductor device using a conventional jig; FIG. 5 is a perspective view showing a state in which round rod-shaped leads are inserted into the resin-sealed semiconductor device assembly jig of the invention, and FIG. 5 is a perspective view showing an embodiment of the upper fixture. 1...Lower jig, 2...Upper jig, 3...
...Screw, 4...Screw hole, 5...
Groove, 6... Round bar-shaped lead, 7... Hole,
8... Jig part, 8'... Shoulder part, 9.
... Semiconductor element, 10, 11 ... Electrode,
12... Thin metal wire, 13... Brazing metal,
14...Jig part, 15...Groove, 16
...Lower jig, 18...Upper jig, 19.
...Elastic body.
Claims (1)
決めする泊具部分と、この治具部分に分離可能に保持さ
れ且つ該治具部分で位置決めされた丸棒状リードの端を
挾んで保持する2つの板状治具部分と、これら2つの板
状治具部分のいずれか一方の前記丸棒状リードに接する
面に取付けられている前記丸棒状リードよりも軟かい弾
性材料からなる弾性体とからなる樹脂封止型半導体装置
組立用治具。A bracket part for positioning round bar-shaped leads of a semiconductor device in parallel at a predetermined pitch; and 2, which is separably held by this jig part and which pinches and holds the ends of the round bar-shaped leads positioned by the jig part. and an elastic body made of an elastic material softer than the round bar lead, which is attached to the surface of one of the two plate jig parts that is in contact with the round bar lead. Jig for assembling resin-sealed semiconductor devices.
Priority Applications (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6142475U JPS595975Y2 (en) | 1975-05-08 | 1975-05-08 | Resin-encapsulated semiconductor device assembly jig |
Applications Claiming Priority (1)
Application Number | Priority Date | Filing Date | Title |
---|---|---|---|
JP6142475U JPS595975Y2 (en) | 1975-05-08 | 1975-05-08 | Resin-encapsulated semiconductor device assembly jig |
Publications (2)
Publication Number | Publication Date |
---|---|
JPS51141465U JPS51141465U (en) | 1976-11-15 |
JPS595975Y2 true JPS595975Y2 (en) | 1984-02-23 |
Family
ID=28522876
Family Applications (1)
Application Number | Title | Priority Date | Filing Date |
---|---|---|---|
JP6142475U Expired JPS595975Y2 (en) | 1975-05-08 | 1975-05-08 | Resin-encapsulated semiconductor device assembly jig |
Country Status (1)
Country | Link |
---|---|
JP (1) | JPS595975Y2 (en) |
-
1975
- 1975-05-08 JP JP6142475U patent/JPS595975Y2/en not_active Expired
Also Published As
Publication number | Publication date |
---|---|
JPS51141465U (en) | 1976-11-15 |
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