JPS595975Y2 - Resin-encapsulated semiconductor device assembly jig - Google Patents

Description

[Detailed description of the invention] This invention relates to a jig for assembling a resin-encapsulated semiconductor device, and in particular, it relates to an improvement of the jig so that an inexpensive jig can be obtained by making the jig easier to process. It is something.

With reference to FIGS. 1 to 3, a conventional assembly jig for a resin-sealed transistor and a transistor manufacturing process will be described.

As shown in FIG. 1, a large number of parallel grooves 5 at a predetermined pitch
A large number of sets of three round rod-shaped leads 6 cut to a predetermined length are positioned in these grooves of the undercarriage tool 1 having the shape of .

The depth of the groove 5 is slightly smaller than the diameter of the round lead 6, and when the round lead 6 is positioned within this groove, a part of its outer periphery protrudes slightly from the plane of the lower jig 1.

Next, the upper jig 2 is attached with screws 3 onto the lower jig 1 which positions and holds the nine-bar shaped lead.

That is, the screw 3 passes through the hole 7 of the upper jig 2 and connects to the lower jig 1.
The upper jig 2 is fixed onto the lower jig 1 by screwing onto the tie 7L4, and the round rod-shaped lead 6 is held between the ends.

In this case, the lengthwise positioning of the round rod-shaped lead is performed using a jig portion 8 as shown in FIG.

That is, the lower jig 1 has a pin (not shown) on the jig portion 8.
The length direction of the round bar lead 6 is determined by the end of the round bar lead 6 held on the lower jig 1 coming into contact with the shoulder 8' of the jig portion 8.

After the round bar-shaped lead 6 is held by the upper and lower jigs 2 and 1 as described above, a transistor is manufactured in the following steps.

That is, as shown in FIG. 3, a step of flattening the tip of the round rod-shaped lead 6, a step of fixing a semiconductor element 9 to one of the flattened surfaces via a brazing material 13, and an electrode 10 on the semiconductor element 9. .11 and the flat surface of another round bar-shaped lead 6 using a thin metal wire 12, and a sealing process using a resin (not shown).

In order to work efficiently in each of the above steps, it is necessary to machine the groove 5 that holds the round bar-shaped lead 6 with high precision, especially when handling the above-mentioned upper and lower jigs 1 and 2 by automatic feeding. Requires precision.

Therefore, there was a drawback that the jig was extremely expensive.

This invention aims to eliminate the above-mentioned drawbacks and is intended to provide a round rod-shaped lead fixing device that is inexpensive and suitable for mass production.

Next, FIG. 4 and subsequent figures showing an embodiment of this invention will be explained.

As shown in FIG. 4, a lower jig 16 that is not to be grooved is fixed on the jig portion 14.

The jig portion 14 is for positioning and has a groove 15 which requires the same precision as that formed on the conventional lower jig 1, and the round rod-shaped lead 6 can be positioned on the lower jig 16 by this groove.

Next, on top of the lower jig 16 in which the round rod-shaped lead 6 has been positioned and placed, an upper fixture 18 as shown in FIG. 5 is fixed in the same manner as in the prior art, that is, by screwing.

In the illustrated example, the upper sleeper 18 is provided with an elastic body 19 made of a softer elastic material than the material of the round rod lead 6 on the surface thereof that contacts the round rod lead (not shown in FIG. 5).

An example of the material of the elastic body 19 is silicone rubber.

Therefore, the upper and lower jigs 18 and 16 sandwich and hold the round rod-shaped lead 6 via the elastic body 19.

After fixing and holding the round bar-shaped lead 6, the upper and lower jigs 18 and 19 are separated from the jig part 14 while the round bar-shaped lead 6 is positioned and held. is assembled.

Therefore, this jig portion 14 can also be used for other upper and lower jigs instead of the upper and lower jigs after separation, so it can be used in common for multiple upper and lower jigs. can do.

This idea requires the use of a large number of units, and
There is no need to machine a highly accurate groove in the lower jig, and it is only necessary to machine a groove 15, which requires high precision for positioning the round bar-shaped lead 6, in only one part of the jig 14. is extremely cheap.

Furthermore, as described above, since the round rod lead 6 is held through a soft elastic body, good results can be obtained in terms of the appearance and quality of the round rod lead.

Although only an example of transistor assembly has been described, it is easy to understand that this invention can be similarly used in the assembly of resin-sealed semiconductor devices using round bar-shaped leads other than 1. transistors. Dew.

[Brief explanation of drawings]

Figure 1 is an exploded perspective view showing a conventional jig used for assembling resin-encapsulated semiconductor devices with round bar-shaped leads attached, and Figure 2 shows the conventional jig shown in Figure 1 with round bar-shaped leads attached. Fig. 3 is an explanatory diagram of the process of assembling a resin-sealed semiconductor device using a conventional jig; FIG. 5 is a perspective view showing a state in which round rod-shaped leads are inserted into the resin-sealed semiconductor device assembly jig of the invention, and FIG. 5 is a perspective view showing an embodiment of the upper fixture. 1...Lower jig, 2...Upper jig, 3...
...Screw, 4...Screw hole, 5...
Groove, 6... Round bar-shaped lead, 7... Hole,
8... Jig part, 8'... Shoulder part, 9.
... Semiconductor element, 10, 11 ... Electrode,
12... Thin metal wire, 13... Brazing metal,
14...Jig part, 15...Groove, 16
...Lower jig, 18...Upper jig, 19.
...Elastic body.

Claims (1)

[Scope of utility model registration request] A bracket part for positioning round bar-shaped leads of a semiconductor device in parallel at a predetermined pitch; and 2, which is separably held by this jig part and which pinches and holds the ends of the round bar-shaped leads positioned by the jig part. and an elastic body made of an elastic material softer than the round bar lead, which is attached to the surface of one of the two plate jig parts that is in contact with the round bar lead. Jig for assembling resin-sealed semiconductor devices.