JPH04127450A - Manufacture of lead frame and semiconductor device - Google Patents

Abstract

PURPOSE:To easily bring outer leads into contact with a package and, at the same time, to prevent the deformation of the outer leads by arraying the root sections of the outer leads which are brought into contact with the package at the prescribed first pitch and the leading end sections of the outer leads extended from the root sections at the second pitch which is wider than the first pitch. CONSTITUTION:Outer leads 3 are arranged in such a way that their root sections 3A of a prescribed length are arranged at a hyperfine pitch (p) (0.3 or 0.4mm) and their leading end sections 3b are arranged at the conventional pitch P (for example, 1mm). A polyimide tape 4 is stuck to the leading end sections 3B and fixes the leads 3. The final test is performed by using the leading end sections 3B of the outer leads 3 while the leads 3 are attached to a lead frame and, after the final test is made, the outer leads 3 are cut off from the position shown by dotted lines and the leading end sections 3B arranged at wider pitch are removed. Thereafter, the leads are bent into their final forms.

Description

DETAILED DESCRIPTION OF THE INVENTION [Summary] This invention relates to a lead frame and a method for manufacturing an ultra-fine pitch semiconductor device using the lead frame.

In final testing of ultra-fine pitch devices.

The purpose is to facilitate contact with the outer lead and prevent deformation of the outer lead.

l) In a package having a sealed structure in which a plurality of leads are electrically connected to the chip at one end, the leads consist of an inner lead portion to be sealed and an outer lead portion protruding from the sealing portion to the outside. The base portion of the outer lead portion that contacts the package is arranged at a predetermined first pitch,
The tips of the outer leads extending from the base portion are arranged at a second pitch that is wider than the first pitch.

2) After separating the package together with the outer lead from the lead frame according to claim 1.

The method is configured to include a step of measuring characteristics using the tips of the outer leads, and a step of removing the tips of the outer leads arranged at the second pitch.

3) The tip of the outer lead is fixed with an adhesive tape.

[Industrial application field]

The present invention relates to a lead frame and a method of manufacturing an ultra-fine pitch semiconductor device using the lead frame.

In recent years, SMD (Surface Mounting)
The use of surface mount device (Device) packages has expanded significantly.

In pursuit of further miniaturization, flat package devices with outer leads having a pitch of 0.3 or 0.4 mm have been developed.

Along with this, issues have arisen as to how to conduct a final test to measure the characteristics of these devices after the assembly process is completed, and how to suppress deformation of the leads at that time.

Specifically, it is difficult to manufacture test sockets for devices with a pitch of 0.3 mm.

The present invention uses a lead frame that satisfies the above problems, and
It can be used as a method for manufacturing ultra-fine pitch devices.

[Conventional technology]

Conventionally, the final test of flat package devices is performed by mounting the outer leads of the device on a jig such as a carrier to prevent deformation, but in this case, the outer leads may be deformed when the carrier is attached and detached, and the number of man-hours required for attachment and detachment is increased. It's difficult.

Furthermore, for devices with a pitch of 0.3 or 0.4 mm, it is difficult to accurately connect the measurement contact itself to the outer lead.

[Problem to be solved by the invention]

Addressing the above-mentioned shortcomings of the prior art, the present invention aims to facilitate contact with the outer leads and prevent deformation of the outer leads during final testing of ultra-fine pitch devices.

[Means to solve the problem]

What is the solution to the above problem?

(2) In a package with a sealed structure in which a plurality of leads are electrically connected to the chip at one end, the leads consist of an inner lead portion to be sealed and an outer lead portion protruding from the sealing portion to the outside. The base portion of the outer lead portion that contacts the package is arranged at a predetermined first pitch,
The tips of the outer leads extending from the wrinkle root portions are arranged in a lead frame arranged at a second pitch wider than the first pitch, or 2) the package is separated together with the outer leads from the lead frame described in l) above. After.

A method for manufacturing a semiconductor device, comprising the steps of measuring characteristics using the tips of the outer leads, and then removing the tips of the outer leads arranged at the second pitch, or 3) the tips of the outer leads. This is achieved by the method for manufacturing a semiconductor device described in 2) above, in which the semiconductor device is fixed with an adhesive tape.

[Effect]

In the present invention, the final test is performed with a large outer lead pitch similar to the conventional one, and then the leads are processed to form a device with the original ultra-fine pitch.

Therefore, it is easy to connect the measurement contacts to all the outer leads during measurement, and deformation of the leads can be reduced because measurements can be made at conventional pitches that are not miniaturized.

〔Example〕

FIG. 1 is a plan view illustrating an embodiment of the present invention.

In the figure, 1 is a lead frame, 2 is a package, and 3 is a lead frame.
is an outer lead, and 4 is an adhesive tape made of polyimide tape.

The figure shows the state after sealing with the resin mold. Since the individual assembly steps are conventional, their description will be omitted here.

In the outer lead 3, a portion 3A of a predetermined length at the base is arranged at the original ultra-fine pitch P (0, 3 or 0.4 mm), and a tip portion 3B is arranged at the conventional pitch P (for example, 0.3 or 0.4 mm).

1 mm).

A polyimide tape 4 is attached to the tip 3B to fix the lead.

The final test is carried out using the tip portion 3B of the outer lead 3 with the lead frame intact, and after the final test, the outer lead 3 is cut at the 9-dot line position and the enlarged pitch tip portion 3B is removed.

Thereafter, the leads are bent as shown in the final form shown in FIG.

FIGS. 2(a) and 2(b) are a plan view and a side view showing the final form of the ultrafine pitch device.

This type of lead frame l has the following characteristics.

(2) After resin sealing, the outer lead 3 is separated from the lead frame, so the tip of the outer lead and the lead frame are not connected, making it possible to measure the characteristics.

■ Since the tips of the outer leads are fixed with polyimide tape, no special method is required to fix the leads.

■ Since the lead bending process is the final process of assembly,
There is little chance of lead deformation.

■ Since the final test is performed using the tip of the outer lead, there is no need for high precision test sockets or contacts, even though it is an ultra-fine pitch device.

■ By extending conventional technology, it is possible to assemble ultra-fine pitch devices.

〔Effect of the invention〕

As explained above, according to the present invention, it was possible to facilitate contact with the outer lead and prevent deformation of the outer lead in the final test of a device with an ultra-fine pitch.

[Brief explanation of the drawing]

FIG. 1 is a plan view illustrating an embodiment of the present invention. FIGS. 2(a) and 2(b) are a plan view and a side view showing the final form of the ultrafine pitch device. In fig. ■ is a lead frame. 2 is the package. 3 is outer lead. 4 is a polyimide tape with 1 piece and 2 pieces (5f-5t)

Claims (1)

[Claims] 1) In a package having a sealed structure in which a plurality of leads are electrically connected to a chip at one end, the leads protrude outside from the sealed inner lead part and the sealed part. consisting of an outer lead portion, the base portion of the outer lead portion in contact with the package is arranged at a predetermined first pitch;
A lead frame characterized in that tip portions of the outer leads extending from the base portion are arranged at a second pitch that is wider than the first pitch. 2) After separating the package together with the outer leads from the lead frame according to claim 1, measuring the characteristics using the tips of the outer leads, and then measuring the tips of the outer leads arranged at the second pitch. 1. A method for manufacturing a semiconductor device, comprising the step of removing. 3) The method of manufacturing a semiconductor device according to claim 2, wherein a tip end of the outer lead is fixed with an adhesive tape.