JPS5956742U - Semiconductor element handling ring - Google Patents

Semiconductor element handling ring

Info

Publication number
JPS5956742U
JPS5956742U JP15087182U JP15087182U JPS5956742U JP S5956742 U JPS5956742 U JP S5956742U JP 15087182 U JP15087182 U JP 15087182U JP 15087182 U JP15087182 U JP 15087182U JP S5956742 U JPS5956742 U JP S5956742U
Authority
JP
Japan
Prior art keywords
handling ring
semiconductor element
element handling
adhesive sheet
ring
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP15087182U
Other languages
Japanese (ja)
Inventor
館脇　政行
Original Assignee
ソニー株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by ソニー株式会社 filed Critical ソニー株式会社
Priority to JP15087182U priority Critical patent/JPS5956742U/en
Publication of JPS5956742U publication Critical patent/JPS5956742U/en
Pending legal-status Critical Current

Links

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of drawings]

第１図は従来例５を示す縦断面図である。第２図ないし
第４図は本考案の一実施例を示すものであり、第２図は
ウェハを粘着シートに貼着した状態を示す外観斜視図、
第３図は半導体取扱いリングの外観斜視図、第４図Ａ及
び第４図Ｂは延伸機を示すものであり、第４図Ａは延伸
前の平面図、第４図Ｂは第４図ＡのＡ−Ａ線における延
伸後の縦断面図である。 １１・・・ウェハ、１２・・・半導体チップ、１３・・
・粘着シート、１７・・・半導体素子取扱いリング。FIG. 1 is a longitudinal sectional view showing conventional example 5. 2 to 4 show an embodiment of the present invention, and FIG. 2 is an external perspective view showing a state in which a wafer is attached to an adhesive sheet;
Figure 3 is a perspective view of the semiconductor handling ring, Figures 4A and 4B are drawing machines, Figure 4A is a plan view before stretching, and Figure 4B is Figure 4A. FIG. 2 is a longitudinal cross-sectional view taken along line A-A of FIG. 11... Wafer, 12... Semiconductor chip, 13...
-Adhesive sheet, 17...Semiconductor element handling ring.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 粘着シート上に載置したウェハを個々の半導体チップに
切断し、上記粘着シートを延伸した後、該粘着シートを
保持する取扱いリングにおいて、該リングの外周形状を
上記ウェハと相似形状とした半導体素子取扱いリング。A wafer placed on an adhesive sheet is cut into individual semiconductor chips, the adhesive sheet is stretched, and then, in a handling ring that holds the adhesive sheet, the outer periphery of the ring is shaped similar to the wafer. Handling ring.
JP15087182U 1982-10-06 1982-10-06 Semiconductor element handling ring Pending JPS5956742U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP15087182U JPS5956742U (en) 1982-10-06 1982-10-06 Semiconductor element handling ring

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP15087182U JPS5956742U (en) 1982-10-06 1982-10-06 Semiconductor element handling ring

Publications (1)

Publication Number Publication Date
JPS5956742U true JPS5956742U (en) 1984-04-13

Family

ID=30334499

Family Applications (1)

Application Number Title Priority Date Filing Date
JP15087182U Pending JPS5956742U (en) 1982-10-06 1982-10-06 Semiconductor element handling ring

Country Status (1)

Country Link
JP (1) JPS5956742U (en)

Cited By (3)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61271852A (en) * 1985-05-27 1986-12-02 Mitsubishi Electric Corp Expanded sheet fixing tool
JPS61292336A (en) * 1985-06-20 1986-12-23 Matsushita Electric Ind Co Ltd Wafer holder
WO2004038779A1 (en) * 2002-10-28 2004-05-06 Tokyo Seimitsu Co., Ltd. Expansion method and device

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134973A (en) * 1978-04-12 1979-10-19 Kyushu Nippon Electric Sheet holding jig for semiconductor wafer

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS54134973A (en) * 1978-04-12 1979-10-19 Kyushu Nippon Electric Sheet holding jig for semiconductor wafer

Cited By (4)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61271852A (en) * 1985-05-27 1986-12-02 Mitsubishi Electric Corp Expanded sheet fixing tool
JPS61292336A (en) * 1985-06-20 1986-12-23 Matsushita Electric Ind Co Ltd Wafer holder
WO2004038779A1 (en) * 2002-10-28 2004-05-06 Tokyo Seimitsu Co., Ltd. Expansion method and device
US7886798B2 (en) 2002-10-28 2011-02-15 Tokyo Seimitsu Co., Ltd. Expanding method and expanding device

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