JPS5952627U - dry etching equipment - Google Patents

dry etching equipment

Info

Publication number
JPS5952627U
JPS5952627U JP1982147423U JP14742382U JPS5952627U JP S5952627 U JPS5952627 U JP S5952627U JP 1982147423 U JP1982147423 U JP 1982147423U JP 14742382 U JP14742382 U JP 14742382U JP S5952627 U JPS5952627 U JP S5952627U
Authority
JP
Japan
Prior art keywords
dry etching
etching equipment
etching gas
cooling
processing chamber
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Pending
Application number
JP1982147423U
Other languages
Japanese (ja)
Inventor
淳 須藤
Original Assignee
富士通株式会社
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by 富士通株式会社 filed Critical 富士通株式会社
Priority to JP1982147423U priority Critical patent/JPS5952627U/en
Publication of JPS5952627U publication Critical patent/JPS5952627U/en
Pending legal-status Critical Current

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  • Drying Of Semiconductors (AREA)

Abstract

(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.

Description

【図面の簡単な説明】[Brief explanation of the drawing]

第１図は従来のドライエツチング装置の概要図、第２図
は本考案にか）るドライエツチング装置の概要図、第３
図は同じく本考案にかさるガス冷却の部分断面図である
。図中、１は反応処理室、２は半導体ウェハー、１０は
冷却水循環用外套管、１３はトラップ、１４は保温器を
示す。Fig. 1 is a schematic diagram of a conventional dry etching device, Fig. 2 is a schematic diagram of a dry etching device according to the present invention, and Fig. 3 is a schematic diagram of a dry etching device according to the present invention.
The figure is also a partial sectional view of the gas cooling device according to the present invention. In the figure, 1 is a reaction processing chamber, 2 is a semiconductor wafer, 10 is a cooling water circulation jacket tube, 13 is a trap, and 14 is a heat insulator.

Claims (1)

【実用新案登録請求の範囲】[Scope of utility model registration request] 反応処理室へ導入するエツチングガスを冷却するための
エツチングガス冷却構造を有することを特徴とするドラ
イエツチング装置。A dry etching apparatus characterized by having an etching gas cooling structure for cooling etching gas introduced into a reaction processing chamber.
JP1982147423U 1982-09-28 1982-09-28 dry etching equipment Pending JPS5952627U (en)

Priority Applications (1)

Application Number Priority Date Filing Date Title
JP1982147423U JPS5952627U (en) 1982-09-28 1982-09-28 dry etching equipment

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1982147423U JPS5952627U (en) 1982-09-28 1982-09-28 dry etching equipment

Publications (1)

Publication Number Publication Date
JPS5952627U true JPS5952627U (en) 1984-04-06

Family

ID=30327839

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1982147423U Pending JPS5952627U (en) 1982-09-28 1982-09-28 dry etching equipment

Country Status (1)

Country Link
JP (1) JPS5952627U (en)

Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558593A (en) * 1978-07-03 1980-01-22 American Water Services Apparatus for cleaning pipe of heat exchanger

Patent Citations (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS558593A (en) * 1978-07-03 1980-01-22 American Water Services Apparatus for cleaning pipe of heat exchanger

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