JPS5950445U - electronic cooling element - Google Patents
electronic cooling elementInfo
- Publication number
- JPS5950445U JPS5950445U JP1982146506U JP14650682U JPS5950445U JP S5950445 U JPS5950445 U JP S5950445U JP 1982146506 U JP1982146506 U JP 1982146506U JP 14650682 U JP14650682 U JP 14650682U JP S5950445 U JPS5950445 U JP S5950445U
- Authority
- JP
- Japan
- Prior art keywords
- cooling element
- electronic cooling
- semiconductors
- type semiconductors
- alternately
- Prior art date
- Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
- Pending
Links
- 238000001816 cooling Methods 0.000 title claims description 5
- 239000004065 semiconductor Substances 0.000 claims description 6
- 239000004020 conductor Substances 0.000 claims description 3
- 239000000758 substrate Substances 0.000 claims description 3
- 239000002184 metal Substances 0.000 claims description 2
- 210000003298 dental enamel Anatomy 0.000 description 2
- 238000010586 diagram Methods 0.000 description 1
- 230000005855 radiation Effects 0.000 description 1
Abstract
(57)【要約】本公報は電子出願前の出願データであるた
め要約のデータは記録されません。(57) [Summary] This bulletin contains application data before electronic filing, so abstract data is not recorded.
Description
第１図は従来の電子冷却素子を示す正面図、第２図は従
来の素子を示す正面図、第２図は従来の冷却素子にヒー
トシンクを付けた状態を示す図、第３図はこの考案によ
る電子冷却素子の一例を示す正面図、第４図はその他の
例を示す正面図である。
１：Ｎ形半導体、２：Ｐ形半導体、３：導体片、７：放
熱フィン、９．１０：金属基板、１１：ホーロー引き、
１２．１３：ホーロー基板。
第３図
Ｌｊ ｕ ｕ ｕ Ｌｊゝｑ−才 ４
Ｍ
口 口
口口Ｌ■１日Ｌ＋−７Figure 1 is a front view of a conventional electronic cooling element, Figure 2 is a front view of a conventional element, Figure 2 is a diagram of a conventional cooling element with a heat sink attached, and Figure 3 is this invention. FIG. 4 is a front view showing an example of an electronic cooling device according to the present invention, and FIG. 4 is a front view showing another example. 1: N-type semiconductor, 2: P-type semiconductor, 3: Conductor piece, 7: Radiation fin, 9.10: Metal substrate, 11: Enamel drawn,
12.13: Enamel board. Figure 3 Lj u u Ljゝq-years old 4
M mouth mouth mouth L■1 day L+-7
Claims (1)
導体の隣接するものの一面と、他面とが交互にそれぞれ
導体片で接続されて全体の半導体が直列に接続され、金
属基板上にホーロ引きされた基板に上記−面の導体片が
固着されている電子冷却素子。P-type semiconductors and N-type semiconductors are arranged alternately, and one side and the other side of adjacent semiconductors are alternately connected with conductor pieces, so that the entire semiconductor is connected in series, and a hole is formed on the metal substrate. An electronic cooling element in which a conductor piece on the negative side is fixed to a drawn substrate.
Priority Applications (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982146506U JPS5950445U (en) | 1982-09-27 | 1982-09-27 | electronic cooling element |
Applications Claiming Priority (1)
| Application Number | Priority Date | Filing Date | Title |
|---|---|---|---|
| JP1982146506U JPS5950445U (en) | 1982-09-27 | 1982-09-27 | electronic cooling element |
Publications (1)
| Publication Number | Publication Date |
|---|---|
| JPS5950445U true JPS5950445U (en) | 1984-04-03 |
Family
ID=30326086
Family Applications (1)
| Application Number | Title | Priority Date | Filing Date |
|---|---|---|---|
| JP1982146506U Pending JPS5950445U (en) | 1982-09-27 | 1982-09-27 | electronic cooling element |
Country Status (1)
| Country | Link |
|---|---|
| JP (1) | JPS5950445U (en) |
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0690030A (en) * | 1992-09-08 | 1994-03-29 | Agency Of Ind Science & Technol | Thermo-element sheet |
-
1982
- 1982-09-27 JP JP1982146506U patent/JPS5950445U/en active Pending
Cited By (1)
| Publication number | Priority date | Publication date | Assignee | Title |
|---|---|---|---|---|
| JPH0690030A (en) * | 1992-09-08 | 1994-03-29 | Agency Of Ind Science & Technol | Thermo-element sheet |
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