JPS5948767A - Transfer mask - Google Patents

Abstract

PURPOSE:To carry out microscopic inspection efficiently without causing electrostatic breakdown, by electrically short-circuiting a pattern with a nontransfer conductive film part on its outside through conductive wires. CONSTITUTION:The conductive film part 1 of the outer circumference of a mask substrate is electrically connected with the conductive film part 2 in its inside for use in transfer through the conductive wires 3 formed on the inside of the part 1, and all the parts 2 arranged along the wires 3 are connected through the wires 3. As a result, charge generated at each part 2 moves to the part 1, and accumulation of the charge and discharge breakdown can be prevented. Since the wires 3 can be used as a scanning coordinate axis at the time of microscopic inspection by arranging each of the wires 3 in parallel to each other at each row of the parts 3, the location of defect occurring at the parts 2 can be detected as a coordinate value, and the microscopic inspection can be carried out efficiently, too.

Description

[Detailed Description of the Invention] [Technical Field of the Invention] This invention relates to a transfer mask for transferring a pattern in the # conductor device manufacturing process, and more specifically, it is widely used for reticles and the like for producing a master mask. It is related to the glass mask that is used.

[Technical background of the invention]

Conventionally, photomasks used in the manufacture of semiconductors such as integrated circuits are usually produced by reducing and transferring a 5x or 10x image using a reticle (f) and brim (1), and a work copy mask transferred from this master mask is used. be done. A transfer mask such as a reticle has a light shielding film flange formed on a transparent glass plate, but conventional glass masks have the following problems, which need to be solved.

[Problems with background technology]

A glass mask (chrome mask) conventionally used as a reticle has a first chrome film portion 1 provided along the outer periphery of a glass substrate, as shown in FIG. The chromium film part 1 has at least one transfer chrome film part 2, that is, a chihattern, which is provided inside the chromium film part 1 and separated therefrom. In this conventional glass mask, during manufacture or handling, the first chromium film portion 1 on the outer periphery is grounded via a device or the like, but the transfer chrome film portion 2 is insulated and
Δ, the transfer chromium film portion 2 had a structure in which K charges were easily charged. Therefore, during the production of glass masks]7
〈During glass mask cleaning for reuse, etc., the transfer chromium film portion 2 is charged with an electric charge, and due to this band %, the gap between the first cross film portion 1 and the transfer chromium film portion 2 is The potential difference generated is greater than the dielectric strength between both chromium films.
4-1//: Then, a discharge occurs, and as a result, the transfer chromium film portion is destroyed and a mask pattern Vζ defect occurs.

On the other hand, apart from this problem (F), when conventional glass masks are inspected using a microscope, it is necessary to clarify the location of defective parts on the glass mask or (to quickly remove the defective parts). This is difficult to discover due to various reasons, such as microscopic examination.

The problem was that it was difficult and inefficient. That is,
With conventional glass masks, the coordinate axes that serve as the base line for scanning positions during microscopic inspection were not completely aligned on the glass mask, so (a) if the pattern on the glass mask was sparse, (b) If the pattern is observed as a large dark area when viewed under a microscope, (C) If the pattern on the glass mask is a continuous repeating/ζ turn, etc. It was impossible to directly point out the problem or confirm the scanning position during microscopic examination.

[Purpose of the invention]

The purpose of this invention is to use the conventional horn mask (
・Another object of the present invention is to provide an improved transfer mask that does not cause electrostatic damage to the pattern that is visible.Another object of the present invention is to prevent the electrostatic damage mentioned above and to improve microscopic inspection. Providing a transfer mask that can be performed accurately and efficiently.

[Summary of the invention]

(71) In order to prevent the pattern from being destroyed by electrostatic discharge, (1) electrically connect the pattern and the non-transferred conductive part (1) on the side (1) through a conductive wire. (ii) the conductive wire was used as a scanning base line or scanning coordinate axis during microscopic inspection as a pattern coordinate reference, and (iii) the conductive wire was provided on the glass substrate of the reticle. , Retechno” pattern (・1
Since the conductive line is reduced and transferred, the line width of the conductive line is transferred and set to a value of 1 (I), so that the conductive line does not appear in the 7 (J) pattern. It is something to do.

The transfer mask of the present invention is particularly suitable as a reticle to be reduced and transferred, but it can be used not only as a reticle but also as other transfer masks depending on the arrangement of the short-circuited conductive wires.

[Embodiments of the invention]

Embodiment f of the present invention will be described below with reference to FIGS. 2 and 6. In addition, in FIG. 2 and 61C1, layers and portions indicated by the same reference numerals as those in the first section (indicate the same portions as in FIG. 1).

In the first embodiment shown in FIG. 2, the first conductive film portion 1 on one circumference of the mask substrate and the chromium film portion 2 for transfer (ill) are arranged in the inner area of the first conductive film portion 1. They are electrically connected to each other by the conductive wires 3 provided, and all the transfer conductive film portions 2 arranged 17" along the conductive wires 3 are also electrically connected to each other by the conductive wires 3. (C is electrically connected. Therefore, even if an electric charge is generated in each of the transfer conductive film portions 2 in such a configuration f, I leakage, the electric charge will spread through the conductive wire 6. 1 conductive film portion 1, no charge is accumulated in each transfer conductive film portion 2,
As a result, it is possible to prevent electrical discharge damage to the transfer chrome film portion.

f: Each conductive wire 6 is connected to each transfer conductive film portion 2 as shown in the figure.
By providing each conductive wire 6 in parallel to each other in each row, each conductive wire 6 can be used for scanning P1 ≦ mark 11 during microscopic inspection and can be used as a guide, so that defects on the conductive film portion 2 for transfer can be avoided. It is possible to accurately detect the location of the object using the coordinate values and j~, and also to perform microscopic inspection efficiently.

The line width of the conductive line 3 is selected to a value such that the conductive line is not transferred, and even if it is used in conjunction with a reticle used for a stepper with a reduction ratio of 10:1. It is desirable that the line width of the conductive line is 2 μm or less. That is, it was confirmed that if the line width of the conductive lines on the reticle was 2/1771 or less, no transferred image would appear on the mask even if the reticle was transferred using a 10:1 stepper.

In the second embodiment shown in FIG. 6, conductive wires 3A, 3B in two directions that intersect with each other are provided in a mesh shape in the inner region of the first conductive film 1, so that both conductive wires 3A, 3
Since the coordinate values of any location within the area can be determined using B as the coordinate axis, microscopic inspection is easier than with the transfer mask of the first embodiment.
It can be carried out.

〔Effect of the invention〕

As described above, with this invention, it is possible to perform microscopic inspection efficiently without causing electrostatic damage, and to accurately and numerically identify the location of pattern damage during microscopic inspection. A transfer mask that can be detected provides a capture force.

According to the transfer mask of the present invention, during microscopic examination, the pattern on the man and the rear may be sparse, the pattern may be observed as a large dark area, or the pattern may be observed as a large dark area.
I'l where the pattern was a continuous repeating pattern of 7
1. However, microscopy must be able to reliably scan the entire surface of the mask and detect defects reliably.

In addition, in the examples, only the case where a Cr non-explosion reticle (C is implemented) is shown, but it goes without saying that the present invention can also be applied to other transfer masks.

[Brief explanation of the drawing]

FIG. 1 is a schematic plan view of a conventional transfer mask. FIG. 2 is a plan view of a first embodiment of the present invention, and FIG. 31 is a plan view of a second embodiment of the present invention. FIG. 7 is a plan view of example i, with a conductive film portion for pattern transfer removed. 1... First conductive film portion, 2... Transfer conductive film portion, 6.68, 3B... Conductive wire.

Claims (1)

[Claims] 1. A transparent insulating substrate, a conductive film portion provided along the outer periphery of the substrate, and a conductive film portion separated from the conductive film portion of the goo. In a transfer mask composed of at least one transfer conductive film portion provided on a substrate, conductive lines with a line width that cannot be transferred? The i
Provided on the substrate between the L-th conductive film portion and the transfer conductive film portion, and connect the −th conductive film portion and the transfer conductive film portion with an electrical current of 1c via the conductive wire I-. A transfer mask characterized by one connection. 2. The conductive wires are arranged in a planar mesh shape, and the conductive conductive film parts are electrically connected to each other, and the conductive film part for transfer is electrically connected to the second conductive film part. 1 (transfer mask according to claim 1, which is connected).