JPS5947851B2 - Manufacturing method for brazed electrical connections - Google Patents

Description

DETAILED DESCRIPTION OF THE INVENTION The present invention relates to a method for manufacturing a brazed electrical contact (hereinafter referred to as a brazed contact).

Conventionally, brazed contacts have been made by pressing a brazed contact material plate that is made by joining a contact material plate and a thin solder plate, or by stacking the contact material and the solder metal made by pressing the contact material plate and the solder thin plate, respectively, until the melting point of the wax is reached. It was made by heating it to a higher temperature.

However, with these methods, the former produces a large amount of scrap with the contact material and solder bonded together, requiring a large amount of money to collect and refine, while the latter requires a great deal of labor to layer each thin piece of solder and the contact one by one. Not only is it necessary;
Since the wax is extremely thin, it is difficult to reliably stack only one layer, and there are many cases where two or more layers overlap, resulting in inconsistent quality.

In order to eliminate the above-mentioned drawbacks, the inventors of the present invention, through initial sales efforts, have discovered a method for producing a uniform contact with a groove 5 that has a high yield and high productivity.

In the process of joining the contacts and the solder, the present invention does not stack the contacts and the solder one by one as in the conventional method.
, the contacts 1 arranged at equal intervals and a thin plate of solder 3 are stacked on top of each other, and the solder is bonded to the contacts by heating above the melting point of the wax in a non-oxidizing atmosphere.

According to the present invention, the solder 31 in the part that is in contact with the contact 1 not only melts and adheres to the contact surface 1' that was in contact with the solder, but also the solder 532 in the part that is not in contact with the contact 1 because the solder is a thin plate. Due to the surface tension of the solder itself, it flows and adheres to the contact surface 1' that was in contact with the solder.

In the present invention, the contacts 1 are arranged at equal intervals.
This is to equalize the amount of the portion of the filter 532 that is not in contact with the contact 1.

Furthermore, the purpose of surrounding the solder joint with a non-oxidizing atmosphere is to prevent oxidation of the solder and to maintain the flowability and wettability of the solder.

In order to further clarify the effects of the present invention, specific examples and their results will be described in detail below.

Example 1 As shown in Fig. 1, holes 4 of 5.1φ wings are formed on the gravite plate 2 at equal intervals (the distance between the centers of each hole is 6.5 wa).
Layer the gravite plate 21 with 661 holes on it (rt) and insert an Ag contact (5,0φ=X1t1u/1) into the hole 4,
On top of that 130 WB7zX 2257imX O,0
4 is a thin Ag wax plate 3 (JISZ326iBAg-1
), and then layer the gravite plate 21 on top of it to form 74
After processing in an atmosphere of 0°C Ta.

Example 2 As shown in Fig. 2, on the gravite plate 2, 150 W
gX 260111jnx o, o 5 tg Ag wax thin plate 3 (JISZ3261BAg3) is stacked on top of which 661 holes 4 of 6,1φ diameter are drilled at equal intervals (7-5 traps between holes). 2
1 and put a 12% CdO-Ag contact (6,0
φ field gX1trL11) in a nitrogen atmosphere,
After the 65°C X 2 vtin treatment, the pieces were allowed to cool naturally in a jig to room temperature, and the solder was evenly bonded to all the pieces, resulting in a soldered contact as shown in Figure 3.

As can be seen from the above explanation, the manufacturing method of the present invention has much higher productivity and yield (and uniform quality) than the conventional manufacturing method, which takes many seconds to set the wax. This can be said to be a method for manufacturing brazed contacts.

[Brief explanation of drawings]

FIG. 1 is a cross-sectional view of the contact and the solder thin plate according to the present invention, FIG. 2 is a cross-sectional view of another embodiment, and FIG. 3 is a cross-sectional view of the contact after brazing.

Claims (1)

[Claims] 1. Brazing characterized by arranging a large number of electrical contacts at equal intervals above or below the solder thin plate in contact with the solder thin plate, and heating the solder to a temperature higher than the liquidus temperature of the solder in a non-oxidizing atmosphere. Method of manufacturing electrical contacts.