JPS6029248B2 - Hermetic terminal and its manufacturing method - Google Patents

Hermetic terminal and its manufacturing method

Info

Publication number
JPS6029248B2
JPS6029248B2 JP1166075A JP1166075A JPS6029248B2 JP S6029248 B2 JPS6029248 B2 JP S6029248B2 JP 1166075 A JP1166075 A JP 1166075A JP 1166075 A JP1166075 A JP 1166075A JP S6029248 B2 JPS6029248 B2 JP S6029248B2
Authority
JP
Japan
Prior art keywords
outer frame
terminal
brazing
glass body
terminal board
Prior art date
Legal status (The legal status is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the status listed.)
Expired
Application number
JP1166075A
Other languages
Japanese (ja)
Other versions
JPS5186379A (en
Inventor
昭 渡辺
三郎 原田
Current Assignee (The listed assignees may be inaccurate. Google has not performed a legal analysis and makes no representation or warranty as to the accuracy of the list.)
Seiko Epson Corp
KOTO DENKI KK
Original Assignee
Seiko Epson Corp
KOTO DENKI KK
Priority date (The priority date is an assumption and is not a legal conclusion. Google has not performed a legal analysis and makes no representation as to the accuracy of the date listed.)
Filing date
Publication date
Application filed by Seiko Epson Corp, KOTO DENKI KK filed Critical Seiko Epson Corp
Priority to JP1166075A priority Critical patent/JPS6029248B2/en
Priority to GB315776A priority patent/GB1478448A/en
Priority to US05/653,003 priority patent/US4033017A/en
Priority to CH103276A priority patent/CH609527B/en
Publication of JPS5186379A publication Critical patent/JPS5186379A/en
Publication of JPS6029248B2 publication Critical patent/JPS6029248B2/en
Expired legal-status Critical Current

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  • Wire Bonding (AREA)

Description

【発明の詳細な説明】 本発明は、水晶電子時計等に用いられる小型の水晶振動
子等を電気的および機械的に取付ける端子板と、それに
接続されたりード線とを水晶振動子等を収容するケース
に取付けられる外枠に封着絶縁用のガラスを介して一体
的に固定する構造をなしたハーメチック端子およびその
製造方法に関するものである。
DETAILED DESCRIPTION OF THE INVENTION The present invention provides a terminal board for electrically and mechanically attaching a small crystal oscillator used in a quartz electronic watch, etc., and a wire connected to the terminal board to connect the crystal oscillator, etc. The present invention relates to a hermetic terminal having a structure that is integrally fixed to an outer frame attached to a housing case via sealing and insulating glass, and a method for manufacturing the same.

水晶電子腕時計等に用いられる小型水晶発振器は、例え
ば第1図に示すように、水晶振動子2を電気的かつ機械
的に接続する一対の端子板3と、端子板3にろう付けさ
れたりード線4と、水晶振動子2を収容するケース1に
ろう付けされた外枠5とをガラス体6で気密シールする
ハーメチツク端子を有している。
A small crystal oscillator used in a crystal electronic wristwatch, etc., for example, as shown in FIG. It has a hermetic terminal that hermetically seals the lead wire 4 and an outer frame 5 which is brazed to a case 1 housing a crystal resonator 2 with a glass body 6.

かかるハーメチツク端子を製造する従来の方法は、外枠
5とりード線4をガラス体6で絶系象封着する加熱工程
の後に、リード線4と端子板3とを銀銅共晶ろう付け村
によってろう付けする工程と、外枠5をケース1に対し
て同じく銀銅共晶ろう付け材によってろう付けする工程
とがある。このような従来の製造方法においては、リー
ド線4と端子板3とのろう付け、並びに外枠5とケース
ーとのろう付け時に、リード線4、外枠5、ガラス体6
の各部品が再加熱されるため、当該部品が熱衝撃によっ
て壊される欠点がある。また、一対の端子板3とりード
線4との接続位置の規制、および端子板3間の間隔の寸
法精度良く出すことが、特に各部品が小さいことからし
て困難で、水晶振動子2の取付けが満足にできなくなる
事態が多く発生し、歩蟹が悪いと共に機械化による量産
化が難しい欠点を有している。特に、端子板3の取り付
けを規定の寸法に維持するためには、加熱工程時に用い
る鋳型治具が複雑になると同時に、多くの工数が必要と
なって、生産性が悪く、安価な量産が不可能となる。而
して本発明は、従来の欠点を除去すると共に簡単な工程
で精度の良いハーメチック端子を得るこができるハーメ
チック端子の製造方法を提供するもので、以下図面を参
照しつつ、その詳細を説明する。
The conventional method for producing such hermetic terminals is to perform a heating process in which the outer frame 5 and the lead wires 4 are insulatedly sealed with the glass body 6, and then to bond the lead wires 4 and the terminal plate 3 to each other by silver-copper eutectic brazing. There is a step of brazing the outer frame 5 to the case 1 using silver-copper eutectic brazing material. In such a conventional manufacturing method, when brazing the lead wire 4 and the terminal plate 3 and brazing the outer frame 5 and the case, the lead wire 4, the outer frame 5, and the glass body 6 are
Since each part is reheated, there is a drawback that the parts are destroyed by thermal shock. In addition, it is difficult to regulate the connection position between the pair of terminal plates 3 and the lead wire 4, and to provide the spacing between the terminal plates 3 with good dimensional accuracy, especially since each component is small. There are many situations in which the installation cannot be carried out satisfactorily, and the problem is that it is difficult to carry out mass production through mechanization. In particular, in order to maintain the mounting of the terminal plate 3 within the specified dimensions, the mold jig used during the heating process becomes complicated and requires a large number of man-hours, resulting in poor productivity and impeding inexpensive mass production. It becomes possible. Therefore, the present invention provides a method for manufacturing a hermetic terminal that eliminates the drawbacks of the conventional method and can obtain a hermetic terminal with high precision through a simple process. do.

第2図は、本発明に従うハーメチック端子の製造方法が
実施されるハーメチツク端子の各構成部品を示す斜視図
で、図中、符号7は第1図に示された端子板3に相応す
る端子板である。
FIG. 2 is a perspective view showing each component of a hermetic terminal in which the hermetic terminal manufacturing method according to the present invention is carried out, and in the figure, reference numeral 7 indicates a terminal plate corresponding to the terminal plate 3 shown in FIG. It is.

端子板7は、例えば鉄50%、ニッケル50%の鉄・ニ
ッケル合金の導電性を有した金属板からホトェッチング
処理によって作られるもので、円形部8と、円形部8の
直径方向に対称的に伸びる幅狭部9と、幅狭部9に連な
る幅広部10と、上記円形部8の中央部を通り幅広部1
0間に伸びるスリット12と、幅狭部9の幅方向に形成
されたハーフエッチ部11とを有している。この端子板
7は一つだけを打ち抜き等によって単独に作ることもで
きるが、幅広部10を介して複数個連続して作ることが
生産性の上から好ましく、実際にはそのように作られて
いる。端子板7の下面には、銀〆ッキ層13と銅〆ッキ
層14の二重メッキ層からなるろう付け部材が設けられ
ている。符号15,16は、第1図のりード線4に相当
するりード線で、例えば鉄50%、ニッケル50%の鉄
・ニッケル合金からなるリード線である。
The terminal plate 7 is made from a conductive metal plate made of an iron-nickel alloy of 50% iron and 50% nickel by photoetching, and has a circular portion 8 and a circular portion 8 symmetrically in the diameter direction of the circular portion 8. A narrow part 9 extends, a wide part 10 continues to the narrow part 9, and a wide part 1 passes through the center of the circular part 8.
It has a slit 12 extending between zero and a half-etched part 11 formed in the width direction of the narrow part 9. Although it is possible to make only one terminal board 7 by punching or the like, it is preferable from the viewpoint of productivity to make a plurality of terminal boards consecutively through the wide part 10, and in reality, it is not possible to make them in this way. There is. A brazing member made of a double plating layer of a silver laminate layer 13 and a copper laminate layer 14 is provided on the lower surface of the terminal board 7. Reference numerals 15 and 16 are lead wires corresponding to the lead wire 4 in FIG. 1, and are lead wires made of an iron-nickel alloy containing, for example, 50% iron and 50% nickel.

符号17は円柱状に成形され、仮焼結されたガラス体で
、第1図のガラス体6に相当し、リード線15,16が
挿通される挿入穴18,19を有している。符号2川ま
下緑に段部21を有した略円筒形状をなした外枠で、鉄
あるいは鉄・ニッケル合金で作られ、その表面には銀〆
ッキ層22と銅〆ッキ層23の二重メッキ層からなるろ
う付け部材が設けられている。符号24は第1図におけ
るケース1に相当するケースの下側を構成する下ケース
で、延性のある銅等で作られ、かつ水晶振動子を収容す
るのに適合した大きさ、形状に作られている。下ケース
24には、上記した外枠20の段部21が競合するのに
適合した穴25が形成されている。かかる部品によって
構成されるハーメチック端子の製造方法の次に説明する
Reference numeral 17 denotes a glass body formed into a cylindrical shape and temporarily sintered, which corresponds to the glass body 6 in FIG. 1 and has insertion holes 18 and 19 through which lead wires 15 and 16 are inserted. Code 2: An approximately cylindrical outer frame with a step 21 in the lower part of the river, and is made of iron or an iron-nickel alloy, and its surface is coated with a silver glazing layer 22 and a copper lacquering layer 23. A brazing member consisting of a double plating layer is provided. Reference numeral 24 denotes a lower case constituting the lower side of the case corresponding to case 1 in FIG. 1, which is made of ductile copper or the like and has a size and shape suitable for housing a crystal resonator. ing. A hole 25 is formed in the lower case 24 to accommodate the step portion 21 of the outer frame 20 described above. A method of manufacturing a hermetic terminal constructed from such parts will be described next.

まず、組立工程によってリード線15,16をガラス体
17の挿入穴18,19に各々挿入すると共に、リード
線15,16の一端に端子板7の円形部8の下面を対向
配置し、またガラス体17を外枠20内にはめ、更に外
枠20を下ケース24の穴25にはめる。
First, in the assembly process, the lead wires 15 and 16 are respectively inserted into the insertion holes 18 and 19 of the glass body 17, and the lower surface of the circular part 8 of the terminal plate 7 is placed opposite to one end of the lead wires 15 and 16, and the glass body The body 17 is fitted into the outer frame 20, and the outer frame 20 is further fitted into the hole 25 of the lower case 24.

この組立工程は第3図に示すように、カーボンで作られ
た2分割構造をなす上下方向の移動だけが許容された鋳
型治具26,27内で行われ、同時に各部品の相対位置
が規制される。端子板7が前述したように、複数連続し
て設けられている場合には、各端子板7の円形部8に対
応する位置に鋳型拾具26,27の鋳型部分が配置され
ている。組立工程で組立てられ、鋳型拾臭26,27に
入れられた各部品は、中性または弱還元性雰囲気炉内に
おいて900qoの温度で約3粉ご間加熱する。
As shown in Fig. 3, this assembly process is carried out in mold jigs 26 and 27, which have a two-part structure made of carbon and are only allowed to move in the vertical direction, and at the same time, the relative positions of each part are regulated. be done. As described above, when a plurality of terminal plates 7 are provided in succession, the mold portions of the mold pick-ups 26 and 27 are arranged at positions corresponding to the circular portions 8 of each terminal plate 7. Each of the parts assembled in the assembly process and placed in the molds 26 and 27 is heated in a neutral or weakly reducing atmosphere furnace at a temperature of 900 qo for about 3 minutes.

この加熱工程時において、端子板7および外枠201こ
設けた銀〆ッキ層13,32、銅〆ッキ層14,23は
、第4図に示すAg−Cu平衡状態図の液相線1から判
るように、銀あるいは銅単独では溶融しない90000
以下の温度においてもそれらが熱拡散等によって合金化
することにより熔融状態となる。これによって端子板7
とりード線15,16とがろう付けされ、また外枠20
と下ケース24とがろう付けされる。なお、第4図にお
いて、ロは固相線、m,Nは溶解度曲線、Aは銀の溶融
点、Bは銅の溶融点、Cは共晶点である。一方、加熱工
程時には、バリウム・ソーダ・金日系のガラス体17が
軟化し、外枠20、リード線15,16、端子板7が気
密に絶縁封着される。加熱工程の終了後、鋳型治具26
,27から各部品を取り出し、端子板7のハーフエッチ
部12を介して円板部8から幅狭部9、幅広部10を切
り離す。この工程によって、端子板7はスリット12に
規制された隙間を有した二つの略半円形をなした二つの
端子板に分割される。二つに分けられた端子板の端面に
は必ず切り欠き部が残り、そこに半田によって水晶振動
子2を半田付けする。上記した工程の終了後、下ケース
24とそれに対応する上ケースとを真空中で冷間圧酸す
ることによって水晶発振器が得られる。以上、図面を参
照しつつ本発明に従うハーメチック端子の製造方法の詳
細を説明して釆たが、本発明は図示した構造のハーメチ
ック端子の製造に限定されるものではない。
During this heating process, the silver laminate layers 13, 32 and the copper laminate layers 14, 23 provided on the terminal board 7 and the outer frame 201 are at the liquidus line in the Ag-Cu equilibrium state diagram shown in FIG. As you can see from 1, silver or copper alone does not melt 90,000
Even at temperatures below, they become alloyed by thermal diffusion and the like, resulting in a molten state. This allows the terminal board 7
The lead wires 15 and 16 are brazed, and the outer frame 20
and the lower case 24 are brazed together. In FIG. 4, B is the solidus line, m and N are the solubility curves, A is the melting point of silver, B is the melting point of copper, and C is the eutectic point. On the other hand, during the heating process, the barium-soda-metal-based glass body 17 is softened, and the outer frame 20, lead wires 15, 16, and terminal plate 7 are hermetically insulated and sealed. After the heating process is completed, the mold jig 26
, 27, and the narrow portion 9 and wide portion 10 are separated from the disk portion 8 via the half-etched portion 12 of the terminal plate 7. Through this step, the terminal plate 7 is divided into two substantially semicircular terminal plates having a gap regulated by the slit 12. A notch is always left on the end face of the terminal board divided into two, and the crystal resonator 2 is soldered therein. After the above steps are completed, a crystal oscillator is obtained by subjecting the lower case 24 and the corresponding upper case to cold pressure acidification in a vacuum. Although the details of the method for manufacturing a hermetic terminal according to the present invention have been described above with reference to the drawings, the present invention is not limited to manufacturing a hermetic terminal having the structure shown in the drawings.

例えば、端子板7にハーフエッチ部11を形成し、そこ
から不要部分を除去するようにしてあるが、ハーフエッ
チ部11に代えて、くびれ部を設けるようにすることも
できる。いずれの構造にしてもスリット12によって分
割された2つの端子板の間隔の寸法精度は非常に高く、
量産化のための各工程の機械化が容易となる著しい利点
がある。端子板7とりード線15,16とのろう付け、
外枠20と上ケース24とのろう付けを、銀〆ツキ層と
銅〆ッキ層とからなるろう付け部村で行っているが、加
熱工程時にガラス体17を軟化させる時の温度で熔融す
る他のろう付け部材を使用してもよい。
For example, although the half-etched portion 11 is formed on the terminal plate 7 and unnecessary portions are removed from the half-etched portion 11, a constricted portion may be provided instead of the half-etched portion 11. In either structure, the dimensional accuracy of the interval between the two terminal plates divided by the slit 12 is very high.
There is a significant advantage that it is easy to mechanize each process for mass production. Brazing the terminal plate 7 with lead wires 15 and 16,
The outer frame 20 and the upper case 24 are brazed together in a brazing section consisting of a silver laminate layer and a copper laminate layer, which are melted at the temperature used to soften the glass body 17 during the heating process. Other brazing members may also be used.

また、ろう付け部材は端子板7および外枠20の所要部
分だけに設けておけば、実際上は充分である。なお、端
子板7のスリット12は水晶振動子2の厚さより5/I
0の華度、広い幅に形成する。叙上の如く、本発明に従
うハーメチック端子の製造方法は、ガラス体を加熱工程
時によって軟化させると同時に、端子板および外枠に設
けたろう付け都村を溶融させて端子板とりード線とのろ
う付け、外枠とケースとのろう付けを行うため、それら
を別工程で行っていた従来の製造方法より製造工程を簡
略化でき、しかも再加熱による熱衝撃に起因する破壊を
防止することができ、さらに端子板をスリットに規制さ
せて封着分割するため、端子板間の寸法を精度良く作る
ことができる等の利点を有し、効率のよい量産化が可能
である等、充分に所期の目的を達成し得、実施上多大な
効果を奏する。
In addition, it is actually sufficient to provide the brazing members only at required portions of the terminal plate 7 and the outer frame 20. Note that the slit 12 of the terminal plate 7 is 5/I smaller than the thickness of the crystal resonator 2.
0 degree, formed into a wide width. As described above, the method for manufacturing a hermetic terminal according to the present invention softens the glass body during the heating process, and at the same time melts the brazing joints provided on the terminal plate and the outer frame to connect the terminal plate to the lead wire. Since the outer frame and case are brazed together, the manufacturing process is simpler than the conventional manufacturing method, which involves brazing these parts in separate processes, and it also prevents damage caused by thermal shock caused by reheating. Furthermore, since the terminal plates are regulated by slits and sealed and divided, it has the advantage of being able to create the dimensions between the terminal plates with high precision, and allows for efficient mass production. The objective of the project can be achieved and has a great effect on implementation.

【図面の簡単な説明】[Brief explanation of the drawing]

第1図は、ハーメチツク端子を利用した水晶発振子器の
縦断面図、第2図は、本発明に従う製造方法が適用され
るハーメチック端子の各部品の分解斜視図、第3図は、
第2図に示された各部品を組立工程によって鋳型治具に
組立てた状態を示す縦断面図、第4図は、ろう付け部材
として用いられる銀・銅合金の平衡状態図である。 7・・・・・・端子板、12・・…・スリット、11・
・・・・・切りかき部(ハーフエッチ)、13,14…
…ろう付け部村としての銀〆ッキ層と銅〆ッキ層、15
,16……リード線、17……ガラス体、18,1・・
・・・・挿入穴、20・・・・・・外枠、22,23・
・・・・・ろう付け部村としての銀〆ッキ層と銅〆ツキ
層、24・・・・・・ケースの一部を構成する下ケース
。 第「図第2図 第5図 第4図
FIG. 1 is a longitudinal cross-sectional view of a crystal oscillator using a hermetic terminal, FIG. 2 is an exploded perspective view of each component of the hermetic terminal to which the manufacturing method according to the present invention is applied, and FIG.
A vertical cross-sectional view showing the parts shown in FIG. 2 assembled into a mold jig through an assembly process, and FIG. 4 is an equilibrium state diagram of a silver-copper alloy used as a brazing member. 7...Terminal board, 12...Slit, 11.
... Cut section (half-etch), 13, 14...
...Silver glazing layer and copper lacquering layer as brazing parts, 15
, 16...Lead wire, 17...Glass body, 18,1...
...Insertion hole, 20... Outer frame, 22, 23.
・・・・・・Silver finish layer and copper finish layer as brazing parts, 24・・・・・・Lower case forming part of the case. Figure 2 Figure 5 Figure 4

Claims (1)

【特許請求の範囲】 1 水晶振動子等を収容するケースに構成されるハーメ
チツク端子において、水晶発振子を固定する端子板は電
極分割するための細長いスリツトを有し、かつ端子板の
一部には前記スリツトに交差し電極を分離するための貫
通しない切りかき部を設けたことを特徴とするハーメチ
ツク端子。 2 細長いスリツトを有し少なくとも一部にろう付け部
材が設けられた導電性材料からなる端子板と、上記端子
板に接続される複数のリード線と、上記リード線が各々
挿通される挿入穴を備えたガラス体と、一部にろう付け
部材が設けられた水晶振動子等を収容する金属製のケー
スに取付けられる金属製の外枠との各部品を、上記ケー
スの所定位置に上記外枠が対向配置されると共に外枠内
に上記ガラス体が入れられ、更にガラス体に上記リード
線が挿入され、かつリード線の一端に上記ろう付け部材
を介して上記端子板が対向配置される状態に組立ての組
立工程と、上記ガラス体が軟化すると共に上記端子板お
よび外枠に設けたろう付け部材が溶融する温度に上記組
立工程で組立てられた各部品を加熱する加熱工程と、上
記加熱工程の終了後上記外枠にガラス体を介した固定さ
れた上記端子板の端部を除去し、上記スリツトに規制さ
せて上記端子板を複数に分割する工程とからなり、上記
ろう付け部材を介してリード線と端子板とのろう付け、
並びに外枠とケースとのろう付けを行うことを特徴とす
るハーメチツク端子の製造方法。
[Claims] 1. In a hermetic terminal configured in a case that houses a crystal oscillator, etc., the terminal plate for fixing the crystal oscillator has an elongated slit for dividing the electrodes, and a part of the terminal plate has an elongated slit for dividing the electrode. The hermetic terminal is characterized in that a non-penetrating cut portion is provided that intersects with the slit and separates the electrodes. 2. A terminal board made of a conductive material having an elongated slit and at least partially provided with a brazing member, a plurality of lead wires connected to the terminal board, and an insertion hole into which each of the lead wires is inserted. The outer frame is attached to a predetermined position of the case, and a metal outer frame that is attached to a metal case that houses a crystal resonator etc. is partially provided with a brazing member. are placed facing each other, the glass body is placed in an outer frame, the lead wire is inserted into the glass body, and the terminal plate is placed facing one end of the lead wire via the brazing member. a heating step of heating each component assembled in the above assembly step to a temperature at which the glass body softens and the brazing members provided on the terminal plate and the outer frame melt; After finishing, the end portion of the terminal board fixed to the outer frame through the glass body is removed, and the terminal board is divided into a plurality of parts by regulating the slit, and the end part of the terminal board is fixed to the outer frame through the glass body. Brazing the lead wire and terminal board,
and a method for manufacturing a hermetic terminal, which comprises brazing the outer frame and the case.
JP1166075A 1975-01-28 1975-01-28 Hermetic terminal and its manufacturing method Expired JPS6029248B2 (en)

Priority Applications (4)

Application Number Priority Date Filing Date Title
JP1166075A JPS6029248B2 (en) 1975-01-28 1975-01-28 Hermetic terminal and its manufacturing method
GB315776A GB1478448A (en) 1975-01-28 1976-01-27 Method of making an hermetically sealed terminal
US05/653,003 US4033017A (en) 1975-01-28 1976-01-28 Manufacturing method of a hermetically sealed terminal
CH103276A CH609527B (en) 1975-01-28 1976-01-28 PROCESS FOR MANUFACTURING TIGHTLY SEALED CONNECTIONS.

Applications Claiming Priority (1)

Application Number Priority Date Filing Date Title
JP1166075A JPS6029248B2 (en) 1975-01-28 1975-01-28 Hermetic terminal and its manufacturing method

Publications (2)

Publication Number Publication Date
JPS5186379A JPS5186379A (en) 1976-07-28
JPS6029248B2 true JPS6029248B2 (en) 1985-07-09

Family

ID=11784122

Family Applications (1)

Application Number Title Priority Date Filing Date
JP1166075A Expired JPS6029248B2 (en) 1975-01-28 1975-01-28 Hermetic terminal and its manufacturing method

Country Status (1)

Country Link
JP (1) JPS6029248B2 (en)

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213735A (en) * 1985-03-20 1986-09-22 Nakamura Kogyosho:Kk Throw-in type thermometer

Cited By (1)

* Cited by examiner, † Cited by third party
Publication number Priority date Publication date Assignee Title
JPS61213735A (en) * 1985-03-20 1986-09-22 Nakamura Kogyosho:Kk Throw-in type thermometer

Also Published As

Publication number Publication date
JPS5186379A (en) 1976-07-28

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