JPH0546281Y2 - - Google Patents

Description

[Detailed description of the invention] [Industrial application field] The present invention relates to a lead frame used in a ceramic package (hereinafter referred to as a package) in which a semiconductor element is housed, and more specifically, the present invention relates to a lead frame used in a ceramic package (hereinafter referred to as a package) in which a semiconductor element is housed. By using the elasticity of the lead frame itself, the lead terminal is pressed against the metal layer (metallized metal layer) of the package member, and the lead terminal is bonded to the metallized metal layer of the package member through a brazing material such as silver solder. The present invention relates to an improvement in a connected lead frame that can be accurately brazed to layers.

[Conventional technology]

Conventionally, an IC package for housing leaded electronic components, such as integrated circuit elements, is made of an electrically insulating material such as ceramic or glass, and has molybdenum (Mo), tungsten ( metallized metal layer 21 made of high melting point metal powder such as W), manganese (Mn), etc.
It consists of an insulating base 18 having a The circuit element 23 is housed and hermetically sealed to form a semiconductor device.

In such a conventional semiconductor package, when the lead terminal 12 is brazed to the metallized metal layer 21 on the side surface of the insulating base 18 as a package member through a brazing material such as silver solder, the insulating base 18 and the insulating base 18 are placed in a jig made of graphite or the like. Brazing metal is clad on the surface.
The lead terminals 12 that have been placed in the The lead terminals 12 were brazed to the metallized metal layer 21 on the side surface of the insulating base 18 as a package member by passing the soldering material through a furnace for heating and melting it.

However, according to this method, the insulating substrate 1
The lead terminal 12 is attached to the side metallized metal layer 21 of 8.
A jig made of graphite or the like is required to position and join the two, and positioning the insulating base 18 and the lead terminals 12 within the jig is very time-consuming. Insulating base 18
It has to be prepared individually according to the shape of the lead terminal 12, and it has extremely poor versatility, which has the drawback of making the semiconductor package as a product expensive.

Furthermore, when the lead terminal 12 is brazed to the metallized metal layer 21 on the side surface of the insulating base 18 as a package member using the jig, the graphite constituting the jig may be attached to the surface of the metallized metal layer 21 of the insulating base 18 or the lead terminal. As a result, when plating is applied to the surface of the lead terminal 12 etc. in the next step, since graphite is attached to the surface of the lead terminal 12 etc., the plating metal layer will be removed. It has the disadvantage that it does not adhere well and causes poor adhesion and pinholes in the plated metal layer.

Therefore, in order to improve the above drawback, a pair of lead frames 13, 13 having a plurality of lead terminals 12 as shown in FIG.
A connected lead frame 11 for a semiconductor package has been proposed, which is connected by a plurality of connecting plates 14 having a shelf section 15 on which a lead frame 8 is placed. This connected lead frame 11 for a semiconductor package has shelf portions 15 facing each other of adjacent connecting plates 14, 14,
The insulating base 18 is placed on the shelf 15 and the shelf 1
5 and 15 to press and hold the insulating base 18, thereby positioning the side metallized metal layer of the insulating base 18 and the lead terminal 12,
Thereafter, the metallized metal layer of the insulating substrate 18 and the lead terminal 12 are bonded by passing it through a brazing furnace.
and were soldered together.

However, according to this method, the connected lead frame 11 must be accurately punched in accordance with the external dimensions of the insulating base 18 in order to prevent misalignment between the insulating base 18 and the lead terminals 12. When the insulating base 18 is placed on the shelves 15, 15 of adjacent connecting plates 14, 14 and the insulating base 18 is pressed and held using the elasticity of the connecting plates 14, 14, the insulating base 18 is placed on the shelves 15, 15 of the adjacent connecting plates 14, 14. 15, the connecting plates 14, 14 must be pushed apart, and if excessive force is applied to the connecting plates 14 at this time, the connecting plates 14 will be deformed, and as a result, the connecting plates 14 is unable to press and hold the insulating base 18, and the metallized metal layer on the side surface of the insulating base 18 and the lead terminal 12 cannot be accurately positioned and joined, and the lead terminal 12 cannot be accurately brazed to the metallized metal layer. It had drawbacks.

[Purpose of invention]

The present invention was devised in view of the above-mentioned drawbacks, and eliminates deformation of the lead frame when positioning the lead terminal in contact with the package member, thereby preventing the lead terminal from shifting in position, and allowing the lead terminal to be placed in contact with the package member with extremely high accuracy. The purpose is to provide a new lead frame that can be well brazed.

[Means for solving problems]

The present invention is a semiconductor package in which a pair of lead frames each having a plurality of lead terminals are connected by a connecting plate having a shelf section on which a package member is placed and a hook section on both sides for abutting and positioning the package member. The connecting type lead frame is characterized in that a slit is formed in the connecting plate between the two claw parts.

〔Example〕

Next, the present invention will be explained in detail based on the embodiment shown in FIG.

FIG. 1 shows an example of the position of a connected lead frame for a semiconductor package according to the present invention.
The connected lead frame shown in is composed of a pair of lead frames 3, 3 having a plurality of lead terminals 2, and a plurality of connecting plates 4, 4 that connect the pair of lead frames 3, 3.

A plurality of lead terminals 2 are attached to the lead frame 3 at regular intervals in a comb-like shape,
The spacing between the lead terminals 2 corresponds to the spacing between the metallized metal layers 9 formed on the side surface of the package member 8.

Further, one main surface of each lead terminal 2, that is, the side that comes into contact with the package member 8, is covered with a brazing material such as silver solder, and the lead terminal 2 is bonded to the metallized metal layer of the package member 8. After positioning it so that it is in pressure contact with 9, it is passed through a furnace at about 800℃,
When silver solder or the like is heated and melted, each lead terminal 2 is brazed to the metallized metal layer 9 of the package member 8.

The lead frame 3 and lead terminals 2 are made of metal such as Kovar (Fe-Ni-Co) or 42Alloy, and are formed by punching a plate-shaped metal body using a conventionally known punching method.

The pair of lead frames 3, 3 having the plurality of lead terminals 2 are connected by a plurality of U-shaped connecting plates 4, each of which has a package member 8 on both sides of its top. Claw portions 6 are formed for abutting and positioning the shelf portion 5 and the package member on which the package is placed.

The connecting plates 4 are attached to the lead frames 3, 3 at intervals corresponding to the external dimensions of the package member 8, and the package members are attached to the opposing shelves 5, 5 of the adjacent connecting plates 4, 4. By placing both ends of the package member 8, the package member 8 is supported on the connecting plates 4, 4 such that the side metallized metal layer 9 of the package member 8 is in pressure contact with the tip of each lead terminal 2. At the same time, adjacent connecting plates 4, 4
The package member 8 supported on the connecting plates 4, 4 by the opposing claws 6, 6 is positioned in contact with the package member 8, and the movement of the package member 8 is prevented, so that the package member 8 is Positioning becomes reliable.

In this way, the package member 8 is placed on the shelves 5, 5 of the adjacent connecting plates 4, 4 with the connecting plates 4, 4 (and the claws 6, 6) spread apart, and the claws 6, 6 are brought into contact with each other. By positioning the metallized metal layer 9 (for example, a high melting point metal layer such as Mo, W, Mn, etc.) that is deposited on both sides of the package member 8, a brazing material such as silver solder is clad (deposited). ) and position the lead terminal 2 for pressure welding.
The lead terminal 2 is connected to the metallized metal layer 9 on a predetermined side surface of the package member 8 by passing it through a brazing furnace at 800° C. and heating and melting the brazing material.

In the connected lead frame for semiconductor packages of the present invention, it is important to form slits between the claws 6 formed on both sides of the connecting plate 4. For this purpose, as shown in FIG. 1, a slit 7 is formed between the claw portions 6, 6 of the connecting plate 4. By forming the slits 7 between the claws 6, 6 of the connecting plates 4 in this way, when the package member 8 is placed on the shelves 5, 5 of the adjacent connecting plates 4, 4, the connecting plates 4,
Even if the connecting plate 4 (and the claws 6, 6) are pushed apart with excessive force, part of that force will be absorbed by the slit 7, and the connecting plate 4 (and the claws 6) will not be deformed. , the package member 8 is positioned in abutment by the claws 6, 6, and the position of the package member 8 is extremely accurate.

[Effect of idea]

As mentioned above, in the present invention, a slit is provided between the claws of the connecting plate which has shelves and claws on both sides that connect a pair of lead frames each having a plurality of lead terminals. Even if an excessive force is applied to the connecting plate and the claw part when pushing the connecting plate (and the claw part) apart and placing the package member on the part, part of that force will be absorbed by the slit. The connecting plate and claws do not deform,
With the package member tightly positioned, the lead terminal can be brazed to a predetermined side metallization layer of the package member with great precision.
In addition, since the present invention does not require the use of graphite jigs at all when positioning the package members and lead terminals, the semiconductor package as a product can be made extremely inexpensive. , when plating the surface of the metallized metal layer of lead terminals or package cage members,
It is also possible to completely eliminate the occurrence of poor adhesion or pinholes in the plated metal layer.

[Brief explanation of drawings]

Fig. 1 is a perspective view showing one embodiment of the present invention;
The figure is a sectional view of a conventional IC package, and FIG. 3 is a perspective view of the conventional example. DESCRIPTION OF SYMBOLS 1...Connection type lead frame, 2...Lead terminal, 3...Lead frame, 4...Connection plate, 5...
... Shelf portion, 6 ... Claw portion, 7 ... Slit, 8 ... Package member, 9 ... Metallized metal layer.

Claims (1)

[Scope of utility model registration request] In a connected lead frame for a semiconductor package, which is formed by connecting a pair of lead frames each having a plurality of lead terminals with a connecting plate, the connecting plate has a shelf section on which a package member is placed, and a lead terminal of the package member. What is claimed is: 1. A connected lead frame for a semiconductor package, characterized in that the lead frame has claws on both sides of the lead frame that press against the two sides to which the lead frame is not soldered, and a slit that facilitates expansion.